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    E dismantling: Huawei P7, "Show outside Huizhong" practice

     

    Pretty, good-looking or exquisite, this is probably the impression of most people on Huawei P6, P7 mobile phone. Indeed, this previous two flagship smartphones have a good appearance, and "Xiuyou" on the shape can be said, and it is going to further explore the ewistech's dismantling laboratory. P7 has " Show outside? "Huizhong"? Take out the SIM calork first, it is already a thing that is often talking. P7 uses the front and rear double glass panels (Corning third-generation gorilla glass) design, the disassembly from the back, according to several glass panels this year, Ewistech Engineers naturally infer the P7 this panel is also achieved by glue. Get fit with the body. The panel is slightly heated with the insertion frame, suction cup is sucked, and the small card is gradually peeled off the rear panel with the fuselage. Successfully separated the rear panel. Slim is the first impression (thickness of about 0.68 mm), and the panel is seen around the foam glue, the intermediate area has a area of ​​heat dissipation stickers. There are also several other foams, such as the LED light around. At this point, the arrangement of the internal components can also be seen, but it is very gentle, and it is orderly. The long strip battery is parallel to the circuit motherboard, avoiding both superimposing, which is one of the reasons of P7 slim. Continue to remove it, break through the obvious screw, take a screw one by one. Remove the protection iron cover on the battery connector after loose. Remove the cover of the phone, EWSETECH engineers are initially determined that this plastic metal combined with iron block is related to the radio antenna of the phone. Remove the bottom plastic cover of the phone, other devices are not integrated on this plastic cover. Naturally, the following is to remove the battery, not too easy, using a large number of glue bits between the back of the battery and the middle frame, and the separation is quite average. The core of the mobile phone is located - the circuit board. First "Clear the Land Route", remove the small device group such as the front camera and the vibrator / headphone jack module. After ingestion, you can see a circle on a circle on the box. Ewistech Engineers noted that the thickness of the earphone jack assembly used in P7 is 3.86mm, which is much thinner than conventional headphone jacks. You can separate the circuit board, a lot of snaps, you need to be cautious. The motherboard is as such an irregular shape, and the motherboard has extended a small piece to the right. The transition is smaller, and the metal skin is added to the board, and the treatment is meticulous. The main board is also connected to the rear camera and the photosensitive / close sensor module, one one is removed. Remove the circuit motherboard after the shield, equipped with the Haisi Dragon chip BALONGV9R1 (Hi6620) application processor, of course, can also be called Kirion910 (Kirin 910 Market Propaganda) / K3V2PRO (commonly known as). The motherboard is another side, Finally, the front panel is left, remove the receiver, the recurrent is fitted with the front panel, and after removing the top of a circle, enclose the sound cavity, seismic buffer; remove the Dome button (power / switch, volume control) Soft board, the soft board and the middle frame are combined with glue. Remove the antenna / speaker module, the module is closely fit to the front panel through the glue and deduction. After separating the speaker, you can see the foam on the plastic block, yes, and there is a lot of bubbles in P7. Here is a soft line connector for a screen in a connection, which is bundled with a tape. Open the tape, separate the connector, below is a touch screen control chip from the Synaptics model S33508. The connector that has been connected is also reinforced with the tape, which is fine enough. EWISETECH dismantling summary: Dissolving itself is not difficult, routine steps and methods. Impressive is the inner construction of P7 in order, and the micro detail processing, the positioning of the internal components of the phone, the reinforcement of the connector, the use of large amounts of foam, and more Hai Si chip Let us believe that Huawei is getting closer and closer to the mainstream design of the international first-line. About Ewistech: EwiseTech is a high-tech Internet company dedicated to electronic product analysis, providing a global customer with a deep hardware analysis of electronic mobile terminals and emerging technologies, including mobile phones, tablets, and wearable devices, and full-hardware and software test services. For more information and dismantling analysis, please visit www.ewistech.com.

     

     

     

     

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