While S10 and S10 + are released, Samsung also released a relatively small mobile phone S10E. The same screen camera is changed to the capacitor fingerprint recognition of the side. What is the difference between this S10E and S10 + inside? Let's take a look.
Configuration list:
SOC: equipped with Qualcomm Snapdragon 855 processor 7nm LPP process
Screen: 5.8 inch Samsung Dynamic AMOLED screen 丨 resolution 2280x1080 丨 Screen accounts for 82.5%
Storage: 6GB RAM + 128 ROM
Front: 10MP
Back: 12M wide-angle main photo + 16MP super wide angle
Battery: 3000mAh lithium-ion battery
Features: Side fingerprint recognition | reverse wireless charging | IP68 dust-proof waterproof | Intelligent variable aperture | hydrocarbon cooling system | screen camera
Decomposition step:
Decomposition needs to take the SIM card to take the SIM card, and the tart is used for waterproof. The S10E is a glass rear cover, first remove the rear glass, the rear cover is strong, and the hot air is heated to 200 degrees, and the tab is opened. The rear camera glass cover is sticked to reduce the stress to be subjected to the mobile phone through balance the internal and external pressure of the phone, and the internal components are not affected by the liquid used in daily life.
Remove the WiFi / BT / GPS antenna, the main antenna / speaker module and the NFC / MST / wireless charging coil. Supports reverse wireless charging, which can be charged for other machines.
Remove the motherboard and camera module. It can be found that the light and distance sensors are high through the substrate, while the USB Type-C interface is a film-water resistant.
Remove the mobile phone battery, the battery is fixed by a white glue, the adhesion is strong, and the battery is deformed.
The handset, vibrator and heat conductive copper tube are then removed. The heat conductive copper pipe is upgraded from the previous aqueous water to "water + electric carbon fiber" to heat dissipation. The thermal conductivity is better. At the same time, the button soft plate fixed by the metal sheet is removed, and the waterproof film is posted on the soft plate, and the earphone hole is also posted on the earphone hole.
Finally, the screen and inner support are separated by heating, and the screen and the inner support are fixed by the surrounding coat and the inner layer of double-sided adhesive. There is a black plastic frame around 2.5D screen to protect the screen. After separating the screen, remove the button again. This time S10e uses a side fingerprint identification scheme, you need to remove the screen before removing. The fingerprint recognition module is fixed by plastic sheets and metal sheets.
Module information:
The screen uses a Dynamic AMOLED screen with Samsung 2.5D, 5.8 "2280x1080 resolution.
The front 10MP pixel camera under the screen, supports autofocus.
From left to right, 16MP ultra-wide angle + 12MP wide-angle main photo, which supports OIS anti-shake, and supports F1.5 / F2.4 intelligent variable aperture.
The battery capacity is 3000mAh, and the manufacturer is Samsung. Due to the fixed problem of the battery, it is easy to deform or damage the battery when self-dismantling, so it is not recommended to dismantle.
Motherboard IC information:
The main IC of the motherboard (below):
Orange: distance sensor
Magenta: Light sensor
Blue: Samsung-S2MPB03-Power Management Chip
Yellow: Maxim- MAX77705C-Power Management Chip
Red: Toshiba- THGAF8T0T43BAIR-128GB of memory
Cyan: QUALCOMM- SM8150-Qualcomm Snapdragon 855 Bad Nuclear Processor
Green: Samsung- K3uh6H6-6GB memory
Light green: QUALCOMM-WCD9341-audio decoding chip
Dark yellow: Skyworks- SKY77365-11-Power amplifier
Shallow purple: QUALCOMM-QET5100-envelope tracking chip
Light red: qorvo-front-end module chip
Shallow Yanghong: Skyworks- Sky78160-11-Front End Module Chip
Crayon green: Cirrus logic-cs35L40-audio amplifier
The main IC on the back of the motherboard (below):
Orange: 2 Goertek-Microphones
Cyan: Skyworks- Sky13716-11-Front End Module Chip
Red: 2 Qualcomm-QDM3870-Front End Module Chip
Light green: Cirrus logic-CS35L40-audio magnifying chip
Mango: MURATA-KM9206121-WiFi / BT module chip
Blue: AKM- AK09918-three-axis electronic compass
Yellow: STMicroelectronics-LPS22HH-Pneumatometer
Wax blue: light sensor
Crayon purple: STMicroelectronics - LSM6DSO-six-axis (gyroscope + acceleration) sensor
Green: SAMSUNG-S2MPB02-Power Management Chip
Dark yellow: SAMSUNG-S2MIS01X01-Power Management Chip
Shallow purple: IDT- P9320S-wireless charging chip
Light red: NXP-80T17-NFC control chip
Crayon green: QUALCOMM-PM8150C-power management chip
Shallow Yanghong: QUALCOMM-PM8150-Power Management Chip
Light purple: SAMSUNG-S2D0S05-Power Management Chip
Light brown: QUALCOMM-SDR8150-radio frequency transceiver
The logic, Memory, PM, and RF chip information used on the motherboard are shown in the table:
The MEMS chip information used on the whole machine is shown in the table below:
Summary:
The whole machine is equipped with 20 screws, screen, back cover, buttons, USB interfaces, earphone holes, SIM card, handset, speakers, microphones, etc. are waterproof. The S10E and S10 + structural differences are S10e with side fingerprint identification and 2.5D screen, and there is a black plastic border around the screen to protect the screen, while S10 + uses the fingerprint identification and surface screen, no screen. Black plastic box.
Source: ewistech
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