FTDI launches development module for ultra-high speed USB to FIFO bridge chip

FTDI introduces a new series of evaluation / development modules that support the next-generation USB interface technology. Its latest mass production UMFT60XX products use FT600 / 1Q USB3.0 Ultra-high-speed integrated chip, which has a total of 4 models, providing different FIFO bus interfaces and data bit wide. The FT600 / 1Q device parameters can be configured by these modules, and their external hardware interface is used to a general FPGA platform for sufficient assessment. The UMFT600A and the UMFT601A module size are 78.7 mm × 60 mm, which have a HIGH SPEED Mezzanine Card (HSMC) interface for 16-bit and 32-bit wide FIFO bus, and the UMFT600X and UMFT601X size are 70mm × 60mm, and also have 16 bits respectively. And 32-bit wide FIFO bus features another Field-Programmable Mezzanine Card (FMC) connector. The HSMC interface is compatible with most Altera's FPGA reference design boards, while the FMC connector is the same for the Xilinx Series Development. The UMFT60XX module is fully compatible with USB3.0 ultra-high speed (5Gbits / sec), USB2.0 high speed (480MBITS / S) and USB2.0 full speed (12MBITS / S) data transfer, and supports two parallel FIFOs from bus protocols, Access to data can reach 400 mBytes / second in the fastest. Multi-channel FIFO mode can process up to 4 logical channels. There is also a simple 245 synchronous FIFO mode. "We have long since following the system design on USB3.0, programmable logic will be more advantageous than using MCU technology, and engineering development is more easier. In addition, in addition to controlling the overall raw material costs, Multi-complex program is written. "Just as Fred Dart, the founder of FTDI chip said:" Therefore, we work closely with some development departments of some leadership, and promote this most cost and efficacy can be specifically implemented. USB3. 0 Method. These new development modules can be easily connected to the most commonly used FPGA development platform manufacturers such as Xilinx or Altera. " Related Reading: US Gao Senmei announces its high security SmartFusion2 and Igloo2 devices to get DPA logo certification Of Altera Arria 10 and proven FPGA power solutions Altera's breakthrough solution for electronic system design in 2015 Technology Day Dual output buck DC / DC controller with digital power system management function

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