28nm
Because of cost-effective upgrade it has long been considered central to Moore's Law, the rising cost 20nm process the following issues once considered a sign of Moore's Law begins to fail, and 28nm process technology as the most cost-effective, has a long life cycle .
In the case where the design cost is continuously rising, only a few customers can afford to turn to the high-end node. According to Gartner, the average IC design cost of 16 nm / 14nm chip is approximately $ 80 million, and the 28NM silicon process device is approximately US $ 30 million, and the design of 7NM chips takes $ 271 million. The IBS data shows that the design cost of the 28NM silicon device is approximately $ 51.3 million, while the 7nm chip takes 298 million US dollars. For most customers, the FinFET process turned to 16 nm / 14nm is too expensive.
In terms of unit chip costs, 28 nm is obvious, will maintain a longer life cycle. On the one hand, there is a significant advantage over the frequency adjustment, power consumption control, heat dissipation management, and size compression compared to 40 nm and earlier. On the other hand, since 16 nm / 14nm and more advanced processes use FinFET technology, maintain high-parameter yield and low-deficient density difficulty increase, each logic gate cost is higher than 28 nm.
The 28 nm is between 32 nm and 22 nm, and the industry introduces the HIGH-K value insulating / metal gate (HKMG) process at the earlier 45 nm stage, and introduces the second generation HIGH-K insulating layer / metal gate process at 32 nm. These gradually matured of 28 nm. In terms of advanced technologies, FinFET (fin field effect transistors), etc. are started from 22 nm. It can be seen that 28 nm is in the key point of the transition of the process, which is an important reason why it is cost-effective.
At present, the 28nm process in the industry is mainly competitive between TSMC, GF (Mn.), Samsung and SMIC. In addition, the end of 2018 announced the quantity of the Lianxiao's 28nm chip's Huahong's Hello Microelectronics. Also began to join the competition.
Although the high-end market will be 7nm, and 14nm / 16nm process occupy 10nm, but 40nm, 28nm and so on and not quit. For example, 28 nm ~ 16nm process is still an important part of TSMC revenue, especially in mainland China, the foundry, is the main 16nm. SMIC is continuously increased by 28 nm.
14 / 16nm
The 14nm process is mainly used in medium and high-end AP / SOC, GPU, miners ASIC, FPGA, automotive semiconductor, and the like. For each manufacturer, the process is also the main source of income, in particular Intel, 14nm is its current main process technology, with the company's volume, it is impossible to know. For China's mainland China's wafer plant, especially SMIC and Huahong are developing 14nm process technology, and the mass production time is not far away.
At present, there are still 7 manufacturers with or will have 14nm process capacity, namely Intel, TSM, Samsung, Melody, Union, SMIC and Huahong.
The same is 14nm process, because Intel strictly pursues Moore's law, the level and striogramid of its process is the highest, as far as the currently released technology, Intel continuously updated 14nm process with TSM 10NM 10 nm.
In May of this year, Intel said that it will increase 14nm process capacity in the third quarter to solve the shortcomings of the CPU market.
However, Intel's own 14nm capacity has been fully loaded, so the company has invested $ 1.5 billion, used to expand 14nm capacity, which is expected to increase production in the third quarter of this year. The 14nm process chip is mainly produced in the US Arizona and Oregon D1X Wafer Factory, and the overseas 14nm Wafer is located in Fab 24, Ireland, and is still upgrading 14nm process.
Samsung, the company announced the official production of 14nm FinFET process in 2015, which has been distributed over high-end mobile phone processors for Apple and Qualcomm. At present, its 14nm capacity market share is second only to Intel and Terminal.
TSMC was produced in the second half of 2015. Compared with Samsung and Intel, although their nodes are different, Samsung and Intel are 14nm, TSM is 16NM, but is in the same generation in the same generation in the actual process technology.
In August 2018, Melody announced the discovery of 7nm LP process to invest more resources to 12nm and 14nm process.
The core has made two process road maps: First, FinFet, this company has 14LPP and new 12LPP (transition version of 14Lpp to 7LP); Second, FD-SOI, the core is currently producing 22FDX, 12FDX will be released when the customer needs.
UMC, 14nm process which accounted for only about 3%, which is not the main production line. This is directly related to the company's development strategy, and the focus of the focus of the company, whether it is the 8 吋 factory, or 12 inch factory, the company focuses on a variety of new special processes.
SMIC, the 14nm FinFET has entered the customer test stage. In 2019, the Shanghai factory was put into new equipment in the second quarter of 2019. The plan will enter the mass production period in the second half of the year. In the future, its first 14nm process customer is likely to be a mobile phone chip manufacturer. It is reported that in 2019, SMIC's capital expenditure was raised from $ 1.8 billion in 2018 to $ 2.2 billion.
