5G communication commercial is getting closer and closer to us, unveiling the first surface of the 5G mobile phone, is a clear modular radio frequency front chip.
It is true that due to the demand for 5G new frequency band, the RF front end needs to increase more frequency bands; 4 * 4MIMO (multiple input and output), so that the demand of the receiving link RF chip is doubled; the use of large-scale carrier polymerization Then, the demand for transmitting the radio frequency chip is increased. Under the premise of the mobile phone motherboard, the use of high integration radio front end module chips may be the main way to meet 4G + and 5G communication.
In fact, the high-performance flagship model represented by iPhone has used RF front-end module chip, because in addition to saving the floor area, such high integrated radio frequency front end module chips can also bring lower loss, simplify design Improve the performance of the whole machine. In the 5G era, the integrated RF front-end solution has become an important choice for manufacturers. It is difficult to meet the needs of mobile terminals similar to 2G / 3G score RF power amplifiers, filters, radio frequency switches, and low noise amplifiers.
In May 2019, based on its EWLAPTM technology, it was also a Semiconductor (Suzhou) Co., Ltd. (hereinafter referred to as it is insufficient) officially released the filter module chip product TR963 and TR965. The TR963 / 965 chip integrates 8 frequency bands (BAND-1/3/5/34/39/40/41) in 3mmx3.2mm package area, and the SP10T radio frequency switch, and adopted MIPI standard interface control, TR965 adds support for carrier aggregation on the basis of TR963. The filter in Tr963 / 965 is manufactured using a sound surface wave (SAW) process, and uses a compute second-generation wafer level package technology EWLAP-2TM to realize wafer level packages; SP10T RF switch is manufactured using SOI process, and The wafer stage filter is buckled to be integrated into the multi-layer package substrate, and all RF ports have matched to 50 ohm impedance, achieving a high integration of the diversity receiving RF front end function. TR963 / 965 is the first similar product launched in the domestic RF front-end integrated circuit industry, which can be widely used in 4G / 5G mobile terminals, which will help customers save packages, reduce costs, and improve performance.
TR963 product performance
It is advisable to adhere to the ultimate user needs, improve product definition, integrate mature filter resources at home and abroad, and achieve high-density integration of multi-band filters and radio frequency switches with EWLAPTM technology. Such composite function filter products can not only meet the needs of current communication, but also meet the needs of filter products in automotive electronics, industrial control, pipeline transportation, energy and other industries.
TR963 / 965 has all independent intellectual property rights, making breakthroughs in multiple fields under partnership. Infilter design and wafer manufacturing links, it is advisable to use a model that is developed with strategic partners. In the filter design, it is compabled that SAW / TC-SAW / FBAR Filter resonator design, parameter extraction, model establishment and fitting, physical field + schematic + electromagnetic field collaborative simulation, version of automatic layout and design rule check, etc. Ability and achieve complete design and verification tool automation.
For the special material properties of lithium niobate and lithium niobate and lithium tamate substrates of SAW / TC-SAW wafer, as well as the unique electrical characteristics of the filter, the overall solution with autonomous intellectual property, CP and FT test overall solutions From the probe, needle card, fixture, to the machine, the test procedure has formed complete, efficient large-scale production capacity, not only guarantees the effective control of the wafer level filter package production, but also directly improves the cost of the product. Competitiveness.
The CSP package is a wide range of manufacturing of domestic filter vendors. After seeing the crystal level package filter module sample of the applicable display, domestic discrete filter shipments have expressed great interest and appreciation, and it is considered to use EWLAPTM packaging patented technology, and A similar band is integrated with this technology effectively solves the next generation of integrated filter product development and manufacturing puzzles. In the wafer stage filter package technology, it is comparable to many domestic advanced packaging partners, which has developed three-generation filter crystal circular packaging technology: EWLAP-1TM, EWLAP-2TM and EWLAP-3TM All have compute independent intellectual property rights and have passed strict performance and reliability verification. Iterative also makes it intravenous, and the filter crystal circular packaging plan continues to evolve, pursues higher performance, lower cost, better. Integration.
Filter crystal circular package flow chart
Wafer stage filter package physical map
TR963 / 965 Integrated Filter Module Chip is an appropriately officially released first filter product, which has been given a number of platform manufacturers, customers, and partners. Subsequent, computes, the coordinated filter resources have been launched in succession 4G DRX products, 4G Pamid products, 5G SUB-6GHz DRX and PAMID products, 5G MMWAVE FEM products, etc.
Throughout the international first-line RF supplier, it is an IDM mode; it is advisable to continue to adhere to the openness, collaboration, win-win mentality, cooperate with domestic and foreign partners downstream of the industry chain, in Shanxi Zhangzhou "China Second Generation Semiconductor All chain technological innovations in the base, insist on "materials → devices and technology → product architecture → circuit design → package integration", continue to promote the full-capacity construction of RF front end, and strive to establish intact within 3-5 years The RF industry has an excellent product and service for our customers.
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