Lomid in R & D 2300PPI miniature OLED display

Lomid, which was selected in the EU H2020, launched in January 2015, is the responsibility of the scientist of Fraunhofer Fep. The project aims to develop a new generation of large-area OLED micro-display, mainly for virtual reality and enhanced realistic applications. The project will last until the end of 2017. The partner of the Lomid project is a flexible OLED micro-display screen for ultra-large (1321 mm). The screen diagonal is 24.9mm, and the acceptable output rate exceeds 60%. They want to develop a strong silicon chip design, supporting high resolution (12001920 - widescreen) with a pixel size (12001920 - widescreen), pixel density is 2300 ppi, and a very reliable manufacturing process for the backplane. Be Mike Thieme, one of the X-Fab project manager of Lomid project partner, said: "(we) develop affordable processes in the CMOS silicon process (for example, 0.18 and 0.35μm lithography), and pay special attention to the top metal of the CMOS backplane The electrode and the interface between the OLED layers. In order to maintain the low cost of CMOS manufacturing, many design rules have been limited. " They will also solve challenges such as OLED micro-display adaptability by implementing a 50mm bending radius. In addition to these new features, the durability at the time of the device must be guaranteed and is equivalent to the rigid device. To this end, they will improve the robustness of OLED and to change the equipment packaging to simultaneously meet the strict barrier requirements (water vapor transmittance "10 -6 g / d m 2) and provide sufficient mechanical protection. Lomid project partners include X-Fab, they will produce the CMOS backplane wafers of the OLED micro-display; these micro-displays will be displayed by the Limbak SL application in the virtual reality header; research institutions CEA-Leti will be developed Fraunhofer Fep focuses on the integrated circuit design of backplane wafers; Leipzig University will be committed to the development of inorganic transparent FET materials; Amanuensis is assisting organizations to coordinate, promotion, and publicize activities. Dr. Beatrice BEYER will explain the latest developments in the SID-ME Spring Festival in Dresden, Germany, March 13-14, 2017. Technology area Future flexible OLED panel development status package and bending reliability is still a key issue Apple will develop the display will develop a next-generation microled Is AMOLED Detailed _Amoled Detailed (Principle, Structure, Process) Skyworth OLED TV technology breakthrough _launch OLED TV in future form Amoled flexible screen is much thorough than that of smart homes.

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