The engineer disassembles Nova 5Z and found that there is no American chip in it.
The engineer of the year ago, because I found out that there is no American IC in the dismantling Nova 5Z, there is no American IC to analyze the history of Huawei Chips.
Today, let's take a look at Nova 5Z more meticulous resolution. In addition to "beautifying", what is the engineer discovered in the mobile phone?
Configuration list
SOC: Equipped with Haisi Qilin 810 processor 7nm process
Screen: 6.26-inch TFT screen 丨 resolution 2340x1080 丨 Screen 83.6%
Storage: 6GB RAM + 64GB ROM
Front: 32MP camera
Back: 48MP main camera + 8MP super wide angle camera + 2MP depth of field camera + 2MP macro camera
Battery: 3900mAH lithium polymer battery
Highlight: China's domesticization of radio frequency chips
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Dismantlement step
The glass rear cover is fixed through the white rubber strip, the glue is not strong, easy to disassemble. The waterproof label is located at the position of the bottom fixed glue, and the water is red.
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The fingerprint recognition module is used as a bush technology, and is fixed to the glass rear cover by rubber. The color of the surface is consistent with the colors of the back cover.
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The motherboard cover and the speaker module are fixed by screws. Among them, there is a split tag on a screw. The speaker module has a fixed vibrator with a glue.
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General mobile phone motherboard cover is a black PC + GF (polycarbonate + glass fiber). The main board of Nova 5z is selected as a white plastic material, which is relatively rare. Be
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The main board has a large area of insulating tape. Includes a shield. Further, heat-conductive silicone is applied to the outside of the CPU position.
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The USB TYPE-C interface and the earphone hole have a jacket, which is dustproof.
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Front 32MP camera, F / 2.0 aperture.
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Rear 48MP main camera + 8MP super wide angle camera + 2MP depth of field camera + 2MP macro camera, where the main photo is Sony IMX582.
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The battery is secured by easy pull-eluting paper, and it can be pulled up by prompted. Easy to disassemble.
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The screen is fixed through a black glue. After removing, we didn't see the touch screen control chip on the screen, which may be integrated inside the screen.
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The screen uses a 6.26-inch 2340x1080 resolution TFT screen, and the screen manufacturer is Tianma, the model is TL062FVMH09-00.
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Motherboard IC information:
The main IC of the motherboard (below):
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1: QUALCOMM-Kirin 810 processor
2: SK HYNIX-6GB memory
3: Samsung-64GB flash memory
4: Hisilicon-power management chip
5: Bosch-gyroscope + accelerometer
6: NXP-audio amplifier
7: SONY-RF switch chip
The main IC on the back of the motherboard (below):
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1: Hisilicon-WiFi / BT / GPS / FM chip
2: Hisilicon-power management chip
3: Hisilicon-power amplifier
4: Hisilicon-radio frequency transceiver chip
5: Goertek-Microphone
Logic, Memory, PM, RF and AUDIO chip information used on the motherboard are shown in the table:
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The MEMS chip information used on the whole machine is shown in the table below:
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Due to this, NOVA 5Z's RF chip used a domestic chip. A small E home engineer chose the 3 power amplifier chips to do DECAP.
It can be found that these chips are integrated with power supply, antenna switch function, and a function of the power amplifier.
And these DIEs are also produced by Haisi. It can be said that it is true pure sea think chip.
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Summary information
There is no American chip in the whole machine, and the RF switch chip has chosen a plurality of Sony chips, which is not as Mate 30 Pro 5G usually uses a large number of US Qorvo chips.
The whole machine uses 11 Haisi chips. The main chips of radio frequency occupies 7, which really realizes the localization of RF chips on the 4G mobile phone, and has also achieved it in the 4G mobile phone.
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Source ewistech
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