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    2019 Intel chipset road map has no change, DDR5, PCIe 4.0, etc.

     

    "Intel launched 300 series chipsets this year. Z390 officially replaced z370 as a new flagship platform. B360 and h310 also perform their respective functions in the mainstream and entry-level motherboard market. The only bad thing is that h310 has been reduced from the original 14nm process to 22nm public key and turned into h310c chipset due to the lack of 14nm production capacity. 300 series chipsets will last at least one year with the current eighth and ninth generation core processors. What will be the processor and chipset platform next year? At present, the biggest change in 2019 is that there is no change. There is nothing to upgrade in terms of chipsets. Ddr5 memory and PCIe 4.0 are still a little far away. It will not be supported until 2020 at least. Due to the delay of the 10nm process, the lga1151 generation is also a rare longevity platform for Intel in recent years. Of course, the chipset is still upgrading. The main force this year and next year is still the 300 series chipset. It is reasonable to say that the next generation of 400 series chipsets should be pushed in, but from the information learned from the supply chain, there is no change in Intel's chipset roadmap in 2019, and 300 series will be the main force next year. There is no new generation chipset next year. In the final analysis, it is the continuation of Intel processor roadmap. Although Intel has stated that the ninth generation core will be the last 14nm process processor, the next generation 10nm process core processor is still a little far away. According to the information previously released by Intel, the 10nm process will not be available until the Christmas holiday at the end of next year, and the mobile version will be the first. The 10nmicelake processor for the desktop and server market will not be mass produced until 2020, that is, the current 300 series chipset will not be replaced until 2020. After adding the native usb3.1gen2 support and upgrading 14nm process, the specifications of the current 300 series chipset seem to have nothing to change. The next generation of technical standards mainly include ddr5 and pcie4.0. However, although they have completed the standard formulation for a long time, they are first for high-performance computing platforms. The demand for consumer grade is not so large, and the initial cost is also very high, It is recognized that these two technologies will not enter the consumer market until about 2020. Amd previously promised that the AM4 platform will support at least 2020. From the trends of these two companies, there will be a large-scale technology upgrade in 2020. At that time, let's talk about supporting ddr5 memory and pcie4.0 bus. Source: super energy network, technology zone US court ruling: Qualcomm must license patented technology to Intel A12xbionic performance exceeds 92% notebook processor or breaks up with Intel Amd10 significantly leads Intel in sales volume in October Intel announced the launch of Xeon E-2100 processor, with a suggested retail price of about 3112 yuan Cambrian 1H enabled Huawei Kirin 980 AI computing performance rose sharply, Download enthusiast app Create an electronic circle of your contacts Pay attention to wechat of electronic enthusiasts Interesting and informative information and technology dry goods Focus on enthusiast class Lock in the live broadcast of the latest course activities and technologies and collect them 0 collections Share:, comment Lin Chaowen PCB Design: pads tutorial, pads video tutorial, Zheng Zhenyu teacher: Altium designer tutorial, Altium designer video tutorial, Zhang Fei actual combat electronic video tutorial, Zhu Youpeng teacher: Hisilicon hi3518e tutorial, hi3518e video tutorial, Li Zeng teacher: signal integrity tutorial, high-speed circuit simulation tutorial, Huawei Hongmeng system tutorial, harmonyos video tutorial, saisheng: EMC design tutorial, EMC video tutorial Mr. Du Yang: STM32 tutorial, STM32 video tutorial, Tang zuolin: basic C language tutorial, basic C language video tutorial, Zhang Fei: Buck Power tutorial, buck power video tutorial, punctual atom: FPGA tutorial, FPGA video tutorial, Mr. Wei Dongshan: embedded tutorial, Embedded video tutorial Zhang Xianfeng: C language basic video tutorial Xu Xiaogang: Modbus communication video tutorial Wang Zhentao: NB IOT development video tutorial mill: FPGA tutorial, zynq video tutorial c language video tutorial linux driver development video tutorial Zhu Youpeng: u-boot source code analysis video tutorial harmonyos,  Press and hold the slider and drag to the far right Learn about new features Published, relevant recommendations US court ruling: Qualcomm must license patented technology to Intel On the morning of November 7, according to Reuters, a U.S. federal judge ruled on Tuesday that chip seller Qualcomm (qcom. O) must put its Ministry Published at 09:22, November 7, 2018 • 0 readings Qualcomm Technology Licensing chip competitor Qualcomm chip dominance shaken Qualcomm rejected the Federal Trade Commission's trial. After the dispute between Qualcomm and the Federal Trade Commission, Koh rejected the proposal and released her decision on Tuesday Published at 09:08, November 7, 2018 • 23 readings Decrypt the accelerometer behind the wearable explosion detection system equipped by the US bomb disposal force Published on 09:01, November 7, 2018 • 3 readings Intel launches industry wide desktop and mobile computing platforms The first China International Import Expo (hereinafter referred to as "China Import Expo") opened grandly today. International leading brands have shown the world's most advanced scientific and technological products for exhibition Published at 08:53, November 7, 2018 • 33 readings The mid-range mobile phones released by Motorola are on sale in the United States Just today, Motorola announced that the Motorola one, which is part of Google's Android one plan, will be launched in the U.S. city Published at 08:45, November 7, 2018 • 20 readings Samsung double screen seamless hinge design foldable mobile phone mass production this month Recently, according to the South Korean media the bell, Samsung has finalized the final design of the foldable mobile phone, that is, using a dual screen setting, that is Published at 08:39, November 7, 2018 • 23 readings There will be a situation of three countries killing in the chip market. Who will win On the evening of October 26, Qualcomm submitted a document to the California High Court in San Diego, accusing apple of stealing its original computer Published at 17:01, November 6, 2018 • 217 readings Low cost discrete power solution for automotive i.mx6 quad core processor Published at 16:55, November 6, 2018 • 53 readings Manchester university opens a new SpiNNaker super project. Recently, the University of Manchester announced that it has opened a new SpiNNaker supercomputer, which is inspired by the human brain. Published at 15:45, November 6, 2018 • 98 readings Does Intel SSD p4500 support VSS variable sector size

     

     

     

     

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