The MUSCA-S1 test chip is based on Samsung Foundry28 nano-SOI process technology, providing a new choice for the on-site system design of the Internet of Things solution.
News Summary:
ARM uses Samsung Foundry process technology to introduce test chips that support embedded random access memory (EMRAM), which can run in Mbed OS and ARM Pelion Internet of Things platform
MUSCA-S1 Test chip integrated FD-SOI substrate bias and EMRAM technology, can be used on SOC design on high-energy accessory equipment
Test chips and development boards are expected to provide an assessment of Internet access equipment designers in the fourth quarter of 2019.
Beijing - June 5, 2019 - ARM with Samsung Foundry, Cadence and Sondrel, in the United States, and Samsung Foundry, Cadence and Sondrel, showing the top 28-nanometer FD-SOI Emram IoT test chip and development board. MUSCA-S1 is designed to provide more choices for Internet of Things designers in on-chip system development. Designers can now easily implement safer, more comprehensive Internet of Things solutions, so that they can be more focused on the differentiation of core products and speed up time.
Gus Yeung, Vice President, General Manager and ARM of the Physical Design Department of ARM, said: "A commitment to constructing the world from trillion interconnection is not far, but we want to make the Internet of networking equipment, we must continue to put a series of technical options Provide designers to test and evaluate. This cooperation has a true end-to-end solution that ensures that the Internet of Things designs can be designated from equipment to data security. "
Compared with the previous ARM's MUSCA solution, the MUSCA-S1 test chipboard now supports testing and evaluating new EMRAM technology, achieving reliable, low-power, and secure equipment development through secure memory. EMRAM technology is superior to traditional embedded flash memory (EFLASH) storage technologies, as it can easily extend the process technology below 40 nanometers, making the on-chip system (SOC) designer can be more flexible in demand and power consumption according to various use cases Expand its memory demand.
MUSCA-S1 test chip integrates on-chip power control, REVERSE BIDY BISING, and EMRAM break-off non-volatile memory, supports testing and evaluation of new energy-efficient networked devices. On Samsung Foundry wafers, designers will have the first time to run ARM® MbedTM OS, and use ARM PelionTM Internet of Things platform to test device and data management functions.
By integrating ARM IP and Software Solutions on a development board, the Internet of Things designers can test and evaluate ARM's end-to-end security Internet of Things solutions, large-scale display of high-energy and secure Internet of Things. In addition, the MUSCA-S1 test chipboard allows designers to re-adjust the reference design for future products, thereby further reducing cost and listing time.
MUSCA-S1 test chip and development board
PSA Certified Level 1 certification has been obtained, which brings together key components of ARM Internet Security product portfolios, including ARM Cryptocell-300 Series, ARM CoreSightTM, ARM TRUSTZONE®, and Trusted Firmware-M (TF-M).
Based on the ARM Cortex®-M33 kernel, the ARM CORSTONETM-200 security base IP and hardware builds authenticated via ARM Keil® MDK and ULINK-PLUSTM Probe.
Use Sondrel's design services to speed up the development of designers.
Use Cadence's digital implementation, sign, verify processes, and standard IP, reduce design risk.
Supply time and more information
Musca-S1 test chips and development boards will be exhibited in China Samsung Operation Forum. MUSCA-S1 will be limited in the third quarter of 2019 and planned to open rent to customers in the fourth quarter of 2019. For more information on the MUSCA-S1 test chip and development board, please contact ARM.
Partner quoted
Jaehong Park, Executive Vice President, Samsung Electronic Design Platform
"The cooperation with our SAFE solutions ARM, Cadence and Sondrel works for the first time to achieve ARM MUSCA test chip and development board in Samsung Foundry silicon. Musca-S1 and actual 28FD-SOI silicon wafers, It is guaranteed that the Internet of Things designers can achieve faster development, deploy substrate bias and integrate EMRAM technology in the next-generation networking equipment to increase energy efficiency and Internet access security. "
Kt Moore, Vice President of Product Management, Digital and Signing Division
"MUSCA-S1 is the industry's first 28-nanometer FD-SOI EMRAM and CACENCE-based IT-based IT-based IT-based IT-based IT-based IT-based IT-based IT-based, using Cadence numbers and signed full process solutions to support the reverse from the synthesis to checkup. Offset, including physical verification and DFM signs. In addition, MUSCA-S1 uses the Cadence verification kit for verification, and protocol compliance uses the Cadence VIP and memory models. By cooperation with ARM, Samsung and Sondrel, we Enable common customers to create a high-energy MRAM Internet of Things edge devices with built-in security and connection capabilities, and further speed up innovation in emerging applications.
Sondrel CEO Graham Curren
"MUSCA-S1 is more than just a security of networked devices and a large-scale management design solution, but also a simple and secure market for cooperation between semiconductor industry leaders. It is the easiest way to The most intelligent edge node device brings together the best combination of tools, technology, processes, and personnel to define new standards for powerful Internet of Things equipment. "
About ARM
As the core of the operation and the network, ARM technology is changing the way people live and enterprises. ARM advanced low-power processor design has been applied to smart computments of more than 1,45 billion chips, and its technology has safely drives electronic products that include sensor to smart phones so as to exceed all models. ARM integrates its Internet of Things devices, connects to the data management platform to assist customers with powerful and executable inspections, create new business value for networking devices. ARM joins more than 1,000 technical partners, the design, safety, management, and application of front-end to all the needs of all required operations from the chip to the cloud.
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