In recent demolition phones, there are more and more chips such as domestic RF PA, audio power amplifier, battery charging and touch control. We have seen an audio amplifier from domestic chip vendors Fourier from domestic chip manufacturers. Among the Samsung Galaxy F52 5G.
In our decided red rice Note10 5G, an audio amplifier chip from Fourier is also found. So, after the regular dismantling, let's take a look at this chip.
Dismantlement step
First shut down the Carto, and the tray has a silicone cover to dustproof. After heating, open the plastic rear cover by the suction cup and leathers. The rear cover is sticker and graphite sheets, corresponding to the battery and speaker position, respectively.
The plastic rear end cover is fixed by the screw and the snap, and the camera cover on the rear end is fixed by a snap. The fingerprint identification module card is covered in the rear end groove. The speaker module is fixed by screws.
There are 7 FPC antennas, which have a surround antenna.
A large area of heat dissipation copper foil is attached to the motherboard shield. A large amount of heat dissipation silicone is also applied to the middle end cover. Further, a thermally conductive silicone is coated at the CPU, the plurality of power supplies, and the radio frequency chip position in the shield.
Unlike the version of Note 10 Pro, this time the Note10's motherboard integrates a 3.5mm headset interface. The headset hole supplier is believed to be universal electronics letcha.
The battery is fixed by a whole piece of easy retret tape, and the battery is slightly deformed after disassembly.
After removing the shackle, the earpiece and the side key soft plate, the screen is separated by the heating table, and the inner support top is attached to the top.
There are 2 BTB interfaces on the display, which are connected to the motherboard and sub-board, which effectively saves the layout space of the display cable and the main sub-board cable two-in-one design.
The 17 screws were fixed in the Red Milk Note10 5G. The internal structure is simple, in order to control the whole machine cost, the configuration of integrated FPC antenna + plastic body + TFT display is selected. In terms of heat dissipation, the inner selection of graphite sheets + thermally conductive silicone sticked foil is heat dissipation.
Motherboard IC information
The main IC of the motherboard (below):
1: Media TEK-MT6833V- 天玑 700 processor
2: Micron-MT29VZZZAD9FQFSM-046 -4GB memory + 128GB flash memory
3: Foursemi-FS1820-audio amplifier
4: qorvo-qm77048e-power amplifier
5: Media TEK-MT6631N-WiFi / BT / GPS chip
6: Invensense- ICM-42607-gyroscope + accelerometer
7: AKM-AK09918C - Electronic compass
The main IC on the back of the motherboard (below):
1: Media TEK-MT6365VPW-Power Management Chip
2: Media TEK-MT6190MV-RF transceiver
3: VANCHIP-VC7643-62-Power amplifier
4: Goertek-Microphone
E analysis
Under the trend of mobile phone audio space, smart audio amplifier is more important. In Note10 5G, FS1820 of FOURSEMI (Fourier) was used, and a 3X2MM audio amplifier chip was packaged for QFN20.
Fourier is a company that focuses on high-performance audio solutions, and his audio solution has appeared in smart devices many times. The company's audio amplifier chip SPC1910 has also appeared on the Samsung Galaxy F52 5G mobile phone disassembled until it was dismantled.
The field of smart audio amplifiers has long been monopolized by Europe and America's chip big factory. Now, the audio amplifier of domestic manufacturers Fourier gradually appears in various mobile phones.
In addition, according to the data in a small E database, the chips such as domestic radio frequency PA, battery charging and touch control have frequently appeared in the phone. It can be seen that domestic chips in various fields gradually break the pattern of foreign chip monopoly. (: JUDY)
(The above content is derived from ewistech authorization reproduced)
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