High-pass Snapdragon 780G processor is equipped. And equipped with a 4150mAh large capacity battery. And Xiaomi 11 Youth Edition also has 6.81mm ultra-thin body. Then how do it do so thin? What surprises will there be inside?
Dismantlement step
Xiaomi 11 Youth Edition mobile phone Carto is located at the bottom of the phone, using a positive and opposite NANO-SIM card design, does not support external memory card expansion. The rear cover uses a flat glass material, and the inner belt rubber material is used as a buffer support. The rear cover is fixed with the foam glue.
The card slot located at the bottom is a stand-alone component, and the motherboard is connected via the FPC soft board. There is a block buffer pad on the front. The motherboard cover is made of a plastic plus metal material, integrated LDS technology antenna, and a graphite heat prevention film in the main board cover has extended to the surface of the battery.
The bottom speaker module is designed with a closed integrated sound cavity, and the module size is less than one-third of the ordinary integrated speaker. Availability Housing The LDS Technical Antenna, the surface of the speaker has a graphite cooling film.
The 4 cameras are independent modules, and the motherboard chip shield surface has a graphite cooling film.
The battery is fixed by a large block of plastic tape, and the model is BP42 and the thickness is only 4mm. The rated power is 4150mAh, provided by Zhuhai Guanyu.
The motherboard and the sub-plate are connected via the FPC soft board, and the antenna panel connected to the RF coaxial line on the bottom side. There is also a transfer soft board between the motherboard and the display, and the soft plate is secured in black double-sided adhesive. The motherboard shield surface has a heat dissipation copper foil.
There is a thermally conductive copper sheet and a heat conductive copper tube assisted whole machine with a heat transfer plate and a heat conductive copper tube assisted entire machine. And contact with the motherboard shield.
Flash soft boards with double-sided adhesive on the back shield surface of the motherboard, and integrated light sensors on the soft board.
The volume bond and the fingerprint recognizer are fixed with a metal positioning sheet, and the soft plate is integrated with the side fingerprint integrated power button function by double-sided adhesive fixing grooves.
In the middle frame and the screen is blended by the foam glue, the screen is separated by heating. The middle frame is attached to a large-area graphite heat preheat film, and the heat dissipation film and the support plate are thermally conductive copper sheets and copper tubes.
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Dismantling analysis
Xiaomi 11 Youth Edition dismantling is general, and the recovery is general. Internal three-stage stack assembly, the components are fixed using a screw and viscose.
The thickness of the whole machine is only 6.8mm, and the straight surface glass design is used before and after, the battery thickness is controlled within 4 mm. The heat dissipation is excellent, and the copper foil, graphite cooling film, thermally conductive silicone and thermally conductive copper pipe are used.
Detail highlight
Xiaomi 11 Youth Edition screen uses domestic Tianma 6.55 inch ultra-thin AMOLED flexible screen, 2400x1080 resolution, 90Hz refresh rate.
The protective glass is designed with a straight surface plate. The glass rear cover also uses a flat plate design. The front and rear glass plane design greatly reduces the thickness of the whole machine, the thickness of 1.2mm is 1.2mm, and the thickness of the glass rear cover is 0.7 mm.
The mobile phone adopts Shanghai Nanxixi Semiconductor Southchip SC8551 domestic fast-changing chip. This is Ewistech to find a domestic fast charge chip except the Haisi for the first time.
The three-three cameras are used in Samsung CMOS photosensitive elements. 64 million main models are S5KGW35P, F / 1.8 aperture; 5 million long focus models are S5K5E9YX, F / 2.2 aperture; 8 million super wide angle CMOS models are S5K4H7, F / 2.2 aperture, in the outer corner of the lens outer ring, there is one Circle silicone ring.
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Motherboard IC information
The main IC of the motherboard (below):
1. SKHYNIX- H9H15AFAMBDARKEM-8GB memory + 128GB flash memory
2. QUALCOMM-SDM7350-Snapdragon 780G 5G eight-core processor
3. QUALCOMM-RF transceiver
4. Qualcomm-Wifi, Bluetooth
5. QUALCOMM-Power Management
6. Southchip- SC8551-fast charge chip
7. QUALCOMM-audio decoding
8. InvenSense-six-axis accelerometer and gyroscope
9. AMS-light distance sensor
The main IC on the back of the motherboard (below):
QUALCOMM-power management
2. QUALCOMM-Power Management
3. SkyWorks-RF front end module
4. NXP-NFC control chip
5. QUALCOMM-Envelope tracking chip
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Summary information
After the motherboard analysis is completed, we found that the radio transceiver and the main power chip will be the same as the Snapdragon 888 platform. A relatively particularly millet 11 Youth Edition used a domestic fast-champion-Shanghai Nanxin Semiconductor SouthChip SC8551 fast charge chip. This is also the first time EWSETECH found in the Qualcomm platform. (: JUDY)
(The above content is derived from Ewistech submission)
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