"On April 22, 2019, ansemi and global foundries jointly announced that they had reached a final acquisition agreement on ansemi's acquisition of the 300 mm wafer plant (FAB 10 in the grid semiconductor plant) of grid semiconductor in East Fishkill, New York.
According to the agreement, the total price of the acquisition is US $430 million, of which US $100 million has been paid when the final agreement is signed, and US $330 million will be paid by the end of 2022. In 2023, ansenmey semiconductor will obtain full operation control of the plant.
300mm wafer factory realizes its dream and strengthens its market competitiveness
The main highlights of this transaction are:
1. The technical team has rich experience in manufacturing and development
2. After years of cooperation, to ensure the production capacity of 300mm
3. With advanced CMOS functions, improve the production quality of MOSFET and IGBT
At the same time, the agreement also stipulates that lattice core semiconductor will manufacture 300 mm wafer products for ansenmey from next year. Ansenmey semiconductor will arrange 300 mm production in East Fishkill factory in the next three years (2020-2022), and allow lattice core semiconductor to transfer many of its technologies to another 300 mm factory of the company.
In fact, the agreement also includes technology transfer, development agreement and technology licensing agreement. Through the technology transfer agreement, ansenmey semiconductor will obtain advanced 45nm and 65nm CMOS process technology, and can obtain all skilled employees of the base. This will allow ansenmey semiconductor to quickly convert from 200mm wafer to 300mm wafer.
Keith Jackson, President and CEO of ansenmey semiconductor, said that we are very pleased to welcome the Fab10 team of grid semiconductor East fishkil to join the ansenmey semiconductor family. The acquisition of 300 mm wafer manufacturing plant is another major measure for us to achieve a leading position in the field of power supply and analog semiconductors. This acquisition adds additional capacity in the next few years to support the growth of our power and analog products, achieve incremental manufacturing efficiency and strengthen the market competitiveness of ansenmey semiconductor products.
As we all know, the 300 mm wafer factory in East Fishkill, New York was originally owned by "blue giant" IBM. In July 2015, lattice core semiconductor completed the acquisition of the global commercial semiconductor technology business of "blue giant" IBM. The 300mm wafer factory was first operated in 2003 and has passed the certification of the U.S. Department of Defense (DoD). It has become a class 1A "trusted foundry" service provider.
Previously, the manufacturing of two 8-inch wafers of ansenmey semiconductor in Idaho and Oregon passed the certification of the U.S. Department of Defense (DoD) and became a class 1A "trusted OEM" service provider. So far, ansenmey semiconductor will become the only 8-inch and 12 inch class 1A "trusted OEM" service provider in the United States.
The acquisition of a 300 mm wafer manufacturing plant by ansenmey semiconductor was unexpected, but it was reasonable.
Ansenmey semiconductor's product series includes power and signal management, sensors, simulation, logic, timing, discrete devices, optoelectronic devices and ASSP. Its main competitors include Texas Instruments (TI), Maxim, STM, Infineon, etc.
Texas Instruments began to operate the world's first 300 mm analog wafer plant as early as 2009 and the second 300 mm analog wafer plant in 2015. Texas Instruments is the overlord of global analog IC.
Infineon acquired the 300 mm storage wafer manufacturing plant of qimengda in 2011 and transformed it into the industry's first mass production plant of power semiconductors in 2013; Originally used to produce power semiconductors for household electronic devices, it is now manufacturing power semiconductors for automotive electronic applications. Infineon is the overlord of IGBT in the world.
STMicroelectronics also produced simulators at its internal 300 mm wafer plant in 2015.
Although Meixin does not have a 300 mm wafer manufacturing plant, it cooperated with Powerchip in 2011 to carry out analog product OEM at the 300 mm wafer plant of Powerchip.
At this time, ansenmey semiconductor took the initiative to acquire 300 mm wafer manufacturing plants, and also faced the pressure of many wafer manufacturing plants in mainland China.
