Almost well known the fine workmanship and metal fuselage of the HTC flagship smartphone One series, which is also these two reasons to make the dismantling of HTC One M8 seems less easy. Or by dismantling, the HTC One M8 is understood by the internal perspective.
Open the door to see the mountain, combined with previous experience, first take the SIM card slot, etc.
I can't find the "flaw" in the back shell in the nunish metal, but also the recent demolition Galaxy S5 gave us some prompts - starting with the front panel. The front panel seems to be three-stage, first try the lid of the drum in the upper and lower tricks.
It is the first to think that the two lids are metals. After shaking, it is actually plastic, and the flexibility is very good, the speaker cover is fixed by the glue with the body, and the screws will be referred to the screws.
Unscrew the screws of these two.
Use the cladding to shake the tight relationship between the front panel and the metal rear shell.
The rear shell is separated, and the material is 106.6 g, the material of the metal is separated, and it is more components in his hand.
Next is to process shield stickers outside the motherboard shield, turn on various connectors on the board, and various positioning screws. Although the "inner" of the HTC One M8 is already expected, it is still very surprising when it looks at the sticker and see the circuit board. The large and small device module is inclined, plus the connection and avoidance of each other. Man is dazzled.
...... .. I finally tied it.
There is also a plastic cover on the antenna module, further removed. During the dismantling process, we found that the antenna design of HTC One is relatively novel. It should be the reason for its aluminum body. The advantages of metal fuselage are self-evident, better texture, stronger hardness, and then The short board is in the RF radio signal through the problem, we will do additional analysis for the antennas of HTC One M8, this will not be detailed.
Remove the size of two boards separately. The flexible circuit board is indeed flexible, and it is relatively fragile. When the motherboard and other modules are removed, you need to deal with various adhesives, while you need to be careful.
After removing the shield, both sides of the board, the single-sided mount used by the circuit motherboard.
Two board details
The HTC One M8 is high-pass MSM897AC platform (the chip and DRAM chip POP package under the DRAM chip), and the LTE full network supports high-pass WTR2100 + WTR1625L scheme.
The front panel is left, the vibrator, the reader, and the battery are removed one by one. The vibrator is designed to be next to the camera, and the regular mobile phone layout, the vibrator design is on the edge of the fuselage. The battery is removed, and the two long visclas tightly put the battery on the box. Among them, the battery is made by Changzhou Shangyang Optoelectronics Co., Ltd. Made.
The separation of the screen part is heated for about half an hour, and the screen portion is removed.
The last big photo, EWISETECH dismantles the strongest in history. The separation between the entire mobile phone is not too difficult, it is difficult to have more devices, complex connections; fit between the devices, the various tape rubber cloth, the late maintenance is very difficult.
(Ewistech feasted)
EwiseTech is a high-tech consulting firm dedicated to electronic product analysis, providing global clients including mobile phones, tablet, wearable equipment, electronic mobile terminals, and emerging technologies, depth hardware analysis, and full-software hardware test services. Detail: www.ewisetech.com
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