After 5G mobile phone release, due to the increase in the device, the lifting camera that is not small in space is previously only appeared in NEX3. Recently, the newly released Huawei glory X10 also chose the lifting camera. Today we will see how the glory X10 distributes internal devices, and how does the lifting module?
That naturally, you must first look from the motherboard.
It can be seen that this motherboard is a camera, or even the placement of the earphone hole, and the space is compressed. How is the IC ranked again? Let's take a look at the distribution of the main IC.
The main IC of the motherboard (below):
1: hisilicon - hi **** - RF transceiver chip
2: Samsung - Klucg2k1ea - 64GB flash memory chip
3: hisilicon - hi ***** - Wi-Fi, Bluetooth, GPS, FM and infrared transmission 5 in 1 integrated chip
4: SK HYNIX - H9HCNNNECMML - 6GB memory chip
5: hisilicon - hi6290l - Haisi Kirin 820 processor chip
6: STMicroelectronics - LSM **** - 6 shaft acceleration sensor + gyroscope
7: hisilicon - hi **** - RF amplifier chip
8: hisilicon - hi **** - RF amplifier chip
9: hisilicon - hi **** - Power management chip
The main IC on the back of the motherboard (below):
1: hisilicon - hi **** - Power Management Chip
2: hisilicon - hi **** - Power Management Chip
3: hisilicon - hi **** - Power Management Chip
4: AKM - AK ***** - Hall sensor chip
5: Murata - Multi-Wave Moduler Chip
6: hisilicon - hi **** - RF amplifier chip
7: hisilicon - hi **** - RF amplifier chip
E analysis
The emergence of Haisi Qilin 820 5G processor makes Huawei and the mid-end 5G mobile phone of glory in market competition more competitive. Also because of the different flagship processors, the power management chip required in the whole machine has decreased. The frequency band supported by the X10 is also less than P40, and the chip of the radio frequency is naturally reduced. And X10 has no separate audio chip. These chips have a decrease in devices such that the main board space is not so crowded, which also enables X10 with space to accommodate the lifting camera module.
After reading the motherboard, we will take a look at the dismantling, the distribution of the X10 other devices
Set of silicone rings in the bottom of the bottom of the bottom of the coat. The rear cover is fixed by the inner support, and the heat gun is used to heat the back cover and the rear cover is slowly opened. The rear cover corresponds to the battery position with large-area bubbles for protection.
The motherboard cover and the speaker are fixed by screws. After the removal, the flashboard is found to be fixed within the main board, and the motherboard is connected to the motherboard.
Black tape is attached to protect it on the BTB interface on the motherboard. The metal plate is used at the rear camera and fixed by screws. After removing the motherboard, you can see that the main chip position is coated with heat dissipation silicone.
The main board and the open space of the sub-plate, such as the earphone holes and USB interfaces, have silicone circles for waterproof.
The battery is supported by a whole piece of plastic tape and has a tale handle to remove the battery.
Press the key softboard with a metal plate for protection. The side antenna plate is welded directly to the coaxial line.
The lifting function of the front camera is achieved by a stepper motor, and a metal plate is covered is protected. At the fixing member, a silica gel ring for waterproof is also possible.
The screen is supported by the inner support. The screen is still separated from the internal support by heating the screen. We can see the anti-rolling mount around the screen.
Module information
The screen is a 6.63-inch 2400x1080 IPS full-scale IPS full screen, the manufacturer is Innolux, the model is PM6635JB1-1.
The post 2 megapixel macro camera, model is Sibco microelectronics SP2509, the aperture is f / 2.4
The rear 40 megapixel main camera, the model is SONY IMX600, the aperture is f / 1.8
Rear 8 megapixel wide angle + depth of field camera, aperture is f / 2.4
The front 16 million pixel camera, the aperture is f / 2.2.
Although the design of the lifting camera occupies a lot of space, the internal use of three-stage design, the overall design is rigorous, and the lifting function is achieved by stepper motor. The whole machine uses waterproof design, each open space, including a silicone ring for waterproof. The whole machine is dissipated by graphite sheet + heat dissipation silicone. (: JUDY)
5G mobile phones in the EWSETECS searches also have this 5G mobile phone ...
Vivo - NEX 3 5G
Reprinted from ewistech.
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