Vivo S9 is launched in March, and the design is a problem, not to comment. However, the thickness of 7.35 mm, the weight of 173g inevitably makes S9 stand out in the 5G mobile phone. It also uses a double front camera. How do this mobile phone accommodate many hardware of 5G mobile phones?
Ewistech is of course a exploration, so dismantling today: Vivo S9, let's take a look at its internal layout.
Dismantlement step
First shut down the Carto, the caloria has a silicone ring, and a model card is placed on the front. The rear cover is fixed by a glue, heated to about 200 degrees, and then open the rear cover using the suction cup and the cladder. The motherboard cover is attached to the foam protection, the speaker, and the battery area have graphite fins.
The rear camera protective cover is fixed to the back cover, and there is a bubbles in the inside to protect the camera.
The box is fixed by screws. There is a screw possession to have a warp tag. The top camera position is protected by bubbles around the top camera. All antennas are in the middle box, which is an integrated antenna.
The top motherboard cover and the bottom speaker are fixed by screws. Waterproof labels and pressure balance films are posted on the speaker module.
The motherboard cover is attached to the NFC coil and the flash and the graphite heat sink. After separation, the bubbles and conductive cloths can also be seen on the motherboard cover.
Self-board has a white waterproof label. There is a green antenna plate on the left, and the fingerprint sensor is connected to the panel over the BTB interface.
Remove the camera, battery, and fingerprint sensor. The battery is fixed by plastic tape. The upper surface of the motherboard is attached to the copper foil and the graphite sheet is also used in the camera position.
Before dismantling the motherboard, you need to remove the two positioning nuts on the motherboard and take the motherboard. The sub-board is fixed by the card slot, and the SIM card slot is on the sub-plate, and the USB interface on the sub-board has a waterproof rubber ring.
Remove accessories such as double-sided adhesive, buttons, main panel connecting soft board, antenna plate, and vibrators. The inner support has a heat-conductive silicone having a heat dissipation of the motherboard, directly coated onto a liquid-cooled copper tube. Black plastic tape is used at the screen soft board.
The light distance soft plate is separately fixed, and the screen is required to remove the screen. The heat separation screen is heated with a heating station, and the inner support is attached to a large area of heat-dissipating graphite, and the screen is fixed by the inner support.
The screen is selected with the AMOLED screen of Samsung 6.44 inch 2400x1080, supports HDR10 +.
Remove the radiant graphite, remove the liquid cold copper tube.
Detail highlight
The whole machine is basically a relatively common three-stage structure. A total of 24 screws + 2 nuts are used, which is not too the same as other phones. It is used in the metal box and integrated antenna design. (Mobile phones currently using boxes are generally medium and low-end mobile phones to use plastic box + FPC antenna).
The thickness of 7.35 mm can be relatively thin in the 5G mobile phone at the time. Therefore, in the dismantling, we also noticed this, and the battery thickness of most mobile phones is 4.5mm or more, and the battery thickness of S9 is only 4 mm.
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At the same time, the metal main board cover is also relatively thin. The motherboard is relatively relatively small because the main board is used.
Motherboard IC information
The main IC of the motherboard (below):
1: Samsung- Kludg4uhdc-b0e1-128GB flash memory
2: Samsung-K3YH7H70AM-AGCL-8GB memory
3: Media TEK-MT6891Z - Tianzhu 1100 5G chip
4: Media TEK-RF transceiver
5: qorvo - RF front end module
6: NXP-NFC control chip
7: Media Tek-WiFi / BT / GPS / GLONASS / FM
8: Media TEK-Power Management Chip
The main IC on the back of the motherboard (below):
1: Media TEK-Power Management Chip
2: STMicroelectronics-6 axis gyro + accelerometer
3: qorvo-5g power amplifier chip
4: Knowles-microphone
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Summary information
S9 selection is equipped with a chip of the latest Tianzhu 1100. At the same time, the front double-fitting is used, and the main photo supports AF focus, and two LED flash on both sides above the screen. The whole machine is heat dissipated by a liquid cold tube + thermally conductive silicone-graphite sheet. The USB interface, SIM Cardo and speakers are protected by silica gel, which can play a certain dust-proof waterproof. (: JUDY)
(The above content is from ewistech)
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