As the first 5G mobile phone, the first five-year-old mobile phone, the Zhongxing Tesco Axon 10 Pro is naturally a product that is expected. Does the small E pushed on Monday make the small partners have been addicted? Xiao E hot iron, sent the dismantling of this phone in the first time. I also expect 5G mobile phones to take a look at the little e.
Configuration list:
Not much to say, we are still from the configuration, first understand this phone.
SOC: Qualcomm Snapdragon 855 processor, 7nm process
Screen: 6.47 inches 丨 AMOLED full screen 丨 resolution 2340x1080 丨 screen occupied 87.1%
Store: 6GB RAM + 128GB ROM, up to 2TB of storage card expansion
Front: Front 20 million pixel camera
Rear: Rear 48 million pixel main camera +8 million pixel telephoto camera + 200 million pixel wide angle camera
Battery: 3900mAH lithium polymer battery (actual rated capacity)
Features: 5G Network | 5G Network | 5G Network (important things say three times)
Decomposition step:
Take the plastic calorine and did not find the waterproof rubber ring. The rear cover is fixed by a glue, and the heat gun is heated and the heat gun is heated, the heating temperature is about 190 ° C, and the rear cover is slowly opened. The protective effect of large-scale foam is posted on the back cover.
The rear camera protective cover is fixed with a large amount of foam and the back cover, which can be removed directly. There is a large amount of bubbles in the protective cover for shockproof.
The NFC coil is fixed to the main plate through the glue, and there is a large-area copper foil to extend to the battery position for heat dissipation. The wireless charging coil is wrapped with a heat radiating graphite, and is fixed to the battery through double-sided adhesive. The bottom is fixed with a tape with the speaker.
Separate the NFC coil and the wireless charging coil from the motherboard cover and the speaker module. It can be seen that the wireless charging coil module has double-sided adhesive and battery fixed, but the bottom not only has double-sided adhesive and speaker fixed, but the folding is folded on the speaker.
The main sub-board is fixed by the screw, and the internal support corresponds to the main board memory & processor position, and is contacted with the liquid cold tube, improves heat dissipation efficiency. The rear camera is attached to the hot copper foil for heat dissipation. Sub-board USB interface has a silicone cover for a waterproof and dustproof.
The battery is supported by the fixed, and the battery is not so easy, so it is not recommended to disassemble the small partner. A total of four radiofrequency coaxial lines are commonly connected between the main sub-board, and the inner support side is secured together to ensure the stability of the mobile phone signal.
The button soft plate is fixed to the recess on the other side by the black rubber strip, the fingerprint recognition sensor, the vibrator, and the handset module, etc. are fixed, and it can be taken carefully.
The screen and the inner support are fixed by the glue, and the screen is heated to approximately 80 ° C to separate the screen. In order to ensure heat dissipation, the inner support of the positive surface extends to the battery position.
Module information:
After reading the dismantling, let's take a look at it, this mobile phone module basics.
Compared with the previous 4G mobile phones, ZTE has also improved on the antenna of the mobile phone in addition to the 5G chip module. Do you think just add the same axis? Of course not! In addition to the antennas of the upper and lower ends, multiple antennas have also been added to the main board and the speaker module to ensure 5G Internet speed.
In addition, in order to carry a 5G chip module without increasing the machine volume, the motherboard of the Zhongxing Tesco Axon 10 Pro also uses the architecture design of the motherboard stack, and the small plate with 5G chip is connected to the motherboard. This design is Apple iPhone XS series mobile phone motherboard stacking mode is similar.
The screen uses a 6.47-inch 2340x1080 resolution AMOLED surface, which is produced by domestic manufacturers, and the model is G2647FB101FF.
The rear three-camera module is 8 million pixels, respectively, the model is Omni Vision Ov7SA3A. 48 million pixel main cameras, models of Samsung GM1, 6-piece lens, the aperture is f / 1.7. The rear 20 megapixel wide angle camera, the model is Samsung S5K3T1SP, six slight lenses.
Front 20 megapixel camera, model of Samsung S5k3t1sp, six-piece lens.
A lithium polymer battery having a rated capacity of 3900 mAh, and the model is Li3939T44P8H756547.
Site-like optical fingerprint identification modules like a camera is a fingerprint identification scheme of a collet technology, in fact there is only one chip. The entire module is supported by the foam.
Motherboard IC information:
The motherboard is labeled 1:
Red -qualcomm-qdm4670-front-end module chip
Yellow-Qualcomm-SDR8153-radio frequency transceiver chip
Orange-Qallycomm-SDR8150-radio transceiver chip
Green -qualcomm-QDM4620-Front-end module chip
Cyan-Sandisk-SDINDDH4-128GB flash memory chip
Blue-Samsung-K3uh6H6-6GB memory chip
红-Qualcomm-SM8150-Qualcomm Snapdragon 855 processor chip
Black -qualcomm-QPM4640-low frequency power amplifier chip
Purple-Qualcomm-QPM4630-low frequency power amplifier chip
Gray-Qallycomm-PM8150B-Power Management Chip
The motherboard is labeled 2:
Red-NXP-NFC Control Chip
Yellow-Qualcomm-WCN3998-WiFi / BT chip
Green -Invensense- ICM-20600-six-axis acceleration sensor + gyroscope
Back surface of the motherboard:
Green-Qallycomm-PM8150A-Power Management Chip
Yellow-Qualcomm-WCD9340-audio chip
Red -qualcomm-PM8150-Power Management Chip
Cyan - qualcomm-qpm6582-radio frequency power amplifier chip
Blue-Qalcomm-QPM5650-RF Power amplifier chip
Orange-Qalcomm-QDM4670-Front End Module Chip
红 - QUALCOMM-QDM4670-Front End Module Chip
Purple-Qalcomm-QPM4621-low frequency power amplifier chip
Black -qualcomm-qdm5650-front-end module chip
Motherboard 2 Rear Language:
Red -qualcomm-SDX50M-5G baseband chip
Yellow-Qualcomm-PM8005-Power Management Chip
Green-Ti-TFA9894B-audio amplifier chip
Blue-Ti-TFA9894B-audio amplifier chip
Cyan - Qualcomm-PMX50-Power Management Chip
The logic, Memory, PM, and RF chip information used on the motherboard are shown in the table:
The MEMS chip information used on the motherboard is shown in the table:
The cost of these chips on the motherboard is approximately $ 186.7, and the cost of the whole machine is approximately $ 323.2. It is sufficient to see these chips to occupy more than half of the machine. Of course, these are just the corner of the iceberg. If you want to know more comprehensive chip information, and the price or detailed parameters of each module must be poked into the Ewistech search to learn more, more exciting information.
Summary:
The three-stage design is used in the middle of the AXON 10 PRO, and the whole machine is rigorous. In order to improve heat dissipation efficiency, the main chip position in the machine uses heat dissipation silicone-added liquid cold tubes to heat the heat, and there is a large area of heat-dissipating copper foil located at the battery position. Moreover, due to the addition of 5g, the motherboard is designed with a stacked architecture for mounting a 5G baseband chip, and the small plate is connected to the motherboard through the solder joint. The radio frequency coaxial between the main panel increases to 4 to maintain the stability of the signal. Moreover, in addition to the antennas of the internal support, the motherboard cover and the speaker module also add multiple antennas to ensure 5G Internet speed. It can be said that many subtle changes in 5G in the whole machine.
Source: ewistech
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