Committed to providing a leading supplier of differentiated semiconductor technology programs in power consumption, safety, reliability and performance (Microsemi Corporation, NASDAQ code: MSCC) announced in Irish ENNIS Aviation Center Of Excellence. This coverage of 1,900 square feet of research and development facilities will provide support for the design, development and manufacturing of the US Gaosi New High Reliability Aviation Intelligent Power Solutions (IPS) series.
At the opening ceremony, Jim Aralis, a Vice President of the Chief Technology Officials and Senior Research and Development of Mei Gao Senmei, unveiled in the Aviation Center for Excellence Airlines. After the event, Aralis presided over the engineering technology forum organized by the technical community.
Aralis said: "Our new outstanding aviation center is the latest example of US Gao Sens in Ireland, and reflects the important contribution of Erosse facilities for a broader US Gao Si Midea global product / technology development network. We now offer Designed until the manufactured complete high reliability aviation intelligent power solution. Erosse facilities not only allow customers to get flexible, adjustable high integration solutions for aviation electric drive and power conversion applications, but also allow customers to be comprehensive The technical service provider is supported as an extension of its design team. "
The new R & D laboratory of this facility is fully equipped with modeling, simulation, analysis, and algorithm development capabilities, can accelerate product innovation. These modern measuring equipment support a wide range of product tests, and special high reliability laboratory has promoted the long-term useful life test of product qualified certification and designated applications. As the power electronics in the aviation, the ELECTRIC AIRCRAFT, MEA targets will play a critical role in supporting this goal.
Pat Wheeler, deputy director of the University of Nottingham Electrical and Electronics Engineering, Pat Wheeler, deputy director of the University of Nottingham, pointed out that power electronics are technologies for electrified aircraft. However, under the current technologies, the advantages of electrified aircraft are slightly negligible, and designers must achieve reliability, power density, and broadband semiconductors in materials and thermal management, to fully exert all the potential of electrical aircraft.
US Gao Sili develops IPS products for multiple growth applications in commercial aviation industries. MARKETS AND MARKETS, Global Market Research and Consulting Institutions, pointed out that the value of the initiator, electrical and electronic system markets reached 8 billion US dollars in 2013, and the annual complex growth rate (CAGR) was 14% and reached $ 21 billion in 2020. The composite growth rate of the electrical system and the electronic components will be expected to be 16% and 13%, respectively.
The flagship product of the United States, the United States, New Supervision Aviation Center, includes aviation core modules (PCM) with integrated FPGA and hybrid drive (HPD). PCM control is used for motor flight control drives and landing gear systems, PCMs are seamlessly connected to aircraft and flight computers, providing important sensor feedback for monitoring. MEGOM also provides custom options to ensure optimized products, but also provide a mixed power drive (HPD) solution with an integrated solenoid drive as a separate product. The manufacturing of these power systems fully utilizes the existing operational infrastructure of Mi Gao Sen, as well as high quality and high reliability techniques in the existing ENS facilities. Erosis facilities are the manufacturing centers of US Gao Sen Mei High Reliability.
DOLAN CLANCY, Vice President, USA, Vice President, said: "This investment in aviation intelligent power supply solutions makes full use of the wide technology and ability of the entire company to expand our market share in the field of focus applications, is our efforts to become Complete solution of the vendor's vision. By combining the company's leading technology and aerospace power module functionality from the world, we look forward to publication of the development of the industry in this market. "
US Gao Si Mide: Committed to the development of Ireland
In 1992, Mi Gao Senmei passed M & A amenities in the Irish Clair County, in the local operation, and in 2012, the facility was used as its European headquarters. In the past few years, Mi Gao Sili has conducted a lot of investment in ENS operations. At present, 270 employees have been in the local area, which is one of the largest employers in this region. US Gao Sen is more than 20 million US dollars in Ireland, and continues to recruit engineers and other professional technicians.
The key ability of Ezis facilities is to develop and manufacture semiconductor devices, and conduct high reliability tests to meet stringent aerospace, satellites, medical and safety standards; Erosis facilities are now one of the largest such facilities around the world. . Mi Gao Senmei also has a design group in Dublin, focusing on developing advanced system-level chip (SOC) software and solutions, especially as the ARM processor; and another in Irish Cork Design groups develop high efficiency embedded hardware and software for real-time Ethernet operation and adjustable.
Mei Gao Senmei promotes commercial avionics innovation
Mi Gao Si Mei provides industry-leading high-reliability products and solutions for flight critical avionics and power conversion applications to meet the evolved demand in the aerospace industry. Mi Gao Si Mei offers a high-powerful field programmable gate array (FPGA) and system-level chip (SOC) technology with low power consumption and SEU immunity; the most widely transient voltage suppression (TVS) solution for lightning strike protection Series; silicon carbide (SiC) MOSFET, diode and rugged power module high performance power discrete technology; integrated analog and mixed signal integrated circuit (IC) capabilities, including high temperature SiC transistor drivers and sensor interface IC, Ethernet and network technology , Wireless radio frequency (RF) diode, power transistor, MMIC, module and subsystem, high-density memory product, solid state storage (SSD) device and advanced packaging technologies such as high temperature (HT) polymer packaging technology. US Gao Senmei continues to expand the leadership of the leadership through product innovation, and fully utilize a wide range of product portfolios to develop a new intelligent power solution series, enriching its ability to develop solutions, become designed until the manufacturing Technical provider.
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