China's LED package industry has increased from 25 billion yuan in 2010 to 28.5 billion yuan in 2011, and the output is increased from 13.3 billion in 2010 to 18.2 billion in 2011. Among them, the highlighted LED output value reached 26.5 billion yuan, accounting for more than 90% of the total sales of LEDs.
In 2011, the core technology, talent training, standard system and abduction of my country's semiconductor lighting energy-saving industry still exists, coupled with unordered competition between enterprises and blind investment, some companies have closed down, so that the LED industry has not continued 2010 The good momentum of the year has entered the transformation of competitive mode and the new stage of industry pattern reforming. But even so, my country's LED lighting industry is still one of the rapid development of global development, initially forming a situation with Japan and South Korea and South Korea.
Technical level is greatly improved
After introduction, absorption, digestion, and improvement, some companies' package technology has reached the international advanced level.
Although China lacks original package technology, after introduction, absorption, digestion, and improvement, some companies' LED packaging technology have been comparable to internationally advanced LED packages in some areas. With domestic chip, small power chip is encapsulated into white LED, and the light efficiency can be up to 30LM / W ~ 150LM / W; the power chip is encapsulated into white LED, and its light efficiency can reach 100LM / W ~ 110LM / W, and imported chip package LED light effects can reach 135LM / W or more.
With the continuous improvement of domestic LED chip, many innovations in the package process, domestic LED companies have gained better product performance through joint innovation. At the end of 2011, San'an Optoelectronics, Fujian Wanbang Optoelectronics Technology Co., Ltd., China Academy of Sciences, Haixi Research Institute and Sichuan Xinli Guangyuan Co., Ltd. jointly issued a super high-efficiency LED daylight tube that co-innovative and developed, which has realized mass production. The light is 150LM / W, the color development index is 70.5, the power factor is 0.8, and the release of the LED daylight tube 140.1Lm / W through the LED Tank 140.1Lm / W in September 2011. And the product adopts a Haixi Institute and Wanbang Optoelectronics having an autonomous intellectual property, as well as high-efficiency phosphors prepared by San'an Optoelectronics Preparation.
COB package into development trend
At present, the COB packaged bulb lamp has occupied a market that is about 40% of the LED bulb.
With the gradual maturity of the LED application market, users have more and more reliability, especially under equivalents, especially in equivalents, requires better energy efficiency indicators, lower power consumption, and more competitive Force product price. It is based on that, compared to traditional LED SMD packet packages and large power packages, the board chip (COB) integrated encapsulation technology is directly packaged directly on a metal-based printed circuit board, as a lighting module via the substrate. Direct heat dissipation can not only reduce the manufacturing process of the bracket and its cost, but also has the cooling advantage of reducing thermal resistance, so it is a LED lighting module package technology for many large manufacturers.
The COB package is paired with the same LED chip particles as the electrical parameter, and the LEDs of the N particles are bound to the aluminum substrate or ceramic substrate by the COB packing process flow through the COB package process process to become a new LED light source mold. Group.
At present, the COB packaged bulb lamp has occupied a market of about 40% of the LED bulb. Many domestic companies have begun to take the COB package mode. Industry insiders predict that COB packages will become an inevitable trend of future development.
In addition to heat dissipation performance, COB Light can perform personalized design. However, in the technical, the COB package still has insufficient light failure, short life, and poor reliability. If it can be resolved, it will be one of the leading directions of future packaging development. Technology area
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