At present, 300 mm analog and power device Fabs under construction or announced to be built in mainland China include Huahong semiconductor Wuxi, Guangzhou Yuexin semiconductor, Shilan micro Xiamen, silijie Qingdao, China Resources Microelectronics Chongqing, Wandai semiconductor Chongqing, etc. once the production capacity of these 300 mm Fabs is opened, it is bound to have a great impact on the global analog and power device market.
At this time, the acquisition of the 300 mm wafer manufacturing plant of lattice core semiconductor did not cost much, only US $430 million. It not only obtained plant facilities and production equipment, but also technology transfer. What is more gratifying is to obtain a large number of mature employees. At the same time, it can prevent the equipment from flowing into competitors or mainland China.
Ansenmey's acquisition path
On August 4, 1999, Motorola semiconductor components group (SCG) split and established ansenmey semiconductor, specializing in the production of analog circuits, logic circuits, discrete small signal and power devices.
At the beginning, ansenmey semiconductor had only a large number of 4-inch small factories and only two 6-inch factories when Motorola was split. After a series of mergers and acquisitions, ansenmey semiconductor built 14 wafer manufacturing plants in North America, Europe and Asia, including 7 8-inch, 6 6-inch and 1 5-inch.
In April 2000, cherry semiconductor company was acquired to obtain product lines such as polyphase controller, driver, automotive / industrial power management and automotive ASSP.
In 2006, it acquired an 8-inch manufacturing plant of LSI Logic, which is the company's first 8-inch wafer manufacturing plant to help the company improve its process technology.
On December 31, 2007, it acquired the voltage stabilization and thermal management department of Adeno semiconductor and obtained product lines such as multiphase controller, driver and thermal management devices.
On March 17, 2008, the company acquired AMI semiconductor and acquired high-voltage ASIC, ultra-low power consumption (ULP) SRAM memory, Lin and can transceiver, low-power RF transceiver, stepping motor driver, audio DSP system, power over Ethernet (POE), industrial process automation and other product lines for automotive applications, so as to enhance the strength of the company's clock, timer and high-end driver; And get a 4-inch and a 6-inch wafer factory.
In 2008, he acquired catalyst semiconductor and acquired digital potentiometer, I / O expander, EEPROM, NVRAM and other product lines.
In 2009, pulsecore semiconductor was acquired to obtain the spread spectrum clock product line and enhance EMI Filter and circuit protection portfolio
In 2010, it acquired California micro devices (CMD) to enhance the company's strength in electrostatic discharge (ESD) protection, electromagnetic interference (EMI) filter, interface and power management.
In July 2010, sound design technologies, Ltd. was acquired and incorporated into the medical department to enhance the strength of ultra-low power consumption (ULP) digital signal processor (DSP) and high-density interconnection technology, and obtained a 6-inch wafer manufacturing plant to expand production capacity.
In 2011, he acquired the image sensor business unit (ISBU) of cypress and obtained the 2D high-performance CMOS image sensor product line.
In 2011, it acquired Sanyo semiconductor and acquired microcontroller, motor driver, audio / video, power module and other product lines; Enhance the competitive strength of power management, application specific integrated circuit (ASIC), memory, MOSFET and IGBT; Obtain several wafer factories in Gifu, Gunma and Niigata.
In 2014, truesense imaging Inc., a CCD image sensor manufacturer, was acquired to enter the CCD field; And get a 6-inch wafer factory.
Acquisition of CMOS image sensor supplier aptina imaging in 2014 Corp., strengthening CIS products.
In 2015, axsem AG, a Swiss supplier of analog and mixed signal products, was acquired to obtain the RF transceiver product line.
In 2016, Xiantong semiconductor acquired one 6-inch and two 8-inch wafer factories.
In 2018, sensl was acquired to help the company expand its supply capacity of imaging, radar and lidar products, so as to expand its market share of automotive sensing applications such as ADAS (advanced driving assistance system) and automatic driving.
In 2018, it purchased 20% of the shares of two 8-inch wafer plants of Fujitsu. At present, ansenmey semiconductor holds 60% of the shares of the two wafer plants.
(source: WeChat official account "core idea")
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