The mobile phone equipment in the Meizu in recent years is really not much, so we must not miss this Meizu 18. Although this Meizu 18 evaluation is not very high, how can it easily disconnect?
E dismantles
First shut down to remove the calorker, and the calorie has a silicone ring. The rear cover is fixed by a strong adhesive glue. So first heat the back cover with a hot air gun, and then cooperate with the suction cup and cladding to open the rear cover.
The camera cover is secured to the back cover by rubber and has a bubbles on the cover for protecting the lens.
The top motherboard cover and the bottom speaker are fixed by screws, and a whole graphite sheet covers from the top to the bottom. Linear motor stickers on the front of the speaker.
Remove the motherboard, sub-board and camera modules. A large-area heat-dissipating copper foil is attached to the motherboard. The main chip is also applied with heat dissipation silicone for heat dissipation.
The battery has a lift handle, which is fixed by plastic tape, easy to disassemble. Remove the battery and remove the coaxial and bottom shockproof.
When the button soft plate is removed, the button is set to the silicone sleeve for protection. At the same time, the sensor soft plate, microphone soft board, handset, and main panel connection soft board can be removed.
Use a heating station to separate the screen. The inner support positive is a large-scale graphite film, and the screen is fixed by the inner support. The fingerprint module is placed on the back of the screen.
The screen is Samsung 6.2 inch 3200x1440 resolution Super AMOLED screen, the maximum refresh rate is 120 Hz, and the model is Samsung AMB623TS15.
The liquid tubes located on the box are not conventionally common, and the entire area can only be considered medium.
E analysis
The main IC of the motherboard (below):
1: QUALCOMM-QPM5677-RF amplifier chip
2: QUALCOMM-QPM5679-radio frequency amplifier chip
3: QUALCOMM-QPM6585-radio frequency amplifier chip
4: QUALCOMM-SMB1396- fast charge chip
5: QUALCOMM- PM8350BH-Power Management Chip
6: qorvo- qm42391-radio frequency amplifier chip
7: SanDisk-SDINFDK4-128G-128GB flash chip
8: Samsung- K3LK7K70BM-BGCP-8GB memory chip
9: QUALCOMM-SM8350-Qualcomm Snapdragon 888 processor chip
10: NXP-SN100T-NFC Control Slices
The main IC on the back of the motherboard (below):
1: qorvo-qm45392-front-end module chip
2: QUALCOMM-WCN6851-WiFi / BT chip
3: QUALCOMM- PM8350-Power Management Chip
4: Cirrus Logic- CS35L45-Audio Amplifier Chip
5: QUALCOMM- PM8350C-Power Management Chip
6: qorvo-qm77033-front end module chip
7: qorvo-qm77040-front-end module chip
8: QUALCOMM-QDM2310-front-end module chip
9: QUALCOMM-SDR865-radio frequency transceiver chip
In addition to the high-pass processor, the whole machine is also a high-pass fast-charged program. In addition, a high-pass second-generation ultrasonic screen is also used.
Summary information
The whole machine is difficult to disassemble, and it is reducing. A total of 21 screws were used in the machine, and a common three-stage structure was selected. The whole machine is heat dissipated by liquid cold tubing + thermally conductive silica stoiler + graphite.
But as a charm year one year flagship mobile phone, Meizu 18 does not support wireless charging, and only 36W charging power is still left regret. (: JUDY)
(The above content is reproduced from Ewistech Authorization)
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