Meizu 16XS dismantling is coming. I just gave a dismantling of Realmin X last week, and today the Meizu 16XS is fresh. As the first three-time Meizu 16XS, will it bring to us?
Configure
SOC: Qualcomm Snapdragon 675 processor 丨 11nm process
Screen: 6.2 inch AMOLED screen 丨 Resolution 2232 x 1080 丨 Screen 80.29%
Storage: 6GB + 64GB
Front: 16 million pixels
Rear: 48 million pixel main photos + 5 megapixel + 8 million pixels wide angle
Battery: 4000mAh lithium polymer battery
Features: Super MTOUCH screen fingerprint 丨 extreme side full screen
Dismantlement step
First take the card slot. The temperature of the plastic rear cover should not be too high when heating is partially heated. Heat to a certain temperature, using the suction cup to suck the slit and open it around the lens. After opening, you can see the standard three-segment design.
There is a large number of heat-dissipating graphite inside the back cover, and the central bubbles are bubbled. There is a black foam glue in the lower left corner. At the same time, it can be seen that the rear camera protective cover is bonded to the back cover by double-sided adhesive. Can be disassembled.
Next, remove the box, in the middle box and the support of the mobile phone is fixed through the card slot, and the lens is used to disassemble it around the middle frame. It can be seen that the bottom of the phone top has a red jacket, the main board and the sub-plate cover each have a screw with a screw.
On the middle frame, there are two end antennas, an antenna in the inside, and the middle frame and buttons are also fixed by both plastic column in both sides and intermediate plastic columns.
The motherboard cover and the sub-plate cover are fixed by a screw, and the screw can be removed. The motherboard cover is attached to the camera, and there is a conductive cloth on the soft board. The top of the motherboard cover is bubbled in the key position.
The sub-plate cover is also spread throughout the conductive cloth and buffer cuced.
There is a waterproof tag and a QR code label on the motherboard. The motherboard shield is attached to a large area of heat dissipation copper foil. At the same time, several lenses are attached to the conductive cloth.
The BTB interface that disconnects the cable can see the two easy-pull glue of the fixed battery, which is very convenient to replace and repair.
Use force to pull the battery to remove the battery, remove the disassembly screen soft board and the main panel connection soft board. After removing the battery, you can send a black strong glue, and the battery is more difficult to remove. Be careful, do not extrud the battery with force. Two electrically conductive double-sided plasticings are posted under the screen soft board BTB interface.
Remove the motherboard, panel, fingerprint sensor and camera. The back shield of the motherboard is also attached to a large-area heat dissipation copper foil. And the copper foil is attached to the heat-conductive silicone, the large probability is the SOC position.
Subsequently dismantled the button panel, vibrator, and handset above the box. All three devices are fixed using double-sided gels, which is very easy to disassemble.
The final dismantling screen. The screen is heated at a certain temperature in the heating station, using a suction cup to absorb the gap, and slowly remove it with a plastic lead. Remove the light and distance the sensor.
There is a conductive cloth on the screen soft board. The soft panel device has a blue insulating tape.
Module information
The screen uses Samsung 6.2-inch amoled polarity full screen, the model is AMS615WX05, and the German VDE Blu-ray eye certification is obtained.
Front-fit 16 MP pixel camera, aperture / 2.2,5 slider, Samsung custom.
The rear three-in-life manufacturer is Samsung. From left to right, it takes 48MP main photos, 6-piece lens, model S5kgm1; 5MP telephoto, 4-piece lens, model S5K5E9; 8MP super wide angle, 5-piece lens The model is S5K4H7.
The battery capacity is 4000mAh, and the manufacturer is Zhuhai Jiade Electric Technology Technology.
Motherboard IC information
The main IC of the motherboard (below):
Be
Red: Samsung- KM3H6001CA- 6GB LPDDR4X DRAM + 64 GB FLASH
Blue: QUALCOMM- SDM675- Snapdragon 675 8-Core Application and Baseband Processor
Yellow: Vanchip-VC7643-FDD / TDD PA + Switches
Green: QUALCOMM- WCD9370- Audio Codec
Deep blue: Invensense- ICM-4X607- 6-Axis Gyroscope and Accelerometer
Pink: Voltafield- AF6133- Electronic COMPASS
Gray: knowles- microphone
The main IC on the back of the motherboard (below):
Deep Green: GPS Low-Noise Amplifier
Red: Qualcomm- PM6150- Power Management
Deep Blue: Foursemi- Audio Amplifier
Gray: Qualcomm- WCN3980 - Wi-Fi, Bluetooth, FM Radio
Yellow: QUALCOMM - PM6150A - Power Management
Pink: QUALCOMM- SDR660- RF Transceiver
Blue: Vanchip- VC7916- GSM / GPRS / EDGE / TDS / TDD PA + SP16T
Green: MaxScend- MXD86A0S- RF SWTICH
The logic, Memory, PM, and RF chip information used on the motherboard are shown in the table:
The MEMS chip information used on the whole machine is shown in the table below:
Summarize
The whole machine is fixed with 21 screws, and the main sub-board has a waterproof label. The front camera is relatively small. Save internal space. Both the motherboard is in front of both sides with large area heat dissipation copper foil for heat dissipation, and there is a thermally conductive silicone. The main antenna and the Bluetooth antenna are fixed on the middle frame. The whole machine uses a large number of conductive cloths and buffers. The conductive cloth is mainly distributed across several cameras and inner support. The buffer bubbles are mainly distributed over the back cover, the motherboard cover and the sub-plate cover. The three-stage design is compact. So cost analysis, the whole machine cost is about $ 188, and its main control IC cost is about $ 96.42, accounting for 51% of the cost of the whole machine.
Source: ewistech
Our other product:
