Realme has been adhering to "Dare Level", Realme Q3 is also a thousand-class mobile phones with high-cost price. The 189g body weight and the thickness of 8.8 mm, with the processor of Qualcomm 750g, 8nm process. There is also a 4880mAh (rated capacity) large-capacity battery.
After watching two Samsung's parity mobile phones, today we will take a look at this cost-effective Realme Q3 dismantling.
Dismantlement step
First shut down the calorker, and the calorker can accommodate 2 SIM cards and an SD card.
Q3 uses a plastic back cover, and the adhesion of the glue used in the back cover is not strong. Therefore, after a slight heating through the hot air gun, open with a crowder, and the back cover is using large-scale bubbles at the battery position for buffering.
The rear end cover, the rear camera cover and the speaker module are fixed by screws, and the screws of the camera cover are labeled. The flash soft plate is fixed to the rear end through the rubber.
The rear end cover is a PC material, and Div1, Div2, MIMO, MAIN1 and MAIN2 five FPC antennas are integrated on the rear cover.
The battery is fixed by the easy-pull paper fixing, the power button soft plate and the volume key soft plate part is pressed under the battery.
Motherboard, panel, fingerprint identification soft board and front and rear camera modules can be removed together. Both the motherboard shield are circulated copper foil, and the conductive silicone is coated inside and outside the copper foil.
There are black dust jackets on the headphone holes and USB Type-C interface. The flagship machine, almost not retains the earphone hole, but these thousand yuan, still leave a headphone hole.
Accessories, vibrators, power button soft plates, volume keying panels, main panel connecting soft boards, and speaker adapter plates are supported by glue fixation.
Finally, the screen and the inner support are separated by the heating station, and then remove the liquid-censored tube between the screen and the inner support, there is a large-area graphite sheet for fixing and strengthening heat dissipation.
Motherboard IC information
The main IC of the motherboard (below):
1: QUALCOMM-SM7225-Qualcomm Snapdragon 750G processor
2: SK HYNIX-H9HQ15AECMBDAR-KEM- 6GB memory + 128GB flash memory
3: QUALCOMM-Power Management Chip
4: QUALCOMM-WIFI / BT chip
5: QUALCOMM- - Audio decoding chip
6: Silicon Integrated- Audio Amplifier
7: STMicroelectronics-Gyro + Accelerometer
8: Memsic-electronic compass
The main IC on the back of the motherboard (below):
1: QUALCOMM-Power Management Chip
2: QUALCOMM-RF transceiver chip
3: VANCHIP-Power amplifier
4: QUALCOMM-power amplifier
5: Goertek-Microphone
The power amplifier chip of 3 only-creatored cores in Realme Q3, wherein 2 models are VC7643, and the other is VC7916-65.
An audio amplifier chip is also from domestic manufacturers, Wuhan Finish, Model SIA8109.
Summary information
The whole machine is simple, and 19 screws are used. The heat dissipation is heat dissipated in the entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire day.
Plastic rear end cap integrates the FPC antenna, plus the plastic back cover, and the use of TFT display, the choice of these modules effectively reduces the whole machine cost. The FPC antenna seems to be an effective means of controlling the cost of the whole machine.
From the internal chip scheme, although the use of Qualcomm Snapdron 750G processor, it also uses a single core, the core micro, and the chip of domestic manufacturers such as Electronics, Geor. It can be apparent that the proportion of domestic chip within the 5G mobile phone is gradually rising. (: JUDY)
(The above content is derived from ewistech authorization reproduced)
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