Today, the Redmi K40 game enhancement version, I don't know if there is a small partner curious now, is it so casual? What is the connection between this game enhancement version and K40? Xiaobian contrast, on configuration information, game enhanced version of the processor, front and rear imaging, and parameters on memory specifications are slightly inferior.
Small built-in hand is a 8GB + 128GB game enhancement version, the price of 2199 is the same price with the K40 standard version. Of course, the game enhancement version is not a place. Its advantage is mainly reflected in battery life, fast charge, heat dissipation, and game operation experience. These advantages have made what improvements have been made, dismantling and see! (There is an answer at the end of the text)
Dismantle
Take the calorine before the cutting machine is removed, and there is a silicone ring onto the waterproof. The rear cover is passed through the glue, and the heat gun is opened and the rear cover is opened by the leathech. There are large-scale bubbles on the rear cover, and graphene is also attached to the speaker position.
The top motherboard cover and the bottom speaker are fixed by screws. Remove the motherboard cover and speaker. NFC coils on the motherboard cover, flash soft board and camera cover are also removed. A graphite film is applied to the NFC coil.
Remove the motherboard, panel, front and rear camera module, coaxial. The USB interface on the sub-board has a silicone ring to waterproof.
You can also see the preparation of heat dissipation before dismantling, such as a back camera soft plate, a battery connection soft plate, and a main panel connection soft board, which can be used to clean the thermal protection. The inner supported groove is exactly a liquid cold tube, which is coated with a thermally conductive silicone, and corresponds to the main board processor & memory chip position.
The battery is connected to the motherboard and the secondary board, and the plastic film is fixed, and the tale handle is attached to facilitate disassembly.
There are also many small devices on the inner support to remove, including side shoulders and accessories, fingerprint recognition & power key soft plates, volume key soft plates, handset, vibrators, and sidewastebed slide plates. Both the side buttons and the slide plates are protected by plastic cover, and the size of the handset and the vibrator is relatively large.
The screen is fixed by the inner support, and the screen is separated after heating. The screen uses the Samsung 6.67 "2400x1080 resolution OLED screen, the model is Samsung AMS3A1667.
The microphone soft plate is located under the inner support of the stone ink, and then the lower liquid cold tube is removed, the liquid cold pipe area is large.
Summary:
The Redmi K40 game enhancement version is fixed with 23 screws, which belongs to a common three-stage structure. In terms of waterproof, in the USB interface, SIM Cardo is protected by silica gel, which can play a certain dust-proof waterproof. The side buttons and the shrapnel are protected by plastic cover. The two wires are connected to the motherboard and the panels separately. Overall, the difficulty of dismantling is medium, reducing reducing.
E analysis
After the dismantling, the internal work performance is still possible, and finally look at the REDMI K40 game enhancement version of IC selection.
The main IC of the motherboard:
1: Skyworks-Sky58258-21-Front End Module Chip
2: STMicroelectronics-six-axis acceleration sensor + gyroscope
3: Media TEK-MT6190W-RF transceiver chip
4: STMicroelectronicS-ST54H-NFC control chip
5: qorvo-qm77048e-radio frequency amplifier chip
6: Samsung-K3uh7H70AM-AGCL-8GB memory chip
7: Media TEK-MT6893Z-Tianzhu 1200 processor chip
8: Samsung- Kludg4uhdc-b0e1-128GB flash chip
9: Media TEK-MT6360PP-Power Management Chip
10: Media Tek- MT6635-WiFi / BT chip
The main IC on the back of the motherboard:
1: Media TEK-MT6359V-Power Management Chip
2: Media Tek-MT6315BP-Power Management Chip
3: Media TEK-MT6315GP-Power Management Chip
4: Cirrus logic- CS35L41-audio amplifier chip
5: Media Tek- MT6315RP-Power Management Chip
6: Skyworks- Sky58080-11-front-end module chip
7: Vanchip- VC7643-Power amplifier chip
In addition to the above-mentioned partial chips, the IC BOM of the whole machine can be viewed until the Ewistech search. When we finish, we also discovered a familiar chip, Shanghai Nanxin Semiconductor SouthChip SC8551 domestic fast-champion, this chip is also unmodied in the millet 11 youth version, it is found in the mobile phone. Domestic fast charge chip.
For overall REDMI K40 game enhanced version dismantling, the internal heat dissipation system is also a major feature. The use of graphene + graphite + liquid cold tubing + heat-conductive silicone is heat dissipated. The game handling experience uses 3 microphone + side shoulder bond + X-axis motor, which greatly enhances the game experience.
What do you look down on how the REDMI K40 game enhancement version? Welcome to the message to discuss.
(The above content is reproduced from Ewistech Authorization)
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