Disclosure Analysis Iphone 11 Pro Max circuit design is not known

The dismantling of the iPhone 11 Pro Max has been released, and the complete information has also been online in the Ewistech search. The module that promised the small partner before that, as well as the cost of the IC part, of course. Let's see the module information first. Module information The screen uses a Samsung 6.5 inch 2688x1242 resolution OLED full screen, the model is Samsung AMB646SK01. The cost is expected to be $ 79.24. Rear 12 megapixel wide angle camera, six-piece lens, aperture is f / 1.8. The rear 12 megapixel telephoto camera, six-piece lens, the aperture is f / 2.0. The rear 12 megapixel super wide angle camera, five sheet lenses, and the aperture is f / 2.4. The total cost of this three-camera module is expected to be $ 27.80. Front 12 megapixel camera, four-piece lens, aperture is f / 2.2. Front infrared camera, four slight lenses. The total cost of the two cameras is expected to be $ 11.50. L-shaped shaped batteries are selected from the Yuezhou Desai battery, the rated capacity of 3969 mAh cells. The cost is expected to be at $ 7.20. Motherboard IC information Motherboard 1 is reverse: 1-TOSHIBA-64GB flash chip 2-Bosch-six-axis acceleration sensor + gyroscope 3-Universal Scientific Industrial-339S00647-WiFi / BT chip 4-SkyWorks-WCD9341-audio chip 5-Cirrus Logic- Audio Amplifier Chip 6-Intel-PMB6840-Power Management Chip 7-NXP-NFC control chip 8-Intel-baseband processor 9-Intel-PMB5765-radio frequency transceiver chip 10-Skyworks-Sky78223-17-Power amplifier chip Motherboard 2 front 11-Avago-Afem8100-Power amplifying chip 12-Apple-APL1W85-A13 bionic processor + 4GB memory chip 13-Cirrus Logic-338S005089-Audio Codec Chip 14-Apple-U1 chip 15-Apple-APL1092-Power Management Chip 16-STMicroelectronicS-STB601A0-Power Management Chip See the table below using the Logic, Memory, PM, and RF chip information on the motherboard: The MEMS chip information used on the motherboard is shown in the table: Summarize iPhone 11Pro Max still uses a demolition design. "Liu Haiziang", L-type battery, and double-layer motherboard starting from the iPhonex. Also due to the increase in the area of ​​the battery and the rear camera, the area of ​​the vibrator is reduced. Silicone circles and glue waterproof are used at various openings and gaps. The internal modularity of the iPhone phone is also well known, which is also known to look forward to how to arrange new components after the addition of 5G. What will IPHONE arrange new components? Source: ewistech

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