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    E dismantling: Analysis in which places have made technological promotion R17 Pro

     

    In 2018, Xiao E income OPPO R17 and OPPOR17 PRO, and the R17, which is known as science and technology and technology, will be given up early. For R17 PRO, do you have a lot of small partners looking forward to the inner world of ultra-high quality? Small e sent today is the combination of science and technology and art, then doing technology-promoted OPPO The dismantling of R17 PRO. Is there a technological promotion? We look from the beginning of the configuration. Configuration list: SOC: Qualcomm Snapdragon 710 processor, 10nm process Screen: 6.4 inch AMOLED water dripping screen 丨 resolution 2340x1080 丨 Screen 86.6% Storage: 6GB RAM + 128GB ROM Front: front 25 million pixel camera Back: Back 20 million + 12 million pixel camera + TOF 3D camera, support OIS anti-shake Battery: 3600 mA chip ion battery Features: Back camera variable aperture | TOF 3D camera | screen light sensing fingerprint | VOOC super flash (The above parameters are the small E family engineer's brother pro test data, or in place with official data.) Decomposition step: Remove the tartr, there is a silicone sleeve on the calorie, there is a certain waterproof and dustproof, use the hot air gun heating the back cover and the inner support void, slowly open the rear cover, the rear cover and the inner support pass the glue. The motherboard cover and speakers are fixed by screws, remove the motherboard cover and speaker. The NFC coils fixed on the motherboard cover and the LED flash soft plate are only removed by the glue. The main board cover is fixed to the large-area graphite sheet to extend on the battery, and the heat is used. Remove the motherboard and sub-plate, soldered the copper sheet on the motherboard metal bracket for connecting the earpiece module, and the light sensor receives the light through the light guide tube. The battery has a rubber paper package. There are two soft boards at the bottom of the bottom. Battery adhesives allow the battery to be opened directly, making it easy to replace. Black glue is used at the bottom of the tape. Although OPPO R17 PRO is not waterproof, it is still a silicone ring in the USB interface, which can prevent splashing of water. The card slot is designed to be separately supported, and the canapper cover is a touched structure, and the handset will pass the sound through the cover, and the screen soft board passes through the inner support void. Silicone pad, protect And the role of the fixed soft board. The screen is fixed by the black gum, and the screen is separated by heating the temperature of about 80 ° C using a heating station. OPPO R17 PRO is amazed outside the appearance, its night scene is also a point that has been praised, then let's take a look at its followed three-camera. The rear camera 20 million pixel main model is SONY IMX362, the aperture is F / 1.8 & F / 1.4, seven-piece lens, support OIS anti-shake. Deposition is 12 million pixels, the aperture is F / 2.6, five slight lenses. A TOF camera is equipped at the bottom. After disassembling the main rear camera module, you can see the internal aperture adjustment device, and 3 pieces of masks and 1 magnet are found after disassembly. Its variable aperture principle: The magnetic forcebelry magnet generated after the inner coil is powered on by the inner coil, which drives the opening and opening up of the toner in the adjustable diaphragm to change the amount of light of the lens, thereby acting as a change of the aperture. We also have a variable aperture camera that has seen the same structure in Samsung Note9. 25 megapixel front camera, five-piece lens, aperture is f / 2.0. The screen is 6.4-inch AMOLED water drop screen, the resolution is 2340x1080, the manufacturer is the Samsung model of AMS6141RW. The battery is 3600mAh lithium-ion battery, and the cell vendor is ATL. With dual-core design, improve the charging efficiency while ensuring safety. Main IC information: After reading the dismantling steps and each module, we still put the attention on the motherboard. Look at the support of the main chips on the core board of OPPO R17PRO. The main IC of the motherboard (below): Red: Samsung-KM2V7001CM-6GB memory + 128GB flash chip Yellow: QUALCOMM-SDM710 - Qualcomm Snapdragon 710 Eight Nuclear Processor Chip Blue: Distance Sensor Chip Orange: QUALCOMM-PM670-Power Management Chip Magen: AKM-AK4376-audio chip Green: QUALCOMM-SDR660-radio frequency transceiver chip Cyan: NXP-Q3304-NFC Control Chip The main IC on the back of the motherboard (below): Red: QUALCOMM-PM6790A-power management chip Green: qorvo-qm56022-radio frequency simulation chip Cyan: Skyworks-Sky77920-21-GPS front end module chip Yellow: QUALCOMM-WCN3990-WiFi / BT chip Blue: Fairchild Semiconductor-FSA4476-Analog Audio Switch Chip See the table below for logic, memory, pm, and RF chip on the motherboard. MeMs on the motherboard see the following table: More modules, components, chip information can click to read the original text, enter the Ewistech official website inquiry, or leave a message to the small E! Summary: The OPPO R17 PRO can be fixed with 2 total 24 screws, and the motherboard is dissipated by heat dissipation silicone fat, graphite sheet and heat dissipation copper foil. The battery is designed to improve the charging efficiency, and the battery is guaranteed, and the battery is heat dissipation. Although the OPPO R17 PRO does not water. However, in the USB interface, SIM caloria, side bond, light sensing and screen BTB interface, there is a silica gel sleeve, which plays a waterproof effect, so it should be a design of water splashing water. The whole machine is designed and the structure is rigorous and stable. Be Hot recommendation: NXP LPC54018 Internet of Things Module OM40007, let your schedule fall more quickly Texas Instrument MSP-EXP430FR2355 LaunchPad Development Kit, allows design development to be simple and intuitive Microchip Technology SR087 Power Demo Board, Switching Power Supply New Selection Bosch BMI088 High Performance IMU, improve the flight and navigation experience with you Roma Semiconductor Sensorshield-Evk-003 Evaluation Kit, a "available" Intel RealSense Depth Camera D400 Series "More Convenient Secret" Analog Devices Eval-ADXL362 Evaluation Board to Develop Designers More Choice Cypress Semiconductor PSoc6 BLE development kit, beautiful design is about to happen STMicroelectronics VL53L1X flight time ranging sensor, absolute ranging fearless color and reflection NXP I.MX 8MQUAD Evaluation Kit MCIMX8M-EVK, a high-performance development tool for unpacking Infineon IM69D120 and IM69D130 Xensiv MEMS microphone, designed for low distortion and high signal-to-noise ratio Original address: https://www.eeboard.com/teardown/r17-pro/ Search for the panel network, pay attention, daily update development board, intelligent hardware, open source hardware, activity and other information can make you master. Recommended attention! [WeChat scanning picture can be directly paid]

     

     

     

     

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