What does spring mean? It means that all things have recovered, meaning the color pink, which means there will be shining new equipment, HTC M9 is the third flagship model of the One series, and this time we need to dismantle, follow us Let's take a detailed understanding of the principles of M9 inside.
Step 1: First, let's take a look at the basic parameter configuration of M9.
• The resolution is 5.5 inch display of 1920 * 1080, and two speakers are equipped with both front.
· 20 million pixel back camera, and support 4K resolution video recording, 4 megapixel Ultrapixel's front camera support 1080P video recording
· The high pass 64-bit octacore 810 processor (4 * 2.0GHz + 4 * 1.5GHz) is used by the CPU (4 * 2.0GHz + 4 * 1.5GHz)
3GB RAM
· 32GB ROM and support Micro SD card expansion
· Communication support 4G-LTE format, Bluetooth 4.1, NFC, HDML3, 802.11AC and infrared equipment
Second: Packaging
· HTC's packaging is very unique, I thought it was Mac Mini.
Because some delays M9 have been going to us for a long time, this machine seems to have some quality defects. When we don't boot, we find a little scratch on the lower left corner of the screen.
And during the boot process we found that the screen will have the quality of the pixel point defect, which makes us impressive discounts.
Step 3: Appearance comparison
Compared with the previous generation of home flagship, we can see that these two models are in the design language. There is a significant change in the two, and the M8 is the back double camera, M9 is a single 20 million camera.
In the fuselage button, M9 is changed to the day style to set the power button to the right side of the fuselage, separated the volume button of the fuselage, so that it is easier to operate when one hand is grasped, and the misconduct is reduced.
Step 4: Disassemble
First we first tapped the top signal by patch, then we can see the top for fixed TORX screws.
The fixing of the screw makes us think of M9 is not strictly sealed. In the next dismantling process, we also found that this is true, just use the screw and the buckle to seal it, but not reinforced by the adhesive, I hope Continue to maintain this trend because M7 is too difficult to disassemble.
Compared to M9, M9 does not need to be heated by the front panel, it can be opened.
After that, it can be opened through the finger, but it finds that the bottom fixation is more strong, but the use of the binder is not found during this process.
After separation of the rear shell, we saw the approximate distribution structure inside M9, and at first glance and M8 very similar.
The motherboard compare M8 is more intuitive after M9, and there is no more masking range.
Step 5: Decomposition of the motherboard
The dismantling of the motherboard is difficult. HTC engineers don't know why, then insist on and like to fix the motherboard in a bonded manner, and the battery under the motherboard is also fixed.
In the process of dismantling we have found a rotating vibration motor, which is soldered on the motherboard.
Step 6: Main components on the motherboard
· Red: Samsung K3RG3G30MM-MGCH 3GB LPDDR4 memory plus Qualcomm 810cpu
· Orange: Samsung KLMBG4GEND-B031 32GB EMMC NAND Flash
· Yellow: High-pass PM8994 PMIC (found on M8 may be iterative PM8941 / PM8841)
· Green: Boyong BCM4356 2 * 2 802.11ac WiFi solution, Bluetooth 4.1 (also available on Nexus 6)
· Sky Blue: High-pass WTR3925 28 NM RF Emitter
· Dark blue: AVAGO ACPM-7800 multimode, multi-band power amplifier module
· Purple: Silicon Image Sil8620 MHL 3.0 Transmitter
Step 7: Decomposition of the battery
The position of the battery is very embarrassing. I want to be in the middle of the motherboard and the front panel. It uses the adhesive to be fixed, very strong, so that we don't like it very much, because it is too difficult to change .
Look at the parameters indicated on the battery. We can not find it. If you want to upgrade from the former 9.88 of the M8, the battery is upgraded to 10.87 watt, and the capacity has a little improved, and the fast charging technology of Qualcomm can be rapidly Electricity supplement, but conventional chargers cannot use this technology, which requires standards, and the charger of Nexus 6 can also be compatible.
Eighth step: The dismantling of the lens module
The lens module passes several screws, and some adhesives are fixed, and it can be dismantled after some simple processing.
HTC has to upgrade the rear camera to 20 million pixels under various pressures, and use sapphire cover, prevent the mirror of the mirror group, and change M8's disease.
Ninth step: speaker dismantling
HTC's Boomsound speaker is a foam package, and the Dolby sound is used, making the speaker's happier,
After that, we pulled out the I / O board, along with the nearby 3.5mm earphone jack, microphone, and Micro-USB.
Step 10: Disclosure of the display
The dismantling of the display needs to be heated, we have made a lot of fine processing, and it can eventually open him.
After that, we found that there were some mysterious "garbled" after the panel, and we learned that this may be a sign of quality assurance.
Step 11: Camera mode of main devices
· Red: NXP 47803 NFC Touch, I saw it in Amazon's fire call
· Orange: high-pass QFE2550 antenna tuner
· Yellow: Integrated MAXQ614 16-bit microcontroller infrared module.
On the display of the display we can see the touch screen controller of the S3351B Synaptics.
Summary:
· HTC M9 can repair score: 2 points (1-10, 10 is the simplest repair)
· The first is that the battery is placed between the front panel and the motherboard makes it very difficult to replace.
· Many components use adhesive connections, making very dangerous and difficult to repair
· The display can only be repaired by the entire mobile phone, so that the screen is replaced very difficult
· Finally, it is worth joining that mobile phone preliminary dismantling does not use adhesives so it is simpler.
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