One plus mobile phone 3T is a new flagship model, the machine is equipped with 6GB RAM, with 6GB RAM, the overall performance is very powerful, Ann Rabbit runs up to 16W +, in performance, there is basically no opponent . So, as a flagship machine, a mobile phone 3T does what performance is on the workman, let's take a look.
One plus mobile 3T uses three-stage full metal body design, and the screen part is fixed with the metal rear cover as the metal rear cover as the same design, and it is necessary to remove the fixed screw of the bottom when disassembled.
After screwing down the fixed screw, you can separate the screen part with the metal rear cover, but be careful when dismantling because there is a lot of fixed snaps, it is not hard!
After opening the rear cover, we can see that the most components of the phone are on the screen. There are not many devices on the back cover, where the vibration motor, the NFC coil, and the three-stage side bond are on the back cover. It is worth mentioning that there is also a heat transfer cotton on the back cover, and it is possible to ensure good heat dissipation performance while fixing components.
The motherboard part and the top of the rear cover.
The bottom small circuit board portion and the bottom of the rear cover.
Let's first remove the small circuit board at the bottom, just remove the fixed screw when disassembling. The removal process is relatively simple, but the fixed screw is a lot, it needs to be patient.
There is a fixed cable on the small circuit board to be unbtolded, and the 3.5mm headphone jack assembly and speaker components are fixed, and they are equally non-removable. The advantage of this is that there is no link between the components, even if it is fell other than the mobile phone, it will not cause looseness of the components.
The bottom small circuit board is close-up, from left to right openings, 3.5mm headphone jack, TYPE-C socket, and speaker open.
Fingerprint module close-up. After removing the small circuit board at the bottom, you can see the fingerprint module, the fingerprint recognition key is not pressed, and the phone can be unlocked at an attempt.
Also need to remove the fixed screw when disassembling the motherboard, it is necessary to note that the motherboard also has a small snap fastener to fix all the screws, need to be carefully disassembled.
Motherboard close-up. Generally speaking, the chip on the phone motherboard is protected with a fixed shield, but the shield is not detachable to a certain extent affect the heat dissipation of the chip.
And a mobile phone 3T is perfectly balance the problem between protective chips and heat dissipation through the mount and detachable shield. Further, there is also a thermally conductive silicone on the shield, and heat dissipation performance can be further enhanced.
After removing the shield, you can see the true calorification of each chip. Red: 128GB UFS 2.0 flash chip; green: audio amplifier chip; blue: high pass WTR3925 radio frequency chip; Yellow: High-pass QCA6164A wireless control chip.
The figure above shows the other side of the motherboard. The red part is Samsung 6GB LPDDR4 storage and Snapdragon 821 processor, storage and CPUs are packaged together; green: two high-pass PM8996 power management chips; blue: RF chip.
There are only two cameras in addition to the shield on the motherboard. Left: SONY IMX 298 16 million pixel main lenses; right: 16 million pixels front lens.
On the battery, the battery capacity of the mobile phone 3T is 3400mAh, and the mobile 3T has a larger capacity battery in the case where the body size is not changed, and the whole machine will continue to work.
By disassembling we can see that add 3T is still very useful in workmanship, but such work will undoubtedly increase the difficulty of production. This is nothing wrong with the road that is not pursuing quality. After all, it will never go.
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