Hisense AI mobile phone H20 dismantling, dismantling difficulty is medium, and the internal structure is reasonable and solid.
The main tools used by dismantling include screwdrivers, suction cups, cladding, tweezers, heating stations, screen turning devices, etc.
First we take the SIM card.
Since the mobile phone uses a double glass design, it is mainly used to use the fitting glue, so it is necessary to heat it evenly with a heating station before dismantling it for 15 minutes.
After heating, we use the screen turning device to open a gap, then use the crowns to slowly open the screen along the screen, because the Hisense AI mobile phone H20 uses the adhesive gel component, so be extraordinary when shaking .
In order to ensure higher screen occupation, the Hisense AI mobile phone H20 places the fingerprint recognition module in the back of the body, so it is necessary to be extravagant when the body is opened, so as not to pull the cable.
There are not many components of the fuselage back shell, only one fingerprint identification module.
Hisense AI mobile phone H20 is extremely technological, the hue is black, white-oriented, and the components are shielded. The fixed screws are not a lot, the cable and layout are neat, it is difficult to imagine this is the interior of a thousand structure.
Next, the metal cover sheet fixed to the surface of the motherboard is removed using a screwdriver, and the metal cover of the Hisense AI phone H20 is a "z" font.
Then disconnect the motherboard to the battery, a deputy motherboard, antenna, a camera, and the like.
The rear double camera will be removed.
Hisense AI mobile phone H20 uses the post 12 million +5 million wisdom double-fitting, equipped with intelligent scene recognition algorithms, can intelligently identify 16 labels and 120 scenarios such as portraits, food, and scenery.
Then use the screwdriver to remove the fixed screw and take the motherboard.
It is worth mentioning that, in order to ensure the light selfie effect, the Hisense AI mobile phone H20 is also equipped with a front LED soft light.
Next, remove the front camera from the motherboard.
Hisense AI mobile phone H20 uses a combination of 20 megapixels and soft lights, and comes with wisdom and beauty. It is adjusted to each person's different facial information, supports the sound control adjustment.
Hisense AI mobile phone H20 motherboard front main components.
Hisense AI mobile phone H20 motherboard back main components.
Use a screwdriver to remove the sub-board below the phone.
The main components in the sub-board of the Hisense AI phone H20 are Type-C data interfaces, speakers, microphones, and vibration motors.
Finally, the battery is removed, and the battery of the Hisense AI mobile phone H20 is easier to disassemble, and the intermediate tape is pulled to remove the battery.
The battery capacity of Hisense AI phone H20 is 3020mAh.
Hisense AI mobile phone H20 adopts Liu Hai full-screen design, the back is the four-curved glass material, and the overall fashion is generous. Inside the body, Hisense AI mobile phone H20 layout is also very regular, and the components are highly intensive, and the main components are shielded. Hisense AI mobile phone H20 is sufficient with glue, the internal material is also multiplied, although only thousands of dollars, but there is a flagship quality. Hisense AI mobile phone H20 dismantling is medium, but because it is a glass material, the process should be extraordinary. Read more
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