In the SchMicon China 2019 Advanced Manufacturing Forum in the beginning of the year, Shao Hua, Vice President of the company, said that Huayi Microelectronics will mass produce 28nm HKC + process at the end of this year, and mass production is 14nm FinFET process at the end of 2020. .
12nm
From the current wafer foundry market, there are very few manufacturers with 12nm process technology, mainly include power grids, core, Samsung and Union. Uploaded in 2018 announced the development of 12nm and more advanced process technology. Therefore, in the current point of view, the world's wafer foundry market, the main players of 12nm are TSMC, CHI and Samsung.
The 16nm process of TSMC has experienced the three generations of 16nm finfet, 16FF + and 16FFC. After entering the fourth generation 16nm process technology, at this time, TSMC changes strategy, launched a revised process, which is 12nm technology, to attract more customer orders, thus Improve the capacity utilization of the 12-inch wafer factory. Therefore, the 12nm process of TSMP is its fourth generation 16nm technology.
The R & D of the company announced in 2018 with the R & D of the 10nm and more advanced process, so that the company's most advanced process is 12nm. The company is divided into two legs, namely FinFET and FD-SOI, which is fully embodied in 12nm process, in terms of FINFET, with 12LP technology, and 12FDX in FD-SOI. 12LP mainly applies to applications such as artificial intelligence, virtual reality, smartphone, network infrastructure, using Melody's professional technology in FAB 8, New York, Sarao County, New York, has been in large-scale production cores since the beginning of 2016 14nm FinFET product.
Since many connection devices need to be highly integrated, it requires more flexible performance and power consumption, and this is difficult to implement, 12FDX provides an alternate path that can achieve lower power than FinFET products, lower cost. And radio integration is better.
Samsung, its wafer foundry path map is not 12nm process, only 11nm LPP. However, the 12nm LP of Samsung's 11 LPP and the core is actually a "teacher's entry", which is a product of three-star 14nm improved, the transistor density is not changed, and the effectiveness has increased. Therefore, the 12nm LP of the core has a lot of common situations in the 12nm process of Samsung, which may also be one of the reasons for AMD to find Samsung OED 12nm products.
SMIC, not only 14nm FinFET process has entered the stage of mass production risk customers, and in the first quarter of 2019, 12nm process technology to develop its customer enters the import phase, the second generation of FinFET N + 1 R & D breakthroughs, progress than expected, At the same time, the FinFET factory in Shanghai Zhongxin southern Shanghai successfully completed and entered the production stage of production capacity. This means how long it doesn't take, a new 12nm process player will kill the war group.
10nm
At 10 nm nodes, the industry players only replace the power, Samsung and Intel.
In general, TSMC is still leading, and typical products are A11 processors for Apple OEM in 2017. And Samsung is also followed by the pace, at 10 nm, the progress of both parties is not large, but the overall level, TSM still slightly wins.
This year, Intel's old opponent AMD has turned over, with the 7nm Ruilong 3000 series processor of the platform, allowing AMD to transcend Intel in the CPU processor's process technology.
At present, Intel's mainstream process is 14nm, but the news will soon come back, after many years of research, the company finally solves the technical problems of the 10nm process and has begun to mass production.
However, Intel's rigorous pursuit of the process node is worthy of, from specific performance indicators, especially PPA and transistor density, Intel's 10nm is more advantageous than 10 nm of Terminal.
7nm
At 7 nm, there is only a TSM and Samsung two, and Samsung's mass production time is obviously lagging behind TSM, which makes Samsung have to cross 7nm, directly 7nm EUV, which makes 7nm like Apple, Huawei, AMD, and Ying Weida. The process of large customer orders is almost all taken by Tajimad. Under this predecessor, the 7nm capacity of TSMP should have a little indispensable. In terms of 7nm EUV mass production, TSMC has also ahead of a step. The Huawei Kirin 990 has been commercially used. The high-pass new generation processor of Samsung 7nm EUV is also produced. It is estimated that it will be available soon.
In terms of 10 nm, the company claims to launch a 7nm process in 2021. It is reported that its 7nm craft has already stepped on the right track, and the power consumption and performance look very well. According to the previous news, the 7nm craft will be 2021 The data center is started on the GPU.
Conclusion
The above, the development of the mainstream advanced process technology, the development of the mainstream advanced process, and the progress of the relevant manufacturers have been explained. More advanced 5nm, 3 nm, 2 nm, etc. have not yet entered the mass production period, and they will not be detailed. These process nodes have already raised players. At present, there are only two TSM and Samsung, TSME will be 5nm in next year, and Samsung seems to be 5nm, directly 3 nm.
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