Haisi Qilin 710A is a 14nm craft chip, and the foundry is SMIC, which should be a lot of people. In contrast, the Haisi Kirin 710 of the 12nm process of Taixia Electricity, is calculated, and the CPU frequency is also reduced from 2.2GHz to 2.0GHz. What is this chip? Ewistech specially incorporated Green Play 4T to see this Kirin 710A.
We still analyze your mobile phone from dismantling.
Glory Play4T uses a side calorker, three card design can support dual NANO-SIM cards and a MicroSD card, and the Truck has a Chinese ID to prevent insertion, with a black rubber ring for fastening and dust.
Then the familiar heating opens the back cover. It should be noted that the fingerprint sensor has a soft board connected to the motherboard, so when opening the rear cover, you need to disconnect the connected ZIF interface to remove the back cover. In addition to fingerprint recognition, the rear cover corresponds to the battery and the speaker position. It is used for buffering, and the corresponding motherboard position is carried out.
The fingerprint sensor is fixed by a black sealing gel with the back cover.
The motherboard cover and the speaker module are fixed by screws, and there is a screw on a slim label. The rear camera protective cover is a whole, and there is a space of the camera below, and the Play 4T Pro is a combination of the rear three-piece, maybe a shared module?
Play3 uses an integrated sound cavity single speaker outfit module, which has a waterproof tag on the module. The module outlet hole has a dustproof net and a foam material.
The battery is secured using a double-sided viscous film, but the viscosity is strong. Although the side is equipped with a handle, it is still necessary to remove the battery with a large force.
The battery uses a lithium polymer battery with a rated amount of 3900mAH. The model is: HB406689ECW, provided by Shenzhen Xinwangda production, the battery cell manufacturer is ATL.
Disconnect all interfaces to remove the motherboard and the sub board. Both are connected by a soft plate and a coaxial connection. The shield of the main IC position of the motherboard is coated with a thermally conductive silicone, and the frame is located at the card tank with a layer of graphite.
The USB port and headphone interfaces on the sub-board have a protective silica gel. We also found a light sensor with a silicone sleeve on the sub-board. But did not find a distance sensor in your phone, and perhaps the software implemented virtual distance sensor?
From left to right, the back 48 million pixel ultra-clear main cameras, the post 2 megapixel camera and the front 8 megapixel self-shooting image.
Button and button soft plate, handset and vibrator are bonded with double-sided adhesive. Could take care of it.
In the middle of the aluminum alloy, the screen is fixed by waterproof glue and the screen, and there is also a circle of anti-rolling mounts around the screen. There is a large area of graphite heat supplement film on the middle box, as well as anti-vibration bubbles, and special protection is also made. The device parts on the screen are insulated tape.
The screen uses a 6.39-inch 1560x720 resolution IPS tight full screen. The screen supplier is Tianma, the model is: TL064JVXM01.
The dismantling is simpler, and the internal use of screws and adhesive fixation. The rear cover is a plastic material, which is within the conventional three-stage layout. The two rear cameras are independent modules that make the replacement and maintenance is relatively easy.
Glory Play 4T's interface is still not updated to Type-C, which is treated inside for life waterproof, and cooling. Although the performance of the whole machine is lower, there is more than enough use of daily use.
Of course, this glory Play 4T has a very special place that it is its processor - Kirin 710A processor. Let's take a look at the chip of the glory Play 4T and its processor.
Motherboard IC information
The main IC of the motherboard (below):
1: hisilicon - hi **** A- Wi-Fi, Bluetooth, GPS, FM and infrared transmission 5 in 1 integrated chip
2: SK HYNIX - H9HCNNNECMML - 6GB of memory
3: Hisilicon - Hi6260 - Kirin 710A Eight Nuclear Processor Chip
4: hisilicon - hi **** - Power Management Chip
5: STMicroelectronics - Acceleration sensor chip
The main IC on the back of the motherboard (below):
1: SANDISK - SDINBDA4-128G-128GB flash chip
2: hisilicon - hi **** - Power Management Chip
3: hisilicon - hi **** - RF transceiver chip
4: Airoha - AP **** - RF front end module chip
The MEMS chip information used on the whole machine is shown in the table below:
From Die Photo to the Kirin 710a of SMIC, the Kirin 710 layout of the process of TSMEC is basically the same. However, the frequency of Kirin 710A has dropped from 2.2GHz to 2.0GHz. The size of the size unicorn 710A is slightly increased.
The 14nm craft unicorn has a size of 8.5x8.35mm; 12 nm craft unicorn 710 with a size of 7.7 x 7.7 mm. Additionally two pictures contrast.
Summary information
This may be that Haisi Kirin first uses SMIC to work, and the recent Huawei equipment has also seen the use of the United Kingdom processor. This also represents Huawei has a variety of options. The rise of all kinds of domestic accessories may have gradually become a big bottom of Huawei "to beautify". (: JUDY)
There is also a record in the ewistech search Kirin 710 processor.
Huawei - NOVA 5i
Reprinted from ewistech.
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