Custom camera + cells shrink, iPhone6s secret dismantling

iPhone6S / 6S Plus is officially launched in many countries, including the mainland, and disassemble it here. In terms of design, iPhone6S is not too much change in iPhone6, but joins the 7000 aluminum of rose gold color and higher hardness as the whole machine. Internal aspect, before dismantling, X-ray shooting is performed on the new iPhone6S. Initially, the internal structure is basically the same. Still use two screws as fixed. The iPhone insists on ensuring the overall performance of the whole machine. Internatively, the iPhone6S still uses the L-shaped board design, which can maximize the maximum guarantee signal is not interfered. The soft printed circuit board of the lithium ion polymer battery connection main board is also fixed by the form of a metal gasket. The screen module is connected to the motherboard by a soft printed circuit board, and Apple adds 3D Touch pressure touch sensing screen on the iPhone6S. The top of the screen integrates a receiver speaker and a front 5 megapixel camera. And the light distance sensor is also integrated at the top of the screen module. Fixed by metal gasket. Front 5 million pixel camera close-up. The bottom of the fuselage integrates a new fingerprint identification touch ID home button. The recognition speed is improved. The two generation fingerprint recognizes the HOME button comparison. TAPTIC ENGINE vibration module close-up, this vibration module has been specially designed to achieve the best state of vibration during the time. TAPTIC ENGINE Vibration Module Closeup. The iPhone6s battery still use trace glue, using a 6.55Wh battery capacity, down slightly compared with the previous generation product, because Taptic Engine battery compartment occupied space. Battery closeup. The iPhone6S uses a 12 megapixel camera and also uses a deep-groove isolated solution to improve the quality. The camera is closely written by Sony is customized, except for Apple, it will not be sold to any manufacturer. Motherboard close-up, main chip integration on this L-shaped motherboard. The new A9 dual-core 64-bit processor is close-up, which uses high-pass baseband and AVAGO, SKYWORKS, TRIQUINT RF solution. It is currently supported by the full Netcom mobile phones in the frequency band. The A9 processor is closely written, and a dispensing process is also used. Toshiba storage particles, high-pass power management chips, etc. Speaker closeup. The bottom module is mainly integrated with the lighting interface, and is also an important overflow portion of antenna model. Decomposition of the whole family blessing.

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