Recently, China Satellite Navigation Positioning Association released "2020 Chinese Satellite Navigation and Location Service Industry Development White Paper". The white paper shows that as of the end of 2019, the domestic Beidou and module sales have exceeded 100 million pieces. The total sales volume of domestic satellite navigation positioning terminal exceeded 460 million units, including the smart phone sales of satellite navigation positioning to reach 372 million units. At the same time, there is currently more than 700 million terminals with a smartphone with a Terminal product society with an Beidou compatible chip. With the various breakthroughs of the domestic Beidou chip, Beidou Application is also a new stage of "standardization" development in many fields. So in the future, what will "core" plan and development in the future of the Beidou chip?
Beidou chip performance is new stairs
At present, the domestic Beidou chip has been widely used in satellite navigation, location service industry, etc., and also has a big breakthrough in technology research and development. Yang Xueying, the Sidi Adviser Intelligent Equipment Industry Research Center, believes that the development of key technologies such as domestic Beidou chips and modules has developed rapidly, and performance indicators have reached the international advanced level. At present, the 28-nanometer-process RF baseband integrated SOC chip supports the new signal of Beidou No. 3, has been widely used in the IoT and consumer electronics; the latest 22 nano-process dual-frequency positioning chip has a market-wide application condition.
At the same time, while the world's first high-precision chip is developed, the world's first high-precision baseband chip "Tianqin Second Generation" is officially released in Beijing, which represents the performance of domestic northwood chips. The last step, and the performance indicators are equivalent to international similar products. According to the "2020 China Satellite Navigation and Location Service Industry Development White Paper", as of the end of 2019, the accumulated sales of domestic Beifun Navigation chip modules have exceeded 80 million pieces, high-precision plate and antenna sales have occupied 30% and 90% of domestic market share. And output to more than 100 countries and regions.
Zhang Quande, secretary general of the China Satellite Navigation Positioning Association, also believes that the current domestic navigation and location service technological innovation continues to be active, domestic chip, module, etc., the performance indicators are equivalent to international similar products, and has formed A certain price advantage. In addition, domestic base products are further integrated with advanced technology levels in technology and performance.
Catch technology and research and development, ushered in the development of "core"
Although domestic Beifou Chips have achieved great achievements in various fields, there are still some problems and challenges in technology and research and development. In terms of technology, Zhang Quan Est believes that the domestic Beigu Chip is currently less technically accumulated in functional integration and challenges. However, the current development of Beidou Application and Industrialization has entered a new stage of technology integration, application fusion, and industrial integration. Therefore, how the Beidou chip is better integrated into mobile communication chips, integrated into the Internet of Things chip, which is critical to the development of the Beidou industry.
In the development of Beidou Chip, Ge Chen, general manager, Beijing Branch, Beijing Branch, believes that compared with the rhythm of the Expressway in the Satard System Space Section, is a short board and pain point for Beidou applications. One. At present, the Beidou Chip R & D team is smashed, and the development base is mainly civilian capital, and it is impossible to form a large scale, high level, large span upgrade and progress. This situation seriously constresses the development of industrial applications.
Functional integration is an inevitable trend
In the future, it will become more extensive in the application of the Beidou chip, and it will become higher and higher for technology requirements. At the same time, in the face of various problems and challenges, what will development began to develop? In this regard, Yang Xueying believes that on the one hand, it is necessary to further strengthen the research and development of basic products, develop Beidou compatible GPS, Gloria, Galileo Other satellite navigation systems chips, modules, antenna and other basic products, develop a growing northwood industry chain. On the other hand, we must continue to develop and improve the technical and products of the high-density navigation chip of Beidou. Break through my country's Beidou navigation chip research and development, while strengthening product and application model innovation, improving product performance, power consumption, cost and other core competitiveness.
In addition, Ge Chen said to the Chinese e-newspaper reporter that the improvement of the chip integration will be the focus of the future development of Beidou chip: "At present, the navigation positioning chip is relatively mature and cost-effective process is a 40nm CMOS process, which can be navigation positioning chip Bring low power, low cost, low risk and other advantages, the future will go to more advanced process evolution and upgrade. SOC chip integrate microprocessor on a single chip, analog IP core, digital IP core and memory, peripheral interface, etc. Advantageous integration, strong function, low power consumption, small size, can effectively reduce the development cost of electronic / information system products, shorten the development cycle, improve product competitiveness, this is also an inevitable trend of Beidou chip technology development "
At the same time, Zhang Quande also mentioned that with the comprehensive development of Beidou "integration technology, integration network, fusion terminal, and data", it will also form a new student state "Beidou +" innovation and "+ Beidou" application, becoming a country. The Construction of Integrated Temporal and Space System and Development of New Layout Core Basis and Power Sources. So the future development trend of the Big Dipper chip functional integration will be achieved through performance optimization, and converged communications, networking and various sensors, to become intelligent booster promote industrial development.
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