The 5G mobile phone of the main selfie - NOVA 6 dismantles has been delivered, please pay attention to check! It is a bit like the main control IC BOM. Let's play together!
Dismantle
The calorker has a silicone ring, and the hot air gun is heated and the inner support gap is soften, and after soften the glue of the fixed, the rear cover can be opened.
The rear camera cover is also secured to the back cover by the foam gum, and there is a large fixed foam and graphite hot stickers on the back cover.
The motherboard cover and the speaker are fixed by the screws, and the large-area graphite sheets are covered with the main sheet and the battery for heat dissipation and extend to the speaker position.
The vibrator is fixed to the inside of the speaker, and the NFC coil and the flash plate are fixed to the main board through the glue, and the soft plate connects two shrapnel on the motherboard to the shield.
Remove the motherboard, front and rear cameras, panels and other components. On the front camera soft board, the corresponding motherboard processor & memory position is copper foil and graphite sheet, heat dissipation silicone.
Battery, the main secondary board connection soft board is supported by double-sided adhesive fixation, and the battery can be pulled out as prompted.
Remove the button soft plates, handset, sensor soft plates on the inner support. The side fingerprint recognition sensor soft plate increases the metal support for protection.
Finally, the heating station is heated on the screen, and the fixed glue is softened. Separate the screen with the inner support. There is a heat dissipation copper plate and a liquid cooling tube on the inner support for heat dissipation. Of course, there are graphite hot stickers on the screen and inner support.
E analysis
NOVA6 5G is still three-way design, designed and rigorous. Some components have waterproof measures. The heat dissipating copper plate + graphite sheet + heat dissipated silicone fat + liquid cold copper tube is carried out. In addition, the NOVA 6 5G motherboard uses a double-layer stack in the form of a double stack without additional increase in the main board area.
The NOVA 6 5G motherboard's double stacking method is to superimpose an antenna plate over the small board.
Let's take a look at which ICs on the motherboard?
The motherboard front:
1: MURATA - Power amplifier chip
2: hisilicon-hi6405-audio decoding chip
3: Hisilicon-Hi6D05-power amplifier chip
4: SAMSUNG- KLUDG4UHDB-B2D1-128GB memory chip
5: Samsung- K3uh7H70MM-EGCL -8GB memory chip
6: hisilicon-hi3690- Haisi Kirin 990 processor
7: hisilicon-hi6526- fast charge management chip
8: Hisilicon-Hi6603-WiFi / BT chip
9: hisilicon-hi9500-Ba Long 5000 5G baseband chip
10: SK HYNIX-3GB memory chip
Back surface of the motherboard:
1: Hisilicon-Hi6421-CPU power supply chip
2: Hisilicon-Hi6421-baseband supply chip
3: hisilicon-hi6422-power management chip
4: hisilicon-hi6422-power management chip
5: hisilicon-hi6422-power management chip
6: hisilicon-hi6h11-low noise chip
7: hisilicon-hi6h12-radio frequency switch chip
The main IC of the small board (below):
1: hisilicon-hi6562-power management chip
2: hisilicon-hi6d03-power amplifier chip
3: NXP-PN80T-NFC control chip
4: MURATA-Power amplifier chip
5: hisilicon-hi6365-radio frequency transceiver chip
6: hisilicon-hi6h12-radio frequency switch chip
7: hisilicon-hi6h11-low noise chip
8: QUALCOMM- QDM2305-front-end module chip
According to the internal 1848 components, the overall material cost is approximately $ 322.289, and the main control IC part occupies 61.5%.
However, most of the main control ICs use Haisi chip, but Nova 6 5g in radio is not used in Nova 5z. And compare the NOVA 6 5G used by the Haisi chip and the Mate 30 Pro 5g basically.
In 1848 components in NOVA 6 5G, China mainly provides regional ICs, screens, and non-electronic components, although the number of components is not high, but cost proportion is the highest.
Nova 6 5G still has any component analysis results, what do you want to know?
Be
Source ewistech
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