Last Zhou Hua Sound X dismantling you? It is still a smart speaker today. It is still a smart speaker of Huawei Ai Intelligent Speaker 2. This is also a speaker that supports a touch.
Dismantlement step
The bottom of the speaker is fixed by double-sided adhesive, and the non-slip mat is a foam material. The non-slip pad is 5 cross screws, one of which has a defense.
Unscrew the bottom screw, the bottom cover is the ABS engineering plastic material, with a bulk buffer in the inside. A product information label on the outside.
The outer casing is a hollow mesh ABS plastic, and the exterior is a freeweed package mesh. Unscrew the two cross screws at the bottom of the speaker, you can remove it, the internal structure of the speaker can be seen.
The audio cavity is supported in the integrated module design, the bottom half-moon-shaped power board, is fixed to the bottom of the sound chamber housing with two cross screws. The connection wire between the power supply plate and the associated device is embedded in the bottom of the trough, and the wire has a sponge material package outside.
Slot connections and welding methods are connected in both the bottom of the power board, and a small piece of protective foam in the slot interface surface is used.
The structure of the bottom sound cavity is a hollow module, one side is closed, and there is a passive passive bass enhancement unit on both sides. The front is a 10W 2.25-inch full-range speaker. The wire of the speaker is connected to the motherboard in the plastic shell, through the hole in the top of the module.
The 10W speaker and two passive bass enhancements have been fixed with 12 cross screws. The speaker is connected to the wires between the two contact points and the wires, and the welding point is wrapped in the outer black tape.
Passive passive bass enhancement units on the left and right sides of the sound cavity, using rubber materials.
The 2.25-inch 10W full-range speaker unit adopts a NdFeB rare earth material.
The top touch cover is fixed using double-sided adhesive and buckle. After careful clackles, you can see a translucent light guide cover and 4 cross fixed screws in the middle of the top of the speaker.
Unscrew the 2 screws of the top 4 screws and fixed sound cavity modules, and the top microphone panel is connected to the main board, and the interface is protected by the interface. Disconnect the top microphone plate and the motherboard to remove the sound cavity module. There are also foam protection at the interface of the top motherboard.
Since there is a coaxial connection between the motherboard and the two antennas, and the pin interface and tin wire are also connected to the speaker and speaker bottom power board, so that the 4 screws of the fixed motherboard are required to disconnect. Each interface and solder joint can remove the motherboard.
On the other side is the NFC, Bluetooth and WiFi antenna of the speaker.
There is a aluminum heat sink between the motherboard and the sound cavity module, and there is a small amount of thermally conductive silicone between the heat sink and the main board.
The top microphone is fixed in a small amount of double-sided adhesive inside the outer casing of the speaker, and can be taken out with the top gap to slide the tank.
The microphone plate is made of white PCB plate, and the four-corner has four ports in the reverse pickup microphone constitutes a radio array.
The frontal microphone pickup hole has a silicone sleeve. There is a LED lamp bead in the middle of the motherboard. There is a circle buffer buffer peripheral. The four touch positions have no physical buttons. The surface is used to contact the main board to generate electrical signals. control.
The speaker top guides are fixed with a small amount of double-sided adhesive, which is easy to remove.
Motherboard IC information
The main IC of the motherboard (below):
Heroic-ht *** sq-audio amplifier chip
2. Media tek-mt **** A-power management chip
3. Nanya-NT5cc ******* - EK-128MB memory
4. Media tek-mt **** - Integrated WiFi, Bluetooth Function 4 Nuclear Processor
The main IC on the back of the motherboard (below):
1. WinBond - W29N ******* -256MB flash chip
2. FuDan micro-fm11 ******* - NFC control chip
The main IC of the back surface of the microphone array motherboard (below):
1. CHIP ON- KF8TS **** - Integrated Touch Light Control Function MCU Chip
2. EVEREST SEMICONDUCTOR- ES **** - Audio Decoding Chip
3. Goertek-microphone
More IC information, remember to go to Ewistech search equipment to view the full content.
Summary information
Huawei AI smart speaker 2 is more complex, using a cross-screw to add double-sided adhesive assembly parts in the whole machine, and a large number of wire connections between the motherboard and the components, and use the welding process more. The outer shell is manufactured through ABS engineering plastics, and the upper half is used for the use of piano paint processes, and the lower half is used to wrap the web.
Although this speaker is similar to Huawei Sound X, it also chooses the same processor for the previous generation of Huawei smart speakers in terms of processor. So, these three Huawei smart speakers, which one is more interested?
(: JUDY)
Similar equipment disassembly information can be queried in the ewistech search restaurant!
Huawei - Sound X Smasrt Speaker
Huawei - ai speaker
Reprinted from ewistech.
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