Realme X is the starting model of Realme Return, although it is positioned in the thousand yuan, but also uses an upset camera, 48 million main photos such as the flagship control machine, how is it in the end? Let's go with Xiao E.
Host information
First come and find out more about the basic configuration? Is this configuration really comparable to the flagship machine configuration?
SOC: Qualcomm Snapdragon 710 Eight Nuclear Processor 丨 10nm Process
Screen: 6.53 inch Samsung AMOLED screen 丨 resolution 2340 x 1080 丨 Screen accounts for 83%
Storage: 4GB RAM + 64GB ROM
Front: 16MP
Back: 48MP main photo + 5MP depth
Battery: 3680mAh polymer lithium ion battery
Features: Lighting screen fingerprint identification 丨 VOOC flashing 3.0 丨 pulse lifting camera
This small E has a depth analysis of RealMe X's components, from cost analysis, RealMe X machine costs about $ 157.3, while its main control IC cost is about $ 65.37, accounting for 42% of the machine cost. Speaking IC, we have to take a look at the motherboard IC and module information.
Motherboard IC
The main IC of the motherboard (below):
Red: RF chip
Green: Light / Distance Sensor
Cyan: QUALCOMM-SDR660-RF Simulation Core
Blue: SK HYNIX-H9HQ53ACPMMD-64GB flash + 4GB memory
Purple: QUALCOMM-SDM710-Snapdragon 710 Eight Nuclear Processor
Brown: Ti-TPD1S414-Power Management Chip
Lander: Ti-TPS61256-boost conversion chip
Deep Green: AKM-AK09918-3 axis electronic compass
The main IC on the back of the motherboard (below):
Red: QUALCOMM-WCN3998-WiFi / BT / GPS / FM RF chip
Green: On Semi-NLAS7242-USB chip
Green: TI-TPS65633- Display Power Socket
Blue: NXP-TFA9894B-Audio Zoom Chip
Purple: STMicroelectronics-STM8S003F3-Control chip
Light green: QUALCOMM-PM670-power chip
Brown: Bosch-BMI160-Six axis (gyroscope + acceleration) sensor
Lander: QUALCOMM-PM670A-Power Slip
Turmeric: Qorvo-QM 56022-RF simulation
Darkness: AVAGO-SFI844-RF antenna switch chip
Deep Green: Qorvo-RF5212A-Power amplifying chip
Orange: Knowles - Microphone
The logic, Memory, PM, and RF chip information used on the motherboard are shown in the table:
The MEMS chip information used on the whole machine is shown in the table below:
I feel that I am not unfinished, and ewisech understands more equipment dismantling, modules, components, chip information, and the whole machine BOM is waiting for you to read. RealMe X's main module information is hidden in the dismantling below, waiting for you to reveal!
Dismantle
First use the lock to take the SIM card, you can see that the card slot is plastic, and there is no waterproof ring on the card slot. Then use the hot air gun to heat the edge edge, and use the chip in the suction cup to be opened around it. When the rear cover is opened, you can see a layer of foam glue, the back cover and the middle box are fixed by this cotton gel.
There is a graphite sheet on the back of the middle frame, almost cover the entire back, for mobile phone heat dissipation. There is a plastic cover at the front camera BTB to protect the BTB interface. There is also a warp tag on the box.
In the middle frame and the internal support are fixed by the screws and snaps, the screws can be separated from the inner support with the crowbar. There is a waterproof silicone ring and a dustproof net at the microphone exit.
The front camera module and its lifting modules are in the middle frame, and is fixed by the screws. Under the screw, you can remove the front module, and then remove the widget on the block. The button has a silicone pad and protect the button.
The lifting module uses a pulsed lifting mode, and the lifting of the camera is controlled by its lifting module. The camera module consists of a plastic front cover, a camera, and a metal rear cover, and there is magnet and adhesive rear cover on the front cover. The back cover has a glue fixed camera, the spring is connected to the lifting module, not fixed, so that the camera can rise.
RealMe X uses the previous photo of 16 million pixel heads, and the sensor model used is Sony IMX471.5 slider.
The rear camera, soft plate and sub-plate cover are then taken. The speakers and oscillators are fixed to the sub-plate cover. In addition, there is a silicone pad or a bubble pad on the motherboard and the sub-plate to protect the BTB interface. The speaker has a foam pad and a dustproof net at the out of the mouth.
The configured rear double-in-one, its main 48 million pixel main camera adopts the sensor to think of the Sony IMX586, 6 slight lens.
Remove the battery, sub-board and fingerprint sensor, and the right side of the battery is easy to remove the battery. There is a black tape on the inner support, which is highly viscous, and the battery adhesion is fixed. There is a silicone sleeve in the headphone jack to protect the headset hole.
RealMe X is used as a light-sensing filter module in a light-sensing screen of the Titzk Technology G2.4.
The motherboard and the remaining parts are removed, and copper foil and silicone are used on the motherboard for heat dissipation. There are two receivers that use double-sided adhesive fixed on the inner support.
The final dismantling screen. The temperature was heated to a certain temperature using a heating station to soften its adhesive gel, separated the screen and within the screen. There is a copper foil on the reverse surface of the screen, and there is a graphite film on the front side, which is used for heat dissipation of the phone.
The screen uses Samsung 6.53 "AMOLED screen, resolution 2340 x 1080, Corning gorilla five generation glass.
The RealMe X machine has 31, and the medium frame is fixed by the screws and snaps, and the remaining components are fixed by screws and gums. There are more heat-dissipating materials such as silicone fat, graphite and metal sheet in the mobile phone, mainly used to heat dissipation to mobile phones and motherboards. There are 2 earpsers on the support of the silicone pad or the cotton pad at the BTB interface. This machine is easier to disassemble, there is no difficulty to disassemble, and the parts can be completely removed.
Source: ewistech
Our other product:
