Lenovo Saved Electric Skills PRO Published on July 22, the configuration information is organized, it is not difficult to find, this is a "biano" classmate.
This is a very person-made game mobile phone, dual speaker, double linear motor, visible to the use of mobile game enthusiasts, symmetrical design, we have seen it. The internal five-stage design is still not coming to see?
The small E started this 8GB RAM + 128GB ROM, the following disassembly data is subject to disassembly equipment.
Dismantle
First shut down to remove the Catto, and did not see the silicone ring on the calorie.
The rear cover is fixed by a glue, and the rear cover is heated and the inner support gap is heated, about 190 ° C. You can turn the rear cover, and there are graphite hot stickers above the two batteries. The rear cover corresponding to the two batteries is also posted, which can be protected.
The dismantling of the inner support is more complicated, and is fixed using a snap and screw. After you unscrew the screw, you need to open it from the front end. When you open in the box, you should also pay more attention to time-off the shoulder wire and the front camera cable.
Remove the internal support, remove the donor, double vibrator, NFC coil, and front lifting modules. The front photo is to achieve lifting function through the stepper motor, and the side key soft plate has a plastic cover for protection.
The box is broken, and the cable is disconnected. Remove the main board, RF plate, antenna plate, sub-plate, radio frequency coaxial line and other components.
The motherboard is fixed by four studs, and it is unplugged with the mouth. Mid-frame liquid cold tube position There is a large area of silicone for heat dissipation, and the top antenna is attached to the tape fixed, and the sub-plate USB interface has a silica gel cover waterproof effect.
Because the double battery and the racemat are taken in front, the internal area is reduced. The RF plate is placed above the motherboard and is connected by a cable.
The battery is fixed to the middle frame through the double-sided adhesive, and the soft plate is fixed by a conductive tape, remove the dual battery and two soft plates.
The screen and the inner support pass the glue fixation, heating the screen heating the screen, about 80 ° C, separating the screen with the inner support.
The liquid cold tubes and copper sheets are covered with heat dissipation in the stone ink, and the area is large.
From the internal structure, the Lenovo Save PRO uses five-way design, very rare. From top to bottom, the earpiece, battery, motherboard, battery, speaker & panel. The advantage of placing the motherboard in the middle position is that the two-hand grip position can just avoid the mobile phone. The Lenovo Save the electric energy mobile phone PRO using a dual liquid cold tube + copper plate + heat dissipation silicone-lipid + graphite sheet. The whole machine is ingenious, the structure is stable, and the dismantling repair is difficult.
IC information on the motherboard also wants to find out:
The main IC of the motherboard (below):
1: QUALCOMM-SDX55M-5G module chip
2: QUALCOMM-PM *** - Power Management Chip
3: Samsung-k **** - BGCN-8GB memory chip
4: QUALCOMM-SM8250-Qualcomm Snapdragon 865PLUS processor chip
5: QUALCOMM-SDR **** - RF transceiver chip
6: Invensense-ICM - **** - Hexaxia Acceleration Sensor + Gyroscope Chip
7: QUALCOMM-WCD **** - Audio decoder chip
8: QUALCOMM-PM **** b-power management chip
9: TI-BQ ***** - Fast charge chip
The main IC on the back of the motherboard (below):
1: Skyworks-Sky55242-11-Front End Module Chip
2: QUALCOMM-QCA6391-WiFi / BT chip
3: QUALCOMM-PM **** A-power management chip
4: Samsung-Klu **** - 128GB flash memory chip
5: QUALCOMM-PM **** - Power Management Chip
The main IC of the radio frequency board (below):
1: QUALCOMM-QPM6585-RF power amplifier chip
2: QUALCOMM- QPM5677-RF power amplifier chip
3: QUALCOMM- QPM **** - RF power amplifier chip
4: NXP- SN **** - NFC Control Slices
5: qorvo- qm ***** - front-end module chip
6: qorvo- qm ***** - front-end module chip
The main Ic on the back of the radio side (below):
1: QUALCOMM-QDM **** - front-end module chip
After a whole machine disassembly, Lenovo saves the electricity mobile phone PRO total of 1800 components, and the material cost is estimated to be approximately $ 250.2, where the main control IC part accounts for 43.2% of the total cost. The BOM of the whole machine can search "Lenovo Saved E-sports" in ewistech.
There is also the following game mobile phones in the Ewistech search.
Red Magic 5G
Black shark 2
And the following shaped design
Soft folding mobile phone
Samsung Galaxy A80 (flip camera)
Reprinted from ewistech.
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