After the mobile game begins, the born game mobile phone is getting more and more. And each home has made a lot of optimization for games. Red Magic 5G is a mobile phone that is specially optimized for cooling. Of course, the most special is that it adds a 15,000-turn small fan in the mobile phone.
Today, the red magic 5g disassembly brought by Ewistech, come close to this small fan.
Dismantlement step
Carto is located at the bottom of the phone, and there is a waterproof and dustproof effect with a silicone ring. The rear cover is heated with an inner support gap to heat it, so that the rubber is turned on.
The large area of the graphite slice of the heat-dissipating heat is covered in the battery and the speaker position.
LED lights are connected to the motherboard through the ZIF connection, and black gum is attached to the main board. Remove the rear camera cover and LED light slate, the rear camera cover and the LED light slate are fixed.
The motherboard cover and the speaker are fixed by screws, and the flash soft plate is fixed to the motherboard through the glue.
There is a wind groove on the motherboard, so that the wind after the fan is activated inside the mobile phone, thereby playing heat dissipation.
Remove the main board, panel, front and rear camera and other components. The main board processor & memory position is applied with heat dissipation silicone and direct contact with heat dissipation copper tubes. The USB interface has a silicone ring for waterproof.
The front camera softboard is attached to the conductive tape protective effect, and the bottom of the rear camera is attached to heat dissipation.
The centrifugal fan is located on the left side, and the wind blows from the right vent to the left ventilation. The speed is up to 15,000 rpm. The flying air springs of this centrifugal fan uses aerospace nanometric materials for high thermal conductivity, improves the overall thermal conductivity.
The battery is fixed to support by double-sided adhesive fixation.
Remove the button soft plate, earphone, earphone hole soft plate, side pressure button soft plate, fingerprint recognition sensor and other devices.
Both the antenna plates are fixed through the cover and the screws.
The soft plates of the side press-sensing buttons and buttons are protected with rubber plugs. The game key soft plate and the external interface soft board are protected by a metal cover.
Separation screens and internal support, still need to use the heating table, melt fixation between both 80 ° C. The inner supported sensor soft plate has a protective silica gel sleeve. The liquid cold tube is located in the upper part of the upper part, pressed under the graphite sheet, the area is not very large.
Module information
The screen is a 6.65-inch 2340x1080 resolution AMOLED full screen, the model is Visionox G2665FP103GF.
Rear 64 million pixel main camera, model is SONY IMX686, the aperture is f / 1.8
Rear 8 megapixel wide-angle camera, model is SK HYNIX HI846, the aperture is f / 2.2
Post 2 million pixel macro camera, model is superpix sp2509
Front 8 megapixel camera, model Sony IMX362, the aperture is f / 1.8.
Motherboard IC information
The main IC of the motherboard (below):
1: QUALCOMM-QDM **** - RF front end module chip
2: QUALCOMM-SDR *** - RF transceiver chip
3: QUALCOMM-QPM **** - RF amplifier chip
4: QUALCOMM-QPM **** - RF amplifier chip
5: Samsung- KludG4UHDB-B2D1-128GB flash chip
6: Samsung- K3LK3K30EM-8GB memory chip
7: QUALCOMM-SM8250-Qualcomm Snapdragon 865 processor chip
8: QUALCOMM-PM ***** - Power Management Chip
9: QUALCOMM-PM **** - Power Management Chip
10: QUALCOMM-XD55M-5G module chip
11: QUALCOMM- PMX ** - Power Management Chip
12: QUALCOMM-WCD **** - Audio Codec Chip
The main IC on the back of the motherboard (below):
1: QUALCOMM- QCA **** - WiFi / BT chip
2: QUALCOMM- qPM **** - RF amplifier chip
3: QUALCOMM- qPM **** - RF amplifier chip
4: QUALCOMM- QPM **** - RF power amplifier chip
5: QUALCOMM- PM ***** - Power Management Chip
6: QUALCOMM- PM **** - Power Management Chip
Specific information, ewistech searches are waiting for you.
Summary information
Red Magic 5G uses three-stage design, due to the addition of small fans, more components of the whole machine. And in order to leave a space for the fan, the motherboard also has special processes. At SIM Cardries, there are silica gel coils at the USB interface for waterproof processing.
It is also due to the internal fraamp sheet + heat dissipation silicone + liquid cold copper tube, and a small fan is added to heat dissipation, so the heat dissipation efficiency is improved compared to the general mobile phone. (: JUDY)
This is not the first time in the mobile phone. The fan of the Red Magic 3 has already entered the ewistech search.
NUBIA - Red Magic3
Reprinted from ewistech.
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