On September 23, "2014 International RF-SOI Seminar" jointly hosted by the SOI Industry Alliance, China Academy of Sciences, China Academy of Sciences, Shanghai Micro Technology Research Institute, and Core Main Co., Ltd. "successfully held in Shanghai. This seminar is the first time in the industry to hold a radiofrequency SOI topic, gathered the core participants in the current RF industry to discuss the opportunities and challenges of radio applications in exchanges.
RF SOI Seminar Site
The seminar first delivered a speech by the academician of Wang Wei, director of the Shanghai Microsystems of the Chinese Academy of Sciences, mentioned the huge future of China's market in RF applications, and the research results of the SOI field in the Chinese Academy of Sciences and the latest developments of the new proud company and SOITEC technology. CEO of the US Commercial Strategy, Handel Jones analyzes mobile consumption applications such as smartphones and tablets with detailed data. The huge market demand and SOI technology are facing opportunities in this field.
Academician Wang Wei, director of the Shanghai Microsystems of the Chinese Academy of Sciences
This seminar gathered IBM, ST, Global Foundries, and several important RF Soi platform craft manufacturers in SMIC. Mark Ireland, vice president of IBM Microelectronics Department Strategy and Business Development, mentioned IBM to provide RF SOI manufacturing processes from 2006, explaining the key role of RF SOI redefines mobile applications in front of the front-end; Laura Formenti, SSS, SSR Architecture and RF SOI The advantages of RFSoi in promoting RF front end integration were analyzed and introduced the St HCMOS9SOI technology platform. The Welcome Factory SME International Senior R & D Director Yellow River detailed the SOI NFET in the RF switch, SOI in enhancing RF power amplifier PhemT performance, CMOS MEMS RF filter potential for SOI CMOS integration, SOI integrated solution will promote SW / PA / ET and SW / AT to SOC and other content, and mentioned that the wafer substance is not only provided by the device-level process, but also supports high-performance wafer level SIP packages.
Jean Pierre Raskin and SOI Wafer Supplier SOITEC Company Product Development Director of SoITESTELLE LAGAHE analyzes the effect of Soil on RF signal integrity and a key role in radio frequency performance. Focus on RF and Wireless Semiconductor Solutions Company Skyworks, Vice President of Fes Si Platform Engineering, Engineering, James, James, shared mobile phone PA design, ET (Enveloppe Tracking) and APT (Average Power Tracking) Performance Comparative Analysis and SOI / CMOS Comparison and analysis of performance of GaAs device. Dr. Lu Wei, Vice President, Shanghai Micro Technology Research Institute, detailed 4G wireless communications, which brought new challenges for RF front-end modules and components. RF SOI technology has become mainstream technology of current antenna / switch-based RF application, and in adjustable Components (including adjustable antennas, adjustable PA, adjustable filter / duplexer, etc.) have development potential.
The last round table discussion, all the guests launched a warm discussion on the "China RF Market", including the characteristics of the China RF market and the main driving force, China Wafer Operation, RF SOI Supply Chain, RF Fem System Package and System Integration Trend, LTE and WiFi GM RFSoi platform driving force, Substrate-Device-Designing Common Cooperative Ecosystem Establishment and other industrial applications to share and collide.
Round table discussion
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