Hisense H10 dismantling evaluation: 20 million big pixel beauty shoot

To dismantle the crazy 20 million pixel beauty shot Hisense H10 dismantling: external workmanship, the internal structure is clear, the components are excellent. To dismantle the crazy 20 million pixel beauty shot Hisense H10 dismantling: external workmanship, the internal structure is clear, the components are excellent. The main tools used by dismantling include: screwdriver (Pentalobe, two cutters), suction cups, cladding, tweezers, etc. First, use the screwdriver to remove two screws at the bottom of Hisense H10, which is more common in the current mobile phone design. Before we start the disassembly, we must take the card to take the card. Next, we use a hairdryer to blow the glue in the screen, then use the suction cup to open the screen, wait until the screen and the rear shell are gap, plug into the block, slowly open the phone screen. The rear shell of Hisense H10 is designed with a common full metal integrated design, which distributes intensive snaps, so it is necessary to be extravagant when shaking. The front panel of Hisense H10 is cleaned, there is no component, because it is the back fingerprint recognition, so the front panel is very refreshing. From the internal layout, Hisense H10 is designed very neatly, and important components have shield protection, and is also coated with thermal conductive silica gel on the surface. Next we have to remove the battery, but to disconnect the battery and the main board before this. The battery of Hisense H10 is relatively thin and the bottom has a tape fixed, and it is difficult to dismantle the pulled battery. The battery is very stable. Hisense H10 has 3500mAh large-capacity battery life. Using a screwdriver to remove the motherboard portion, the screw of the Hisense H10 fixed motherboard is not much, so it is relatively easy. The main panel of Hisense H10 is relatively fresh, and the main components have shield protection, which are detachable and non-removable. Hisense H10 uses a front 20 million-pixel camera, which is a 12 million-pixel Sony IMX386 camera, Selfie and camera effects are very good. (The right side is the back camera, the left side is the front camera) The main board layout of Hisense H10 is neat, the space is very reasonable, the chip surface printing text is clearly visible, and the motherboard is excellent. The main board layout of Hisense H10 is neat, the space is very reasonable, the chip surface printing text is clearly visible, and the motherboard is excellent. Let's take a look at the secondary board, the two sheets have two parts: speakers, data interfaces. The dismantling of Hisense H10 is medium, and its structure is collapsed, and the internal components are at a glance. Multiply, materials are also very particular, the shield and heat transfer silica gel are also just right, and the strength of Hisense is the strength of the old hardware manufacturer. Read more