5G array of domestic mobile phone today, you would expect the Samsung it? Samsung is getting lower and lower in the domestic market, may indicate that Samsung has lost the market in China, but still ranks in front of global shipments. As a high-end flagship Samsung Galaxy Note series, there will be a lot of attention.
Yes, today we disassemble is Samsung Galaxy Note 20.
Dismantle
After turning off, the SIM Cardo and S Pen are removed. SIM caloria has a film waterproof, does not support SD card expansion; S Pen built-in action sensor, click the S Pen button to implement mobile phones, S Pen now has the largest selling point of the Note Series.
Note 20 is a PC + PMMA back cover, and the rear cover is strong, and the hot air gun is heated to 200 degrees, and the tiny sheet is opened. In addition to common foam, the rear camera glass cover is also attached to a pressure balance film and a microphone.
The pressure balance film reduces the stress to be subjected to the internal components of the mobile phone by balancing the internal and external pressure of the phone, protecting the internal components from the liquid used in daily life.
Then remove the NFC / MST / wireless charging coil, BTB metal cover, top and bottom antenna modules, wherein the wireless charging coil is fixed by a glue fixed, the BTB metal cover, the top and bottom antennas are fixed by screws.
An annular gum is applied around the earpiece, and the cable is partially pressed under the black plastic parts and can only break down.
The handset is located under the front camera, and the sound is conducted to the top through the metal sheet on the back, and it functions as a sound effect.
Remove the motherboard, sub-plate, and connection soft board, USB TYPE-C soft board, display soft board, and front and rear camera soft board. The motherboard is attached to a plurality of layers of graphite sheets for heat dissipation.
Note 20's motherboard is designed with a higher cost of double-layer, with a two-piece spacing of 0.9mm.
The screen is connected to the motherboard via a transfer soft board, and the BTB interface is fixed by the screw and the metal sheet.
The rear camera is also fixed by screws.
The battery is strongly viscous, and the battery is deformated after the adhesive is fixed.
Remove the vibrator, white S Pen cover, buttons soft plates and coil soft boards, these components are fixed by glue. Note 20 integrates the power key and function keys Bixby, saving the internal space. Waterproof film is posted on the soft board.
The coil soft plate and the coil in the S PEN induced to charge the S Pen.
Finally, the screen and internal support are separated by heating, and the Note 20 uses a high-pass ultrasonic fingerprint identification module, and the fingerprint recognition module is integrated on the screen.
In addition to the surrounding of a coat with a large area, there is a large area of double-sided adhesive in addition to a circle of foam. It is often difficult to dismantle, usually the A series will be designed, and there is no in the Note series.
Summarize
Note 20 The whole machine is fixed with 22 screws, and there is no anti-punch label on the screw. The whole machine is difficult to dismantle, the screen fixing glue and battery fixtures bring a large difficulty to disassemble, on the screen, back cover, button, USB interface, S Pen, SIM tray, handset, speaker, microphone, etc. Process. Note20 uses an external 5G baseband, comparing the occupancy space, so the two-layer board design is used, and the position of S Pen further compresses the space of the battery.
The maximum change in Note10 last year is the heat dissipation and plastic rear cover of the motherboard, and the Note20 motherboard is heat-dissipated by several layers of graphite slices under the motherboard and uses a plastic back cover. Note10, Note9, etc., by heat-dissipating copper tube, and glass rear cover.
Motherboard IC on Note 20:
Motherboard 1 The main IC (below):
1: QUALCOMM- SM8250 - Qualcomm Snapdragon 865 PLUS processor
2: Samsung-K3LK3K30EM-BGCN-8GB memory
3: Samsung-Klueg8uHDB-C2D1-256GB flash memory
4: QUALCOMM-SDX55M-X55 baseband
5: Maxim-max ***** C-power management chip
6: NXP-NFC control chip
7: STMicroelectronics - Pneumatometer
8: AMS-TMD **** - Ambient Light / Distance Sensor
9: AKM-AK **** C-electronic compass
Main board 1 main IC (below):
1: MURATA-KM0422176-WiFi / BT chip
2: QUALCOMM-PM8250-Power Management Chip
3: IDT-p **** S-wireless charging chip
4: Cirrus logic- cs ***** - Audio amplifier
5: Color temperature sensor
6: Microphone
7: stmicroelectronics-lsm **** - gyroscope + accelerometer
Main board 2 main IC (below):
1: QUALCOMM-SDR865-radio frequency transceiver chip
2: SkyWorks-Sky77365-11-Power amplifier
3: Wacom-W9020-S PEN control chip
4: QUALCOMM-QET5100-envelope tracker
Contains IC, Note 20 The entire machine has a total of 1611 components, and the estimated material cost is US $ 373.64. Of which 42.4% is the main area of the flash memory, memory and screen of Korea, of the total cost. This is quite high.
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Reprinted from ewistech.
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