Infineon Technology Co., Ltd. (FSE: IFX / OTCQX: IFNNY) recently released a transceiver product line that replaces more than ten independent devices to simplify system design and production work. Due to the lower power consumption, this highly integrated monolithic transceiver can also help reduce the fixed cost of the high data rate millimeter wave wireless return communication system. New products are wireless data links between LTE / 4G base stations and core networks over 1Gbps.
The Britthing BGTX0 device adopts a standard plastic package, and a chip can replace more than ten discrete devices used in existing system design. It can greatly simplify assembly processes for customers who continue to use standardized SMT patch assembly process.
The BGTX0 product line is equipped with a radio frequency front end facing a wireless communication system with 57-64 GHz, 71-76 GHz or 81-86 GHz millimeters. In addition, the system solution also integrates baseband / modem functions, which reduces the space for board space, enhances the reliability of critical wireless backhaul links required to support LTE / 4G networks, and reduce their cost.
Philipp Von Schierstaedt, Vice President and RF and Protection Device Traffic Line, and the Voli-General Manager of the Transferring Device: "V- and E-microwave bands available for LTE / 4G backhaul transmission, supportable data rates are equivalent to the three previous generation networks Time. Accordingly, they require extremely high radio frequency performance to cater to the operational demand. By launching new transceiver products, Yingfine fully utilizes its advanced process and radio design expertise, help system designers reduce complexity, simplify production Work, ultimately improve the quality of its backhaul transmission solutions and on-site reliability. "
The BGTX0 transceiver integrates all RF components on a small chip, including the I / Q modulator, a voltage controlled oscillator (VCO), power amplifier (PA), low noise amplifier (LNA), programmable gain amplifier (PGA), SPI control interface, etc., an embedded wafer-stage ball grid array (EWLB) package. In the production process, the built-in self-test (BIST) can be utilized to verify and calibrate RF performance, which helps to simplify the process of loading chips into the final product of the equipment manufacturer on the production line.
Excellent RF performance of the SiGe process - including power amplifiers up to 18 dBm output power, low noise amplifiers as low as 6 dB, and VCO superik, which is better than -85dBC / Hz (100 kHz offset), allow system design Personally achieve high-order modulation schemes, such as QAM64 of 500 million signal samples per second, or when the bit error rate is 10-6, the sampling rate reaches billion QAM32 of a total of billion signal samples per second. The device's electrostatic protection (ESD) performance exceeds 1 kV, enhances robustness of customer system design, and simplifies design tasks. The backhaul transmission transceiver product line power consumption is less than 2W, which reduces the power cost of network operators. This series of products uses a direct conversion architecture that greatly simplifies the interface design between radio frequency and baseband compared to the current discrete millimeter wave system.
In addition, system vendors can also benefit from the quality and reliability of SIGE IC production processes in the UFC.
Supply
The engineering sample of the BTGX0 product line will be launched in September this year, and the bulk production plan begins at the end of the year.
For more information, please visit www.infineon.com/backhaul.
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