Even if the 5G mobile phone of Samsung has been released, the previous A series has turned the camera mobile phone, still makes the small E heart, today take a look at this flip camera mobile phone, what is the difference between the previous lifting camera.
Configuration list
SOC: Qualcomm Snapdragon 730G 64-bit Bad Duclear Processor 丨 8nm Process
Screen: 6.7-inch Super Amoled No Poof Flections Comprehensive Screen 丨 2400x1080 丨 Screens for 93.8%
Storage: 8GB RAM + 128ROM
Camera: 48 million main camera +8 million pixel super wide angle camera + 3D depth of field camera
Battery: 3700mAh lithium-ion polymer battery
Features: 123 degree super wide angle camera 丨 180 degrees before and after flip three camera 丨 no receiving pole design 丨 screen optics fingerprint recognition
Dismantlement step
A80's SIM Carto is located on the left side of the phone. SIM Cardo with gray waterproof rubber is made of plastic plus metal, is a positive anti-dual nano-SIM card design, and Truscell has a positive copy card ID, and memory card expansion is not supported.
The A80's double curved rear cover is adopted with the sixth generation of Corning glass rear cover, and the black adhesive is used in many times. You need to use a hot air gun to separate the screen after melt. After the rear cover is removed, you can see a heat dissipation buffer pad in the middle, and the rear end cover of the host is the NFC coil.
PC material main board protective cover and semi-closed speaker module share 10 cross screws, and the main board cover is also integrated with LDS antenna, and there are graphite heat dissipation materials in addition to NFC coils.
There is an antenna board on the side of the fuselage, secured by 1 screw, and the coaxial connection is used with the motherboard. The motherboard and the sub-board are connected by an FPC soft plate and two RF coaxial lines, and the sub-plate is fixed with a cross screw, and there is a black foam material around the interface. Remove the sub-shell to see the optical fingerprint identifier fixed with two cross screws, the identifier and the screen are not used.
The battery is fixed, two plastic protective sheets on the camera lifting module, is fixed by adhesive, and it is more convenient.
Manually drive the camera lifting module to the phone and take the two plastic guards. The two sides are fixed with 4 screws. After removing the fixed screw, we found that the entire module is connected to the motherboard with the front of the motherboard and cannot be immediately Remove.
After removing the motherboard fixed screw, the motherboard and the camera lifting module are removed throughout the disassembly, and the lifting module is connected to the main board, and there are two metal limiters on both sides of the module. The motherboard is in front of the shield surface with heat dissipation copper foil.
A layer of viscous auxiliary screen on the back side of the screen and the support plate is not strong in viscosity.
AMS670TA01 is a 6.7-inch super amoled no full-hole full screen, which protects glass for the fifth generation of Corning gorilla.
Rotating camera part disassembly
The lift motor is one of the main modules of the rotating camera and is not in the camera module. However, the upper portion is fixed to the upper portion, and the right side is the light and the distance sensor to install the fixed bit, and no reserved earpiece and the handset mounting position are reserved. Therefore, the upper portion of the whole box is integrally formed, smooth and flat. There is a plastic phase sheet on both sides of the midfam. The vibrator also has a circle of fixed foam.
The next is the dismantling of the camera module, which is used in front of a black glue to fix the fixed soft plastic film, and the plastic cover that can be seen from both sides of the module can be seen.
The protective cover is the two BTB interfaces connected to the three camera modules, and there is a top pickup microphone on the right side of the module.
The A80 camera lifting mechanism is a stainless steel metal material. The entire mechanism is fixed between the entire mechanism and the rear shell. The disassembly is relatively simple. The two sides of the top of the mechanism are gears and horizontal axes. Two camera FPC soft plates are wrapped around both sides of the horizontal axis. . A total of 4 Y words fixed screws on both sides of the camera protective housing.
The camera protective housing is the aluminum alloy material, and there is a shock-shock cotton. On the side of the camera base, there is a pink heat dissipation silica pad, and the two bridges are fixed with double-sided adhesive.
The A80's serpentinal module is actually composed of a double-lens module plus a depth of field lens module. Two modules are inlaid in an aluminum housing, and the two modules can be pushed out with their fingers. Can be removed.
The two cameras on the left are 8 megapixels 123-degree wide-angle cameras, using Samsung S5K4hayx CMOS sensor, the other is a 48 million pixel main camera uses Sony IMX586 CMOS sensors, and the module supports PDAF phase focus technology. There is also a 3D depth of field camera module integrated LED flash.
A80 camera working principle: When shooting with a front camera, the lifting motor ups up the camera module, fixed to the guide rail on the side of the body, move the top two-layer gear set, the rear three camera forward Camera cast. If you re-switch to the back camera lens, the rotary camera module will be retracted down, and the three-camera automatic rotation is backward, restored.
Motherboard IC information
The main IC of the motherboard (below):
Yellow: STMicroelectronics-LSM6DSM-Accelerometer and Gyroscope chip
Red: QUALCOMM-SM7150-Gao Tonglong 730G 64-bit Barn Processor Chip
Green: Silicon Mitus-SM3010-USB Type-C Port Protection IC & 2: 1 MUX High Speed Switch Chip
Blue: Samsung- KM8V7001JM-8GB LPDDR4X DRAM + 128GB Flash chip
Cyan: QUALCOMM-SDR660-Transceivers chip
Deep Green: QUALCOMM-WSA8815-audio chip
Purple: Skyworks- Sky77786-11-wireless front chip
Orange: Cirrus Logic-CS48L33-Audio Decoding Chip
Pink: QUALCOMM-SMB1390- fast charge chip
The main IC on the back of the motherboard (below):
Yellow: skyworks-sky13745-21-radio frequency amplifier chip
Green: QUALCOMM-PM7150-Power Management Chip
Orange: NXP-TFA9894B-Audio Amplifier Chip
Deep Green: QUALCOMM-PM7150A-Power Management Chip
Cyan: NXP-PN80T-NFC chip
Blue: QUALCOMM-WCN3998-WiFi, Bluetooth, FM chip
Red: AKM-AK09918C-Electronic compass chip
The logic, Memory, PM, and RF chip information used on the motherboard are shown in the table:
The MEMS chip information used on the motherboard is shown in the table:
Of course, this is just the corner of the iceberg. If you want to know more comprehensive chip information, you must poke into the ewistech search to learn more, more exciting information.
Summarize
Samsung A80 machine is a three-stage layout assembly, and the internal use of a large number of screws fixed components, and there is no location of the handset assembly between the screen and the middle box, only the screen vibration is used. The lifting rotary camera module is connected between the hard bonding plate and the motherboard. When the two-surface rear cover rises at the camera module, there is a certain gap between the upper half of the back cover and the body, the whole machine block and the camera lifting mechanism are manufactured using a full metal material, the weight of the whole machine is heavy, internal use A large number of modular components, facilitating follow-up maintenance costs.
Source: ewistech
Our other product:
