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    E dismantlement: dismantling reno 3, seeing the performance of Liaotai 5G SOC Tianzhu 1000L

     

    On the 5G SOC, Media Tek Tianzhu 1000L must have a name. As of the current OPPO Reno3 5G of the Tianzhu, after disassembling, how many associates used within Reno 3 inside. E analysis: Decomposition Reno3, organized a total of 1435 components, and the estimated price of the overall material is approximately 254.47 US dollars. Among them, the main control IC part occupies 44% of the total cost. The main IC of the motherboard: Be 1: qorvo-qm77040-radio front end module 2: Skyworks-Sky58254-11-5g RF front end module 3: Skyworks-Sky58255-11-5G RF front end module 4: NXP-SN100T-NFC control chip 5: Media TEK-MT6315-Power Management Chip 6: STMicroelectronics-STM8S003F3-Microcontroller 7: SAMSUNG-K3YH7H70AM-AGCL-8G memory chip 8: Media TEK-MT6885Z-5G SOC 9: Samsung-kludG4UHDB-B2D1-128GB Flash 10: Media TEK-MT6635-WiFi / BT / GPS / GLONASS / FM The main IC on the back of the motherboard: Be 1: Media TEK-MT6190W-RF transceiver 2: Media TEK-MT6315-Power Management Chip 3: Media TEK-MT6315-Power Management Chip 4: STMicroelectronics - LSM6DSM - Acceleration + Gyroscope 5: Media Tek - MT6360 - Power Management Chip 6: Media TEK - MT6359V - Power Management Chip 7: Skyworks - Sky78191-11 - Front End Module 8: SkyWorks - SKY53735-11 - RF reception Of course, only some of the main control ICs are used, and many MEMS chips are also used on the whole machine. More detailed IC information and picture recommendation enters Ewistech, search "Reno 3" for query. E dismantles As mentioned earlier, a total of 1435 components, how to place it in a thin body? Unknown. 1. Remove the SIM calork before disassembling the machine, the hot air gun is heated after the cover is four weeks, use the suction cup and crowbar to remove the back cover. The camera protective cover is fixed. There are large-scale bubbles, main-board and speaker modules with an OPPO identifier on a large-scale bubble. There is a graphite sticker under the NFC coil and the speakers for heat dissipation. 2. NFC coil, the speaker module is fixed by double-sided adhesive and screws and the motherboard cover, and is connected to the main, the secondary board. The speaker's shrapnel is connected to the left through the FPC soft board. Be There is black foam on the front camera, and there is a graphite piece under the pamp. Sub-board device for dispensing treatment. 3. The battery is fixed with the inner support by easy-pull glue, and it can be torn off. Be Black double-sided adhesive is used to secure the FPC soft plate and the coaxial position. 4. Tear the four-week black glue, remove the coaxial, two main panels to connect the soft board, and the front and rear cameras. Be The BTB connector on the motherboard and the sub-board is protected by a blue silica gel protective. 5. Motherboard, the sub-board is fixed by screws and card slots, and removes the main board, the sub-plate, and the double-sided adhesive fixed fingerprint identification module. Be The upper left angular ray distance sensor module is connected to the motherboard through the shrapnel. There is a thermally conductive silicone on the outside of the front CPU position of the motherboard. There is an insulating tape on the liquid-cooled hot copper tube. 6. The handset, the light distance sensor module is fixed by double-sided adhesive, and the button is added to the bilateral glue. The vibrator is fixed by the conductive tape. Remove it in turn. Be It can be seen that there is a red silicone protective sleeve on the inner support below the BTB cable. At the same time, the BTB interface also has a blue silicone sleeve. Be 7. Finally disassemble the screen, the screen and the internal support are also fixed by the surrounding strip. After heating, use the rocker tablets. The top of the screen is copper foil and conductive cloth. The whole machine uses 24 screws, two anti-tightening labels, two waterproof labels, three coaxial lines. Wire heat dissipation heat, CPU part is coated with heat-conductive silicone lipids using graphite + heat dissipation copper foil + heat dissipation heat. All BTB interfaces on the motherboard and sub-board are protected using silicone sleeves, and the button is discharged is not recoverable (only violent disassembly). It can be seen that the whole machine does not ignore the detail in the thin body. (Edge: ashely) Also in Ewistech ... Vivo - X30 5G REDMI - Redmi K30 5G Huawei - Mate 20 x 5g Be Article source ewistech

     

     

     

     

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