According to Digitimes Research's data, the global IC foundry increased by 6% in 2017, reaching $ 55.6 billion, will reach a market size of $ 74.6 billion in 2022, an annual composite growth rate of 6%. According to market research structures such as IC Insights, the 2017 global integrated circuit abbot has increased by about 7% compared with 2016, it is possible to rush to $ 55 billion, an increase of 10% year-on-year. From the development of the integrated circuit abundance market in 2017, the top ten enterprises in the wafer accounted for 95% to 96% of the overall foundry market. "I am looking forward to the good future of China's semiconductor industry, and all walks of building industries. Gener hopes to become partners in China's local semiconductor industry, this is the firm commitment of M-core to the Chinese market." Globalfoundries Vice President and Gaotong, General Manager of China, said in the speech of its GTC Technology Conference Shanghai Station.
FINFET and FD-SOI are in line with the FD-SOI, 7nm steadily advanced
"With the rapid development of customers, market and applications, we will continue to develop new technologies to achieve interconnected intelligence. China is definitely one of the most important markets of the core, we will continue to bring advanced, differences in Chinese customers. The technology helps our customers grow and success. "Mike Cadigan, senior vice president of global sales and business development.
According to Mike Cadigan, with 5G is about to begin commercial, the speed of data transmission is getting higher and higher, and the phone needs to meet high speed, massive data transmission, and there is a need for different radio frequency devices. Therefore, in terms of high performance calculation requirements, the core will provide a FinFET process, from 14LPP, to 12LP, and then to 7LP. Dr. Gary Patton, a senior Vice President, Global R & D, said that the current 7NM 7LP EUV technology has active progress, and the graphic 7LP process is expected to increase by 40% more than 14 nm process, and the energy consumption is reduced by 60%. The core revealed that the commercial and popularity of EUV will be promoted according to the plan, and cooperate with the customer AMD. He frankly, EUV did face a lot of challenges, including how to further improve the yield, mask, etc., must strive to overcome the production of scale. The core is currently adopting the strategy of propulsion EUV, which does not require a mask, and the second phase is used in the first phase.
AMD second generation ZEN CPU architecture, the next generation NAVI GPU architecture will use the corner 7 nm.
On the other hand, real-time data, real-time feedback, connection cloud, accelerated innovation is a new requirement proposed by applications such as Internet of Things, but traditional processes are generally difficult to meet all requirements, especially the Internet of Things is higher for low power consumption. . For such low power cost-effective applications, the core provides 22FDX, 12FDX, etc. for the Internet of Things, mobile communication, and RF chips. Gary Patton said that 20, 22 nm has entered a quantitative preparation stage, and there are 15 Tape-outs at the end of 2018, and there are nearly 135 customers to expand in the initial contact. He pointed out that 12FDX performance has been achieved by 90%, and it is expected that it will enter the test production in the second half of 2018, which is officially mass production in the first half of 2019.
Mike Cadigan emphasizes that the FinFET and FD-SOI process route strategies will help customers meet their needs in low, medium and high-end applications. Two processes do not compete for different application scenarios, more of a complementary relationship. "In emerging application markets such as the Internet of Things, Chinese customers always have a variety of different needs, with the focus of the product, and a single technology is difficult to meet their requirements, and the two-line parallel can be established with Chinese customers to establish a sound ecological environment. "Greg Bartlett, senior vice president of M-CMOS Business Unit," With the direction of automation, automobile manufacturers and accessories suppliers are also designing new integrated circuits. The core includes the new platform AutoPro Diversified automobile platform, combined with a series of technologies and services, can meet the complexity and demand for realizing intelligent interconnection applications in the automotive industry. "
He pointed out that there are two categories of subversive trends in the automotive industry: one is electrification of the power assembly, and the other is automatic driving. China has just started in these two aspects, which will present more opportunities and as this aspect.
In addition, according to Greg Bartlett, after completing the acquisition of the IBM microelectronics, the core has been able to provide highly differentiated RF technology and has a large ASIC design / development team, of which about 150 employees are located in Shanghai, and 40 to 40 50 employees are located in Beijing. "Our ASIC business continues to grow, the number of employees is also increasing, with the most widely used ASIC design service, differentiated IP, custom chip and advanced packaging technology, providing real end-to-end design."
Actively lay out of the Chinese market, Chengdu factory is produced next year
The construction construction of the factory building in the factory in the factory has laminated more than 8 months. The first phase of the factory will be capped in early November. The progress progress is very smooth. The Chengdu Government is working with the core to establish a world-class FD-SOI industry ecosystem, which will develop bricks in the development of high-tech industries. As the Global Vice President, the general manager of China, the general manager of China, "It is not just a simple production facility, and it is a good symbol of China."
It is reported that FAB 11 (11) will become China's largest wafer factory when completed next year, and become one of China's most advanced 300mm wafer. At the same time, FAB 11 will also become the production center of the core 22FDX. The secondary FAB 11 will produce mainstream technology products of 130 nm to 180 nm, with a monthly wafer number of 200,000. By the second half of 2019, the mass production of 22FDX (FD-SOI) will be performed, and the output is expected to be 65,000 per month.
In addition to the construction of the factory, the close relationship between the core and China has been long. In FD-SOI, the core is working closely with the Chengdu Municipal Government to expand the FD-SOI ecotropic circle. It has created Chengdu into the center of FDX chip design and IP development through investment of more billion dollars. Several leading semiconductor companies have promised to jointly support ecotropic motions, including Invecas - Leading IP development partners. Invecas has been investing a lot in China, including the recent development of engineering teams in Shanghai and Shenzhen, and committed to establishing a R & D center in Chengdu to develop advanced IP and support for FD-SOI development.
The core is not only increasing investment in the Chinese market, but also provides support for Chinese customers with its leading differentiated technology. Recently, Melody 22FDX® technology has recently been adopted by three Chinese local customers. Shanghai Fudan Microelectronics Group is expected to adopt a corbet 22FDX platform, which is expected to begin design and development of intelligent products with high reliability, artificial intelligence and intelligent networks in 2018. After detailed design assessment, Rikin Microelectronics Program adopts the core 22FDX process technology. Mage 22FDX technology can meet SOC products that have higher requirements for power consumption and performance. Ruixin will use the core 22FDX technology to design ultra-low power consumption based smart hardware SOC, and also use to design high performance artificial intelligence application processor SOC. In addition, the national microphone plans to introduce low-power 22FDX technology in the development of the next-generation network chip product, and perform a formal amount of flow in the future. Can work with local customers to witness 22 nano-processes, which is an important and very meaningful moment for the core.
"Looking into the big Chinese, our existing customers cover top companies to many small companies, but when we offer more capabilities and similar 22FDX technology, more opportunities will emerge, let us have the opportunity to serve the customer before. "White farmers emphasized.
Original address: https://www.eeboard.com/news/7nm-6/
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