The market is out, the global mobile phone chip faucet Qualcomm (QALCOMM) Card RF (RF) component market sacrifice strategy has successfully obtained the first customer Lenovo / Motorola, and the power amplifier (PA), etc. of Skyworks and Lianfa The factory brings pressure.
As far as the upstream generation plant is seen, if the high-pass strategy works, and driving the RF component shipping is high, it will benefit the Subcomite Factory's stable follow-up camp; however, it is relatively unfavorable for the Skyworks Operator.
Qualcomm launched its own RF element scheme "RF360" in 2014. It was originally a PA using a semiconductor CMOS process, but last year announced that the new company named "RF360", the main TDK company name "RF360", mainly attacking the RF component. The "Gallium Arsenide Pas" launched by Qualcomm and TDK has been successfully produced this year, and the supply chain is outgoing effectively into the global PA faucet Skyworks.
The market is out, Qualcomm is the intensity and speed of expanding the market share, and the main product mobile phone baseband chip is used to bundle the subsidy method of the PA component. As long as the client purchases the baseband chip and the RF component per 1 million US dollars.
With this calculation, the average of each Pa can be crossed by $ 0.3, an over 1 US dollars, and the discount is directly between 20%, smoothly enters the Lenovo / Motorola supply chain, will be mass production in the fourth quarter; the second potential Customer ZTE is in the test phase.
The legal persons believe that once the high-pass PA component is smooth in the Lenovo camp, the upper reaches will be able to benefit.
Turning from CMOS to arsenide, high pass shock PA
Gao Tong launched its own RF element program "RF360" in 2014. It is PA with a semiconductor CMOS process. It has low cost advantages, and is manufactured by TSMC with an Old-inch factory, and then with its own mobile phone chip shipments, with other PA manufacturers Skyworks. Avago, RFMD and other PA suppliers are different from gallium arsenide (GaAs). However, because the performance of CMOS has not been effectively solved, Qualcomm starts to turn to the GaaS process this early this year.
Qualcomm is more announced with the Japanese zero component large factory TDK, intended to set up a new company "RF360 Holdings Singapore" in Singapore, where TDK's subsidiary of RF module business will remove part of the business to the establishment of "RF360", representative Qualcomm will change to the RF component layout, which has become one of the prior methods.
When STEVE MOLLENKOPF responded, "Gallium Arsenide PAS" (ie, gallium PA) that cooperated with TDK will be produced in 2017, which is a relatively appropriate time point, will be again Find suitable applications.
The legal perspective believes that with the Mollenkov said that the PA process used by Qualcomm's RF component will be turned from the current CMOS to arsenide gallium. Under this architecture, the future is bound to adjust the foundry, from the current Test 3rd , Hongjie, a gallium foundry plant.
Since Qualcomm Plan launches new gallium PA in 2017, the market is expected to find a suitable factory this year, and there will be samples at the end of the year, will be available next year.
In the era of smartphones, the number of PAs was transferred, and the number of PAs was used at least seven and eight, more than two to two more than 3G mobile phones, plus the number of 4G mobile phones in the two years, driving one Wave RF element kinetic energy.
The RF components such as House PAs are launched, and the competitors are approachable, and the components of Skyworks, Avago, RFMD and land mills are certified on the mobile phone public, avoiding long-term short-footed phenomena in the peripheral zero components.
Qualcomm is a good brand?
This solution integrates several chips of Antenna Tunner, EPT, Multiband CMOS PA (each chip is a series, facing different BAND combinations), RF POP (this is new to join the RF360 technology, should be authorized to obtain TDK technology The product later.
At this point in time (April 2017), the high-pass RF360 new generation of multimode power amplifier (MMPA) has all given the original CMOS process to turn to the performance stable gallium arsenide process, such as QPA5460. Do not consider the factors in the market and competition manufacturers, at least its performance is fully capable of meeting the needs of various mobile phones and cellular mobile communications products.
In terms of power saving this problem, the main advantage of the high-pass RF360 front-end solution (including PA and PAPM power module to PA) is in envelope tracking and with its supporting, which allows PA to work in compression mode. Non-linear zones (DPD, DIGITAL pre-distort). These are some professional concepts, there are not much pen ink. There are also other products in the market, such as Skyworks and QROVOs have known products that support ET, but because they do not use DPD in the high-pass baseband processor, these PAs are not working in compression mode, power-saving skills. Naturally, it will be different.
In addition to the power amplifier and the power supply module with its supporting, another functional module in the RF360 can really enhance the user experience is an antenna tuner (antenna tuner) system. At present, the Aperture Tuner and closed-loop impedance antenna tuner are also available in RF360, which can a large extent to solve the inefficient efficiency of similar "death" to "伫立 风雨" It is no problem.
This high-pass RF component strategy turns to a gallium gallium gallium process, which will enable the OEM, and the establishment of the company has the opportunity to benefit, as for the impact of the power of Taiwan, it is waiting to be observed.
The "Gallium Arsenide PAS" (ie, gallium PA), which is launched by Qualcomm and TDK, will be produced in 2017, which is a relatively appropriate time point, and will find the appropriate application market.
Finally, what is the signal that Qualcomm is released for those who advocate GaAS, "the end", "The end" is released.
Skyworks, feel the challenge from Qualcomm?
Original link: https://www.eeboard.com/news/qualcomm/
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