Infineon launched a complete three-phase inverter system solution (HybridPack 2 IGBT module-based hybridkit), which reduces the workload of designers in the (h) EV inverter structure design stage, and helps them to Feifei Ling's HybridPack2 IGBT power module performance evaluates, this IGBT module is suitable for up to 80 kW inverter applications.
Development steps for inverter systems
The full structure diagram of Hybridkit for HybridPack2 is shown in Figure 1. HybridPack2 is a typical 6-tube IGBT product that supports three-phase inverters. The main matters and challenges required for design in the design are as follows:
The DC bus support capacitance employed in the inverter system provides a decoupling of power modules and batteries. Film capacitors are best suited for this application. The main parameters include the operating voltage of the capacitor, the allowed ripple voltage and the effective value current. In order to reduce stray inductances of the entire system, modules and capacitors should match each other in terms of mechanical.
In order to avoid the temperature overheating of the module, the maximum allowable temperature specified in the module manufacturer's product specification must be used for the heat loss channel for the power loss in the module. Therefore, the design of the cooling system is of great significance for achieving the best performance of the product and ensuring the service life of the product.
In order to fully implement control, monitoring, evaluation, security and protection functions on the motor control panel and IGBT drive circuit board inside the inverter, need to be fully planned and design in the first system design phase, including components, program Design and PCB circuit board + inverter high voltage circuit wiring determination, etc. Good layout ensures good electromagnetic compatibility and reserves sufficient electrical gaps and climbing distances. In addition, software development, testing, and debugging are required.
All in all, the inverter system is an important core component of (h) EV, and it is necessary to vigorously build the system.
Parts and features of Hybridkit and HybridPack2
Hybridkit (Figure 2) fully considers the above design challenges. It is a system solution for customer carefully designed to customers, allowing customers to easily and quickly complete inverter development and structural design of the entire (H) EV. Go to HEV. Since Hybridkit can make customers quickly evaluate various key parameters, it helps customers reduce product development cycles. Hybridkit is more than just a reference design, but also supports early system testing (for example, Hybridkit is included in hardware in the HIL system) or to get system testing in the initial prototype phase.
Infineon's IGBT Power Module HybridPack2 (Figure 3) and module-based Hybridkit can meet special operating needs of automobiles, including thermal cycle stability, power cycle stability, etc. During the development of the HybridPack module series, we have improved significantly for the following two aspects: the connection of the chip surface bonding line (Bonding Wire Binding line) and the solder joint between the substrate and the substrate (IGBT copper bottom plate and). Therefore, most water-cooled systems can meet HybridPack heat dissipation requirements. HybridPack2 is designed to meet 80KW driver requirements. All power semiconductor devices required for the inverter in HybridPack2 and three NTC (negative temperature coefficients) resistors for temperature measurement. The module has a maximum operating knob temperature of 150 ° C, which contains a six-cell structure composed of a three-generation trench field terminating an IGBT (insulated gate bipolar transistor) and a septic diode that matches there. The maximum rated current and voltages of HybridPack2 are 800A and 650V, and there is a minimum in parallel conduction and switching losses.
The second module of Hybridkit includes a DC bus support capacitor B25655J4507K (EPCOS manufacturing), which matches the electrical and mechanical aspects, which can achieve compact design and low stray inductance. After adjustment and testing, ensuring that the capacitor fully meets the requirements of HybridPack2.
We provide water-free parts for applications that require higher power or higher operating temperatures. The water-cooled member can be directly secured to the IGBT module, and an integrated rubber pad is added to the middle, and the appropriate sealing effect can be added. All design parameters are optimized to ensure compact shape, optimal cooling effects and longer service life.
The module uses two independent PCBs to perform board design in accordance with the most advanced design rules, specifications and standards, including: IGBT drive circuit board and MCU control board. The six-channel IGBT driver board is optimized in electrical and mechanical aspects to meet the requirements of HybridPack2. The drive plate has the following main functions: IGBT drive power supply DC-DC power supply to ensure electrical isolation between six different IGBT drivers (1ed020i12-Fa, UFC-based driver-free magnetic transformer technology) DC bus voltage detection with electrical isolation (input to protection / monitoring); temperature measurement by NTC elements; active clamp diodes for short circuit protection; each IGBT driver is individually equipped with separate push-pull output power Enlarge the circuit to increase current drive.
The logic circuit board includes all components required to control the driver plate. In addition, it provides interfaces between all other components necessary to constitute a complete inverter system, including: motor interface (encoder and rotary modulator), current sensor interface, communication (CAN and RS232), and additional simulation and Digital input / output interface. Using the Yingfine board microcontroller (TC1767), various protection and monitoring functions, drive control, and evaluation of HybridPack2 performance can be easily implemented by software. Sample software for these features is being developed.
Hybridkit for HybridPack2 is both a reference design and a great tool for developing a three-phase inverter system. It not only supports hardware testing and measurement (ie short circuit, temperature, etc.) and supports software development. It contains all components necessary to constitute a complete system, and provide interfaces (motor interfaces, current measurements, and communication interfaces) connected to other external components. Stop-supplied documents, including part lists, circuit design, and layout data, etc., allowing customers to start the development of the EV system as soon as possible. Technology area
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