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    E dismantling: the tenth generation of small diamond Note10 Pro, the control cost is really

     

    In June, I entered the off-season. The flagship machine in the first half of the year has been released, and it is in the second half of the year. Recently released equipment floats in two thousand yuan, and now major brands are declared that their products have extremely cost-effective, and in small-series recent equipment, high-cost mid-range equipment. But argument, how can I miss REDMI? This creates today's dismantling sharing - the tenth generation of small diamonds, Redmi Note 10 Pro. Configuration As above, the purchase disassembly memory version is 6GB + 128GB, the price is 1699. E analysis The main IC of the motherboard: 1: Media TEK-MT6891Z- Tianzhu 1100 processor 2: Samsung-K3uh6H60BM-AGCJ-6GB memory 3: SK HYNIX-HN8T05BZGK-128GB flash memory 4: STMicroelectronicS-ST54H-NFC control chip 5: SouthChip-SC8551A- Fast charge chip 6: Media TEK-MT6635XP-WIFI / BT chip 7: VANCHIP-VC7643-62-Power amplifier 8: Invensense-ICM-42607-gyroscope + accelerometer The main IC on the back of the motherboard (below): 1: Media TEK-MT6359VPP-Power Management Chip 2: Media TEK-MT6190W-RF transceiver 3: qorvo-qm77048e- medium high frequency power amplifier 4: color temperature sensor 5: Microphone 6: AKM-AK09918C-Electronic compass When dismantling, see because Note10 Pro supports 67W fast charge, the battery has 2 BTB interfaces. When the chip is analyzed, Note10 Pro realizes the fast charge function by 2 Shanghai Nanxin SC8551A charge pump charging IC, and the charging current is up to 8A. Do you still remember? The Nanyin fast charge chip is also found in the EWSETECH. (PS: Disabled also found in the Redmi K40 game enhancement version!). Previously, the battery charging chip was basically monopolized by foreign companies such as Qualcomm, Ti, NXP, but gradually discovered more mobile phones from Shanghai Nanxin, Ruixin Micro, and other domestic charging programs. And when IC BOM of Note10 Pro, we found that it used a lot of domestic chips in the internal chip scheme, such as only the centinion, Shanghai Nanxin, Ai Electronics, Shanghai Well and so on. Be HD demolition First shut down to remove the Carto, and there is a silicone ring on the calorie to prevent dust. After the hot air gun is heated, open the plastic back cover with the leatch. The middle of the rear cover is positively posted with large-scale foams to buffer at the end of the battery and NFC. The rear end cover of the PC material is fixed by screws and snaps. The rear end cover corresponds to a large-scale graphite sheet at the position of the main board RF and the power supply chip. The antenna, the NFC coil, the rear camera cover and fingerprint identification soft board are integrated on the rear end cover. There are 7 FPC antennas on both ends of the rear end cover to form a surround antenna. The battery is fixed by easy pull-eluting paper, and the battery is slightly deformed. Remove the motherboard, panel, speaker module, coaxial and front and rear camera modules. The CPU, flash memory and power chip are included in the main board shield, and there is a heat-conducting silicon heat dissipation on the sub-board fast-filled chip. Earpters, vibrators, side key soft plates, main panel connecting soft boards, and ambient light sensor soft plates are supported by glue fixation. Among them, the ambient light sensor is hidden under the black glue sleeve. The motor is an X-axis motor using AAC. Finally, the screen is supported by the heating table and the inner support, and the inner support is attached to the large-area graphite sheet, and finally the VC liquid cooling plate under the graphite sheet will be taken. Note10 Pro uses a 6.6-inch 2400x1080 resolution LCD screen. The screen protected glass is used in Corning Gorilla Glass Victus, officially stated that 2 times scratch resistant to the sixth generation of gorilla glass, 4 times scratch than ordinary glass. The Redmi Note10 PRO machine design is simple, with 16 screws to fix, standard three-stage structure. In terms of heat dissipation, the entire machine is mainly heat-dissipated by graphite sheet + thermally conductive silicone-copper foil + liquid cold copper tube. Plastic rear end integrated FPC antenna + plastic rear cover design + TFT display selection, and effectively reduces the cost of the whole machine. The above is a dismantling sharing of Note10 Pro, more detailed analysis data shows that the EWiStech search is viewed. (The above content is derived from Ewistech Authorization)

     

     

     

     

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