The multi-flagship machines in the first half of the year announced a strategic cooperation with the image brand. One of the mobile phones announced the three-year strategic agreement with the famous image brand Hasu. The first flagship product after the formal cooperation between the two sides, and the 9 series is equipped with a new image system with Hasu, which is a flagship mobile phone. How is it?
Dismantlement step
Remove the calorium according to the convention, and the calorium has a silicone ring to prevent dust and water.
Since the mobile phone supports IP68 dust-proof waterproof, the adhesion of the post-cover is strong. The rear cover is positive on the battery / wireless charging coil position to buffer.
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The motherboard cover and the sub-plate cover are fixed by screws, and there is a definition tag on the screw. The wireless charging coil is fixed to the main plate and the sub-plate cover through the glue to form a whole module. The wireless charging coil is wrapped in a whole piece of graphite sheet for heat dissipation.
The flash / microphone soft board and the NFC coil are fixed on the motherboard. Flash / Microphone Soft Board Integrated Flash, Microphone, and Flick-Detect Sensor.
Then remove the motherboard, panel, speaker module, main panel connection soft board and front and rear camera. The main board shield outer CPU position and the radio frequency chip position are coated with gray and blue thermally conductive silicone. On the motherboard and sub-board, those devices that are exposed outside the shield are protected by dispensing.
One Plus9 Pro uses a dual-core design, so there is a easy pull handle around the battery. At the same time, the battery can be removed from both sides.
The fingerprint recognition module, the slide plate, and the transfer cable can be removed directly, and the 3 RF coaxial cards can be taken into the groove on the side of the battery. . The USB TYPE-C interface is waterproof. The BTB interface between the elastic sheet and the transfer cable is protected by a metal cover.
The manufacturer of the fingerprint identification module is a summit technology, but there is no ultra-thin fingerprint identification technology used on the mainstream flagship.
Power button soft plate, volume key soft plate, screen adapter soft board, handset and haptic vibrating motor are fixed, carefully remove.
Finally, the screen is separated by the heating station and the inner support, and there is a large-scale copper foil on the back of the screen, and the inner support front is lowered. The liquid cooled plate is fixed in the chamber position of the box.
One Plus9 Pro The whole machine uses a three-stage design, a total of 21 screws are used. Due to the use of silica gel sleeves or glue to achieve silicone sleeve or glue to support IP68 dustproof and waterproof, back cover, screen, and each opening position.
Detail highlight
4400mAh lithium polymer dual-core battery is from ATL.
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We found that the mute keys did not connect to the motherboard during the dismantling process, and 2 ISENTEK high-precision linear motion / switch sensors were found in the later statistical motherboard IC. One Plus9 Pro achieved mute functionality by these two sensors.
The motherboard is designed with a double sheet design, and there is a thermally conductive silicone in the main chip position in the shield.
One PixelWorks X5 Pro vision processor is integrated within One Plus9 Pro, which optimizes variable high refresh rate display using a unique industry-leading MotionEngineTM technology.
Motherboard IC information
Motherboard 1 The main IC (below):
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1: QUALCOMM-SM8350-Qualcomm Snapdragon 888 processor
2: Samsung-K3LK7K70BM-BGCP-8GB LPDDR5
3: Samsung-Klueg8uHDB-C2D1-256GB flash chip
4: QUALCOMM-Power Management Chip
5: IDT-wireless power receiver
6: NXP-NFC control chip
7: QUALCOMM -WIFI6 / Bluetooth chip
8: Invensense- gyroscope + accelerometer
Main board 1 main IC (below):
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1: QUALCOMM-Power Management Chip
2: RockChip- fast charge chip
3: QUALCOMM- fast charge chip
4: PixelWorks-PX8578-X5 Pro vision processor
5: Knowles-microphone
Main board 2 main IC (below):
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1: QUALCOMM-RF transceiver
2: qorvo-power amplifier
3: QUALCOMM-audio amplifier
Summary information
One Plus9 PRO and the previous small e-demolished IQOO7, Xiaomi 11 and Samsung Galaxy S21 are high-pass 888 processors, and double-layer design is used to save internal space. Therefore, there are many preparations in heat dissipation, and heat-cooling tubes + graphite sheets + copper foil + thermally conductive silicone is heat dissipated. (: JUDY)
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(The above content is released from Ewistech Authorization)
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