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    Mate 30 Pro 5G Disassembly Analysis: How long does it take for 5G mobile phones from the pure domestic device circuit after Huawei 251 incident?

     

    14 of the 21 antennas for 5G Mate30 Pro 5! Demy secret unicorn 990 5G and unicorn 990 difference, look at the real supermatition Leica film. Review the configuration, let's explore the internal charm of this phone. Configuration list SOC: Haisi Kirin 990 5G processor 7nm + EUV process Screen: 6.53-inch Super Amoled surface screen 丨 2400x1176 resolution 丨 screen accounting for 94.1% Storage: 8GB RAM + 256GB ROM Front: 32MP camera + 3D deep sense camera + attitude sensor Rear: Rear 40MP wide-angle main photo (support OIS) + 40MP movie camera + 8MP telephoto (support OIS) + 3D deep camera Battery: 4400mAh lithium polymer battery Features: IP68 dust-proof waterproof | 3D deep sense camera | attitude sensor | 40W wired fast charge and 27W wireless fast charge Dismantlement step The stacked calorie has a rubber ring, ensuring space while ensuring waterproof. The rear cover is made of glass, secured to the host, and a large-scale bubble, which is buffered. Both the top antenna module and the bottom antenna module are fixed by screws, and some screws have a warp tag. NFC and wireless charging coils are fixed to the antenna module by rubber. Since the screws have been removed, the motherboard, the soft plate of the main panel is connected, and the rear camera to the motherboard, and the metal cover of each BTB interface can be removed. We can finally see that this block is used for the motherboard design. Huawei Mate30 Pro 5G is the first time in the mobile phone for the first time (Double-layer board design is not used on MATE 20 X 5G), and two motherboards are 1mm. Double-laminate design is not particularly special in the 5G mobile phone. However, on the MATE30 PRO 5G, there are also two places that also use a double sheet structure, and the first block is to place two chips for implementing the wireless charging function. Another piece is a small plate of BTB, the main function is to form a high low difference to the BTB interface next to side, thereby facilitating the cable layout. Remove the rear camera module, front camera module, flash soft plate, and light distance sensor soft plates from the motherboard. After the rear camera is fixed after the motherboard, the four corner cards are supported, prevent shake, and there is red glue cover to fix and protect the sleeve. USB TYPE-C soft board, panel, speaker module is fixed by screws. The two coaxial wires on the side are fixed in the groove. Since the waterproofing of the whole machine, the waterproof rubber ring at the openings of the interface and speaker is essential. The microphone is also waterproof by waterproof film, and a waterproof label is also posted at the SIM Cardo location. Remove the resonance speakers, linear motors, fingerprint identification modules, and infrared light boards. Button soft plates are fixed by screws. The resonance speakers are fixed by screws and adhesives, with the screen, drive the screen vibration, resulting in sound, linear motor below the resonance speaker. The battery is fixed by a easy pull handle to facilitate disassembly. Finally, the screen and internal support are separated by heating. There is a foam glue at the surface of the screen and the non-surved surface, which is used to improve the waterproof performance of the whole machine. The on-one side of the left and soone is thinner, only 1.3mm in the thinnest, and the button is 2.7 mm. The whole machine is cold cooling through the copper pipe. The heat dissipation copper tube is supported under the frontal graphite sheet. Module information The screen uses Samsung 6.53 inch 2400x1176 resolution Super AMOLED surface. The cost is expected to be $ 61.5. The three cameras are a module, which is 32MP front camera, 3D deep-sensitive camera and attitude sensor, where the attitude sensor enables the AI ​​empty control function, and the 3D deep sensation is a 3D face unlock. Function and precise depth of field information at your selfie. The three cameras are Sony, and the total cost of the total module is about $ 16.5. Rear 40MP wide-angle subject (support OIS) + 40MP movie camera + 8MP telephoto camera (support OIS) + 3D deep sense camera. In addition to the 8MP telephoto camera is OV production, the other three are Sony. The total mode price is about 56.2 dollars. Motherboard IC information Motherboard 1 The main IC (below): 1: hisilicon - Kirin 990 5G processor chip 2: Micron-8GB memory chip 3: TOSHIBA-256 flash chip 4: Hisilicon -wifi / BT chip 5: Invensense- gyroscope + accelerometer 6: BOSCH-Pneumometer 7: hisilicon-audio decoding chip 8: Hisilicon-power management chip Main board 1 main IC (below): 1: Hisilicon - Power Management Chip 2: NXP-NFC control chip 3: STMicroelectronics-wireless transceiver chip 4: Halo Microletronics - Battery Management Chip 5: Goertek-Microphone 6: AKM-electronic compass Main board 2 main IC (below): 1: Hisilicon - RF transceiver 2: QAULCOMM-front end module 3: Hisilicon-power amplifier Logic, Memory, PM, RF and AUDIO chip information used on the motherboard are shown in the table: The MEMS chip information used on the whole machine is shown in the table below: Finally, look at all 5G baseband chips on the market. Kirin 990 5G, Balong 5000, Samsung Exynos 5100 and Qualcomm X50 5G baseband comparative map. Of course, this is just the corner of the iceberg. If you want to know more comprehensive chip information, you must poke into the ewistech search to learn more, more exciting information. Summarize The whole machine uses a total of 27 screws. The dustproof level is IP68. In addition to using waterproof rubber circles and waterproof films, it is also achieved by reducing the fuselage opening, and the earphone hole and volume bond are canceled. After using the screen vocalization technology, the top of the screen disappeared. There are 21 Haisi chips in the whole machine. We didn't discover Ba Long 5000, because this time is directly in Kirin 990 5G integrated 5G baseband chip Palong 5000, so there is no need to plug 5G chip. Although the proportion of relative to domestic IC chips has risen, the proportion of domestic accessories in the whole machine has only 13.4%. Therefore, to achieve a pure domestic standard, the domestic brand has a long way to go. Source: ewistech

     

     

     

     

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