The first model is equipped with the glory of the Qilin 820 5G, the first sells a second of 100 million. At this point of this very much attention to the screen of the screen, use the glory of the LCD screen 30s, but it still has a very extraordinary market reaction. Why is it?
E analysis:
Kirin 820 5G's performance is not to say more, the performance of the whole machine is nature is not a SOC, but also depends on the supporting IC, and the glory 30 S which matching chips? Let's take a look at the motherboard.
The main IC of the motherboard (below):
1: hisilicon-hi ****** - Wi-Fi, Bluetooth, GPS, FM and infrared transmission 5 in 1 integrated chip
2: Micron-8GB memory chip
3: hisilicon-hi6290L-Kirin 820 5G chip
4: SANDISK-SDI ***** - 128G-128GB flash chip
5: NXP-TFA ***** - Audio Amplifier Chip
6: hisilicon-hi **** - Power Management Chip
7: hisilicon-hi **** - Power Management Chip
8: stmicroelectronics- ism ***** - six-axis accelerometer and gyroscope chip
The main IC on the back of the motherboard (below):
1: hisilicon- hi **** - Power Management Chip
2: hisilicon-hi **** - RF transceiver chip
3: hisilicon-hi **** - RF amplifier chip
4: hisilicon - hi **** - RF amplifier chip
5: AKM-AK ***** - Compass chip
In addition, numerous MEMS chips are used on the whole machine.
For 1111 components of glory 30 s, Ewistech made detailed finishing and removing Ewistech. Will the internal construct not disappoint consumers?
Dismantle
Glory 30s side metal Catto front There is Chinese logo to prevent accidental, and have a red film for waterproof. A white sealing adhesive is fixed between the double-curved glass rear cover and the body.
The rear camera protective cover is fixed with a white sealing rubber. The inner side of the glass rear cover is attached to the graphene cooling film and the bubble buffer pad.
The NFC induction coil, the graphene hot film, and the flash plate are attached to the motherboard cover, but the flash sheet is fixed to the inside. A graphene heat absorbing film is attached to the surface of the sound speaker module.
The rear camera bottom mounting bit and the front camera lens fixing position have a reduction of shock absorbing materials. The motherboard shield surface is attached to the hot copper foil, the headphone interface and the USB TYPE-C interface are equipped with silicone dust jacket. On the right side of the bottom, a separate antenna board is linked to the motherboard with a coaxial line.
The main, the sub-plate is connected by the FPC soft board and the coaxial line. The motherboard shield surface has a yellow heat sink, and there is a heat dissipation silicone in the position of the main control chip.
The battery is fixed with double-sided viscous plastic film, a lithium-based battery, a battery model: HB466483EEW, is provided by Des. Electronics production, using ATL battery.
FPC soft board, the vibrator is fixed by double-sided colloid, respectively, and the surface of the vibrator has a foam material on the surface of the vibrator. The top earpiece and ambient light distance sensor plate is attached to the foam glue.
The screen and the middle box are fixed with a glue, and the graphene heat dissipation material is posted on both sides. There is a layer of anti-rolling landing between the box and the screen.
It is well known. The glory 30 S screen uses a 6.5 inches, 2400x1080 resolution IPS tights full screen.
64MP lens uses Sony IMX682 CMOS sensors, 6-piece lens;
8MP telephoto lens adopts HOWTS OV7563 CMOS sensor, 5-piece lens;
In addition, the CMOS information of the two lenses will go to the Ewistech search!
Overall, glory 30s use three-stage layout assembly, and the components use modular design, and the rear camera uses a separate module with a roll rack. A multi-piece graphene cooling film helps mobile phone heat dissipation. The equipment is relatively high, and the use of Qilin 820 5G chip has effectively controlled 30s cost, which has indeed increased market competitiveness. I want more detailed IC BOM stamp ewistech searches! (Edge: ashely)
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Reprinted from ewistech.
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