Today will be the dismantling of millet 11, aside, over the past few exceptionally good this millet 11 grab. Millet 11 as a starter Xiaolong 888, though they have a short exclusivity period, but it was overturned chip, but millet 11 has not slipped word of mouth, let millet configuration stacker 11 captured a lot of consumers. Well, today is still the same 11 follow eWisetech dismantling millet, millet review before dismantling 11 full sincerity configuration.
Dismantling equipment for the 8GB + 128GB version of millet 11, the official flagship store purchasing, text content analysis for dismantling dismantling of equipment are based. (Note: only mentioned the cost of material cost estimates, factors affecting the cost of materials component has many, the real cost of the material there will be some differences.)
Dismantle
Cato taken off, it was heated with a heat gun to cover 200 degrees, and the binding sucker can pry skid plate. After the foam cover a large area, and is different from the usual imaging rear cap and not fixed to the rear cover by glue, but the screws by the motherboard. Noting in particular airgel thin BTB cover affixed, can block some of the heat, the heat is not to cover too rapidly spread.
Following the rear lens cap is removed, the top of the antenna module mounting screws, the bottom speaker / antenna module to be removed. Wireless charging coil and the NFC coil is the use of protective effect of glue on top of the antenna module, a large area for heat dissipation on a graphite sheet wireless charging coil, a cover plate corresponding to the sub-interface and the device has a foam position, can play.
Also integrated on top of the antenna module LDS antennas 3, at the back of the corresponding system board module interfaces BTB foam protective position are affixed, the processor and the corresponding position in a conductive material, as well as below the graphite sheet, heat can be effectively.
Then remove the motherboard, the sub plate, the sub plate connected to a main flexible plate, the front and rear of the camera module and RF coaxial. In front of the camera module are affixed with a copper foil heat. 3 the RF card are coaxial inner support recess, such that the overall layout more clearly.
In-board shield a large area of the copper foil attached to the graphite sheet and heat dissipation. Inner shield CPU, power amplifier chip and the chip has affixed thermal grease.
By fixing tape easy to pull the battery, it would also facilitate disassembly, particularly millet cell 11 is equipped with two interfaces BTB, for fast charge.
VC also support the inner liquid cooled copper tube, an earpiece, and the vibrator side key soft board. FPC side keys only by a groove provided on a support fixed to the inner black plastic sheet, the rest is secured by glue. Also in the sense of light and speaker location has a red apron, dust apart, it can also play a protective role. Brass inner support position is a groove shape corresponding to the rear position of the camera module is also hollow design, which makes more light.
Heating the screen and the final separation stage by heating the support, the support including a front back surface affixed large graphite sheet, affixed with a large area of the screen foil, the back surface of the touch control chip is affixed with a graphite sheet. Remove the fingerprint recognition, fingerprint recognition screen millet under 11 using top technology using ultra-thin sinks fingerprint recognition module, which is the flagship of the mainstream programs.
Recalling dismantling, millet, and 11 layout generation on 10 large difference millet, millet left back the motherboard 10, the right side is a battery. Millet 11 return to the common three-stage design of the battery motherboard + + sub-panels, internal layout clear, easy dismantling.
Used a total of 18 machine screws, heat, motherboards, batteries, camera, screen, wireless charging coils have been heat treated. Although millet waterproofing 11 does not support waterproof, but the USB port, and a speaker at the Cato silica gel protection, dust and water can play a role in the current mainstream flagship Samsung, Huawei and Apple support level IP68 waterproof and dustproof. May be out of question of cost or process does not support waterproof, of course, may also be employed on millet 11 Pro version.
E analysis:
The old rules, after dismantling, eWisetech millet 1874 on the same assembly 11 one by one analysis, due to too much data, not here enumerate, interested can go to the library to view detailed search eWisetech whole BOM, the check portion of the IC on the board.
The main IC of the motherboard (below):
1: Qualcomm-SM8350- Qualcomm Xiaolong 888 processor
2: Micron- MT62F1G64D8CH-031 - 8GB LPDDR5 memory chips
3: SK Hynix-HN8T05BZGK-128GB flash memory chip
4: Qualcomm-SDR868- RF transceiver chip
5: Qualcomm-WCN6851-WiFi6 / BT chip
6: two fast charge chip Qualcomm-SMB1396-
7: Nuvolta-NU1619A- wireless power receiver chip
8: QORVO-QM77033D- chip front end module
The main IC on the back of the motherboard (below):
1: Qualcomm-PM8350C- power management chip
2: Qualcomm-WCD9380- audio decoder chip
3: Silicon Mitus-SM3010B- display power management chip
4: QORVO-QM77040- chip front end module
5: Qualcomm-QPM5641- PA
6: AKM- AK09918- electronic compass
7: Microphone
8: Lion-LN8282- wireless charge management chip
After integration of the data, we found the program 11 Millet 55W fast charge by two high-pass SMB1396 fast charge pump chip. 50W wireless charging scheme using a wireless charging Lion Semiconductor power management chip and Shanghai volts of Semiconductor radio chip.
Since millet micro curved screen 11, surface inadvertently avoid this problem, to remove the outer 11 millet optimization software, the board and the sub board is provided SEMTECH grip position sensor, which sensors may monitor two grip position corresponding to the position in real time electromagnetic wave absorption rate, when the phone is different grip state, combined with the latest anti inadvertently algorithm, intelligent anti inadvertently trigger.
Also a two-speaker Harman Kardon is a big selling point 11 of millet, we also found millet stereo speaker 11 is the result of Harman Kardon tuned, internal speakers and vendors or AAC GoerTek company.
11 in the integration of millet machine materials, calculate the material costs about $ 391.73. On this basis, the main chip alone accounts for 49.3%. Of course, this is only the cost of materials, and as a starting Xiaolong 888, presumably the price will be slightly higher. From disassembled perspective disassembled millet 11 can be seen in the layout of the machine clear, without excessive adapter cable. This gives dismantling and maintenance of late have been facilitated.
Millet teardown analysis of currently 11 on this end, but also reiterated that the above data are based equipment dismantling, if you want to understand its internal components, detailed whole BOM in eWisetech can be found. Past millet device can can query.
Millet 10
Millet 9
Millet 8
Reprinted from ewistech.
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