The development of the 5G network will inevitably make the mobile phone market in the second half of the year will have a lot of 5G mobile phones. In fact, in early June, Xiao E purchased a 5G version of Samsung Galaxy S10 from South Korea. And Xiao E made a mistake of a camera. However, after a month of meticulous analysis, the engineer's brother finally completed this mobile phone, and the correct information was completed. Let's take a look at this 5G device with Xiao E.
Configure
The first step is naturally still to review the configuration of this phone.
SOC: Samsung EXYNOS 9820 丨 8nm LPP Process
Screen: 6.7 inch 丨 Samsung Dynamic AMOLED screen 丨 3040x1440 丨 screen account for 88.4%
Storage: 8GB RAM + 256GB ROM
Front: 10MP + 3D Depth Camera
Rear: 12MP wide-angle main photo + 12MP telephoto + 16MP super wide angle + 3D Depth camera
Battery: 4400mAh lithium-ion battery, 25W fast charge
Features: 5G mobile phone 丨 屏 超 超 指 指 指 系统 系统 系统 系统 系统 系统 系统 系统 系统 系统 系统 系统 系统 系统 系统 系统 系统 系统 系统 系统
Dismantle
After reading the configuration, Xiao E will take you a step by step to uncover the inner world of 5G mobile phones.
S10 5G The single nano-SIM calorker is used, does not support Micro SD extension, and the calorker is used for waterproof. The rear cover is a glass rear cover. Due to waterproof, the sealed adhesive adhesive adhesive between the back cover and the main unit is strong, and the hot air gun is heated to 200 degrees, and the lens is opened. The rear camera glass cover has a pressure balance film that reduces the stress to be subjected to the mobile phone by balance the internal and external pressure of the phone, and protecting the internal components from the liquid used in daily life.
One BTB interface is reserved on the motherboard, which may be used for other operators.
Remove the BTB metal cover and NFC / MST / wireless charging coil. The BTB metal cover is attached to the backlight graphite, and the NFC / MST / wireless charging coil is connected to the motherboard through the BTB interface. The S10 + and earlier generations before this are connected to the motherboard.
By taking the 8 screws, you can remove the connection motherboard and handset soft board, WiFi / BT / GPS antenna and the main antenna / speaker module.
Unscrew the three screws to remove the motherboard, sub-board and camera modules.
The motherboard has a higher cost of double-layer board, and the two motherboard spacing is 0.9mm.
Remove the mobile phone battery, the battery is fixed by a white gum, the adhesion of the gel is strong, and the removal of the battery is easy to deform the battery.
The metal antenna is then removed, but the key soft plate, headphone hole soft plate, handset, vibrator, buttons, buttons are fixed by metal sheets. There is also a heat conductive copper tube on the box, which is fixed from the previous water to "water + electric carbon fiber" to "water + electric carbon fiber" in the copper tube. The thermal conductivity is better.
Due to the waterproofability of the phone, a waterproof film is posted on the button soft board, and a waterproof rubber ring is also posted on the earphone hole.
Finally, the screen and internal support are separated by heating. Between the screen and the inner support through the surrounding circle of the cotton rubber and white waterproof strip + intermediate layer conductive tape and double-sided adhesive fixation.
The border of the left and right sides of the support is thinner, only 1.6mm, the thinnest place, and the button is 3.4 mm.
The back of the screen can see the high-pass ultrasonic fingerprint identification module, the fingerprint identification module is integrated on the screen, but it is more difficult to remove it from the screen. So if the ultrasonic fingerprint recognition module is broken, it may be necessary to replace it together.
Module information
After dismantling, it is natural to disclose more information about some main modules.
The screen uses a Dynamic AMOLED screen with Samsung 6.7-inch 3040x1440 resolution. Model is Samsung AMB666WS04.
The front camera is 10MP + 3D Depth camera.
The rear camera is 12MP telephoto + 12MP wide-angle main photo + 16MP ultra wide angle + 3D Depth camera, supports OIS anti-shake, and mainly supports F1.5 / F2.4 intelligent variable aperture.
The battery capacity is 4400mAh, and the vendor is Samsung.
Motherboard IC information
The main motherboard IC information is coming. Since this S10 5G version has a double-layer board, the motherboard is also divided into two pieces.
Motherboard 1 The main IC (below):
Red: Samsung-Exynos 9820-Barn Processor
Yellow: Samsung-K3YH7H70AM-AGCL- 8GB memory chip
Green: samsung-klueg8u1ea-b0c1- 256GB flash chip
Cyan: Samsung-Exynos 5100-5G baseband chip
Blue: Samsung-WiFi / BT chip
红: Cirrus logic-CS35L40-audio amplifier
Light red: Broadcom-BCM47752KUB1G-GNSS transceiver
Light yellow: Maxim-MAX77705C-Power Management Chip
Light green: NXP-PCA9468C-charging management chip
Youth: distance sensor
Shallow purple: light sensor
Dark yellow: STMicroelectronics-LPS22HH-Pneumatometer
Main board 1 main IC (below):
Red: Samsung-Shannon 5200-Power Management Chip
Yellow: SAMSUNG-S2MPB02-Power Management Chip
Green: SAMSUNG-S2MPB03-Power Management Chip
Cyan: STMICROELECTRONICS -STM32G071? -MCU
Blue: SAMSUNG-S2ABB02X01-Power Management Chip
红: Samsung-Shannon 5201-Power Management Chip
Light red: Samsung-Shannon 5310-Power Management Chip
Light Yellow: 2 Samsung-Exynos SM 5800-Power Adjustors
Light green: qorvo-qm78077-front end module
Youth: Light sensor
Shallow purple: AKM-AK09918-electronic compass
Dark yellow: Goertek-Microphone
Main board 2 main IC (below):
Red: STMicroelectronics-LSM6DSO-Gyro + Accelerometer
Yellow: Cirrus Logic-CS35L40-Audio Amplifier
Green: SAMSUNG-S2D0S05-Power Management Chip
Cyan: IDT-P9320S-wireless charging chip
Blue: SAMSUNG-S2MIS01X01-Power Management Chip
红: SAMSUNG-82LBXS2-NFC control chip
Light red: Cirrus logic-CS47L93-audio decoding chip
Light yellow: 2 Samsung-Shannon 5500-RF transceiver chip
Light green: MURATA-front end module
Youth: AVAGO-AFEM-9100-Front End Module
Shallow purple: Skyworks-Sky77365-11-Power amplifier
The use of logic, memory, pm, rf and MEMS chip used on the motherboard is shown in the table:
The MEMS chip information used on the whole machine is shown in the table below:
Summarize
The whole machine is fixed with 17 screws. The whole machine uses the three-stage design of the motherboard + battery + panel, and the motherboard uses a double-layer design, making the occupancy space decrease, the battery occupancy is large, and the battery capacity is greater. Waterproofing, screen, back cover, button, USB interface, earphone hole, SIM card, handset, speaker, microphone, etc. are waterproof. Ultrasonic fingerprint recognition module is small and thin than other fingerprints, but it is necessary to replace together with a screen, and the maintenance cost is higher. With a hydrocarbon cooling system, the heat dissipation effect of the whole machine is improved.
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